摘要:
Lower reflow temperature in dielectrics is obtained by using a composite dielectric film. The composite dielectric film includes a first layer doped in the conventional range. A borophosphosilicate glass (BPSG) thick layer having concentrations of around 4.4 wt. % boron and around 5.6 wt. % phosphorus is exemplary. The composite dielectric film includes a second layer doped excessively. A BPSG thin layer having concentrations between 1-4 wt. % phosphorus and between 7-8 wt. % boron is exemplary. A capping layer of conventional dopant concentration may be additionally added to prevent outdiffusion. A composite dielectric BPSG film can be reflowed around 700° C. as compared to the typical 800-900° C. range. After reflow, etching away the second highly doped layer removes any potential adverse effects.
摘要:
A device for ESD protection of a high frequency circuit (1) of a semiconductor device comprises first (3) and second (4) p-type and first (6) and second (5) n-type JFET's, wherein the first p-type JFET (3) is connected with its gate to a high voltage source, its source to an input/output pad (2) of the semiconductor device, and its drain to the source of the first n-type JFET (6), the second p-type JFET (4) is connected with its gate to the high voltage source, its source to the drain of the second n-type JFET (5), and its drain to an input/output terminal of the circuit (1), the first n-type JFET transistor (6) is connected with its gate to ground (GND), and its drain to the input/output terminal, and the second n-type JFET transistor (5) is connected with its gate to ground (GND), and its source to the input/output pad (2).
摘要:
A field effect transistor is made on a chip comprising a SiC-substrate. The transistor includes a plurality of densely stacked parallel transistor cells occupying totally a rectangular area. Each transistor cell has parallel strip-shaped regions forming the electrodes and active areas of the cell and each inner cell shares its drain and sources electrodes with neighbouring cells. In order to give a good power dissipation allowing an electrical high power of the transistor, the rectangular area has a very elongated shape and specifically it should have a width not larger than substantially 50 &mgr;m. In the rectangular area all the transistor cells have their strip-shaped regions located in parallel to short sides of the rectangular area and are generally very short considering the length of the rectangular area. Thus specifically also each cell has a length not larger than substantially 50 &mgr;m. The distances from the long sides of the rectangular area to the edges of the chip should be at least 50% and preferably 60% of the thickness of the chip to allow a good thermal flow out of the active rectangular area. A plurality of such very elongated active areas can be located on a single chip.
摘要:
To protect a high-frequency integrated circuit (1) against higher voltages than normal operating voltages on an input/output terminal connected to a bonding pad (2), a semiconductor varistor (3) having low and essentially constant resistance for said normal operating voltages and higher resistance for said higher voltages is integrated between the bonding pad (2) and the input/output terminal together with the integrated circuit (1).
摘要:
An RF front-end receiver comprises a low noise amplifier and a local oscillator driver, which are connected to respective input ports of a mixer which comprises a first and second transistor with gates coupled to one output terminal, a third and fourth transistor with gates coupled to the other output terminal, a fifth and sixth transistor with gates coupled to respective output terminal of the local oscillator driver, the sources of the first and third transistors coupled to the drain of the fifth transistor, the sources of the second and fourth transistor coupled to the drain of the sixth transistor, the sources of the fifth and sixth transistor coupled to ground, the drains of the first and fourth transistor coupled to one output terminal of a mixer output port, and the drains of the second and third transistor coupled to the other output terminal of the mixer output port.
摘要:
A method in the fabrication of an integrated high frequency circuit including a DMOS transistor device comprises the steps of providing a substrate, etching a trench in a region defined for an extended drain for the DMOS transistor, and doping a region below the trench and a region at a side of the trench to a first doping type by means of ion implantation in the etched open trench through a mask, wherein the ion implantation is effectuated in a direction, which is inclined at an angle to the normal of the surface of the substrate, to thereby create a partly lateral and partly vertical current path in the extended drain. The method comprises further the steps of filling the trench with an insulating material to form a shallow trench isolation region, and forming a gate, a channel region, a source, and a drain for the DMOS transistor.
摘要:
An electrical device having a voltage dependent capacitance is provided comprising a first region of a semiconductor material, and a second region and a third region of a semiconductor material formed in the first region, the second and third regions being separated by a separation region, and an electrically insulating layer formed on the first region at least at a region corresponding to the separation region, and a substantially conductive element formed on the insulating layer at least at a region corresponding to the separation region such that the insulating layer electrically insulates the substantially conductive element from the first, second and third regions, and a first electrode connected to the substantially conductive element, and a second electrode and third electrode are connected to the second and third regions. A method of manufacturing the device is also disclosed.
摘要:
A semiconductor device is supported by a semiconductor body which comprises a substrate, an oxide layer and a weakly doped monocrystalline wafer. Trenches for a dielectrically isolating layer which surrounds a component region are etched in the wafer. A field effect transistor in the component region has two doped wafer-line gate regions, which have been diffused in the component region with the aid of a first mask. Two heavily doped regions are diffused in the component region with the aid of a second mask, these regions forming the source region and the drain region of the transistor. The semiconductor body is easy to produce and is available commercially, which simplifies manufacture of the field effect transistor. Manufacture is also simplified because the configuration of both the component region and the parts of the transistor are determined by the simple choice of masks. The component region is weakly doped and is easy to deplete of charge carriers. The electrical field strength in the component region is weak, according to the RESURF method, and the field effect transistor withstands high voltages without risk of current breakthrough. The component region occupies only a relatively small area on the substrate.
摘要:
An RF front-end receiver comprises a low noise amplifier and a local oscillator driver, which are connected to respective input ports of a mixer which comprises a first and second transistor with gates coupled to one output terminal, a third and fourth transistor with gates coupled to the other output terminal, a fifth and sixth transistor with gates coupled to respective output terminal of the local oscillator driver, the sources of the first and third transistors coupled to the drain of the fifth transistor, the sources of the second and fourth transistor coupled to the drain of the sixth transistor, the sources of the fifth and sixth transistor coupled to ground, the drains of the first and fourth transistor coupled to one output terminal of a mixer output port, and the drains of the second and third transistor coupled to the other output terminal of the mixer output port.
摘要:
A monolithically integrated microwave amplifier device, comprises an input for receiving a microwave signal, a first power amplifier stage (11; 32) having an input coupled to receive the microwave signal, an impedance matching network (16; 39) coupled to an output of the first power amplifier stage, a second power amplifier stage (12; 33) having an input coupled to the impedance matching network, and an output for outputting the microwave signal after having been amplified by the first and second power amplifier stages, wherein the first power amplifier stage is optimized to be supplied with a first supply voltage (13; 35), which is essentially lower than a second supply voltage (14; 36), with which the second power amplifier stage is optimized to be supplied. Preferably, the second stage is an end stage based on an LDMOS transistor, and the first stage is a driver stage based on a bipolar transistor.