Method and apparatus for improved plasma processing uniformity
    1.
    发明授权
    Method and apparatus for improved plasma processing uniformity 有权
    改善等离子体处理均匀性的方法和装置

    公开(公告)号:US07164236B2

    公开(公告)日:2007-01-16

    申请号:US10793253

    申请日:2004-03-05

    IPC分类号: H05B31/26 C23F1/00

    摘要: A method and apparatus for generating and controlling a plasma (130) formed in a capacitively coupled plasma system (100) having a plasma electrode (140) and a bias electrode in the form of a workpiece support member (170), wherein the plasma electrode is unitary and has multiple regions (Ri) defined by a plurality of RF power feed lines (156) and the RF power delivered thereto. The electrode regions may also be defined as electrode segments (420) separated by insulators (426). A set of process parameters A={n, τi, Φi, Pi, S; Li} is defined; wherein n is the number of RF feed lines connected to the electrode upper surface at locations Li, τi is the on-time of the RF power for the ith RF feed line, Φi is the phase of the ith RF feed line relative to a select one of the other RF feed lines, Pi is the RF power delivered to the electrode through the ith RF feed line at location Li, and S is the sequencing of RF power to the electrode through the RF feed lines. One or more of these parameters are adjusted so that operation of the plasma system results in a workpiece (176) being processed with a desired amount or degree of process uniformity.

    摘要翻译: 一种用于产生和控制形成在电容耦合等离子体系统(100)中的等离子体(130)的方法和装置,其具有工件支撑构件(170)形式的等离子体电极(140)和偏置电极,其中等离子体电极 是单一的并且具有由多个RF馈电线(156)限定的多个区域(RF)和传递给其的RF功率。 电极区域也可以被定义为由绝缘体(426)分离的电极段(420)。 一组过程参数A = {n,τi,i,P i, 被定义; 其中n是在位置L i1处连接到电极上表面的RF馈送线的数量,τi是针对i 是相对于其他RF馈线中选择的一个RF馈线的第i个RF馈线的相位,P < SUB> i 是通过位置L i i处的第i个RF馈线传送到电极的RF功率,S是RF功率到 电极通过RF馈线。 调整这些参数中的一个或多个,使得等离子体系统的操作导致以期望的量或程度的均匀度处理工件(176)。

    Method and system for monitoring component consumption
    2.
    发明授权
    Method and system for monitoring component consumption 有权
    用于监控组件消耗的方法和系统

    公开(公告)号:US07233878B2

    公开(公告)日:2007-06-19

    申请号:US10767347

    申请日:2004-01-30

    IPC分类号: G01N21/88

    摘要: A method for monitoring consumption of a component, including the steps of emitting a radiation beam onto a first area of the component and detecting a portion of the radiation beam that is refracted by the component. A radiation level signal is generated based at least on a strength of the detected portion of the radiation beam, and a thickness of the component is determined based on the radiation level signal. The thickness of the component is compared to a predetermined thickness value, and a status signal is generated when the comparing step determines that the thickness of the component is substantially equal to or below the predetermined thickness value. When the comparing step determines that the thickness of the component is greater than the predetermined thickness value, the component is exposed to a process that can erode at least a portion of the component.

    摘要翻译: 一种用于监视部件的消耗的方法,包括以下步骤:将辐射束发射到部件的第一区域上,并检测被部件折射的辐射束的一部分。 至少基于辐射束的被检测部分的强度产生辐射水平信号,并且基于辐射水平信号确定分量的厚度。 将部件的厚度与预定的厚度值进行比较,并且当比较步骤确定部件的厚度基本上等于或低于预定厚度值时,产生状态信号。 当比较步骤确定组件的厚度大于预定厚度值时,组件暴露于可能侵蚀部件的至少一部分的过程。

    System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
    3.
    发明授权
    System and method for using first-principles simulation to facilitate a semiconductor manufacturing process 有权
    使用第一原理模拟以促进半导体制造过程的系统和方法

    公开(公告)号:US08032348B2

    公开(公告)日:2011-10-04

    申请号:US10673138

    申请日:2003-09-30

    CPC分类号: G06F17/5009 G06F2217/16

    摘要: A method, system and computer readable medium for facilitating a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is then performed using the input data and the physical model to provide a first principles simulation result, and the first principles simulation result is used to facilitate the process performed by the semiconductor processing tool.

    摘要翻译: 一种用于促进由半导体处理工具执行的处理的方法,系统和计算机可读介质。 该方法包括输入与半导体处理工具执行的处理有关的数据,并输入与半导体处理工具相关的第一原理物理模型。 然后使用输入数据和物理模型执行第一原理模拟以提供第一原理模拟结果,并且第一原理模拟结果用于促进由半导体处理工具执行的处理。

    Method and system for monitoring component consumption
    4.
    发明授权
    Method and system for monitoring component consumption 失效
    用于监控组件消耗的方法和系统

    公开(公告)号:US07353141B2

    公开(公告)日:2008-04-01

    申请号:US11736789

    申请日:2007-04-18

    IPC分类号: G01N21/88

    摘要: A method for monitoring consumption of a component, including the steps of emitting a radiation beam onto a first area of the component and detecting a portion of the radiation beam that is refracted by the component. A radiation level signal is generated based at least on a strength of the detected portion of the radiation beam, and a thickness of the component is determined based on the radiation level signal. The thickness of the component is compared to a predetermined thickness value, and a status signal is generated when the comparing step determines that the thickness of the component is substantially equal to or below the predetermined thickness value. When the comparing step determines that the thickness of the component is greater than the predetermined thickness value, the component is exposed to a process that can erode at least a portion of the component.

    摘要翻译: 一种用于监视部件的消耗的方法,包括以下步骤:将辐射束发射到部件的第一区域上,并检测被部件折射的辐射束的一部分。 至少基于辐射束的被检测部分的强度产生辐射水平信号,并且基于辐射水平信号确定分量的厚度。 将部件的厚度与预定的厚度值进行比较,并且当比较步骤确定部件的厚度基本上等于或低于预定厚度值时,产生状态信号。 当比较步骤确定组件的厚度大于预定厚度值时,组件暴露于可能侵蚀部件的至少一部分的过程。

    System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
    5.
    发明授权
    System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process 有权
    用于使用第一原理模拟的系统和方法来提供便于半导体制造过程的虚拟传感器

    公开(公告)号:US08050900B2

    公开(公告)日:2011-11-01

    申请号:US10673583

    申请日:2003-09-30

    摘要: A method, system, and computer readable medium for facilitating a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool, and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is performed using the input data and the physical model to provide a virtual sensor measurement relating to the process performed by the semiconductor processing tool, and the virtual sensor measurement is used to facilitate the process performed by the semiconductor processing tool.

    摘要翻译: 一种用于促进由半导体处理工具执行的处理的方法,系统和计算机可读介质。 该方法包括输入与半导体处理工具执行的处理相关的数据,以及输入与半导体处理工具相关的第一原理物理模型。 使用输入数据和物理模型执行第一原理模拟,以提供与由半导体处理工具执行的处理相关的虚拟传感器测量,并且虚拟传感器测量用于促进由半导体处理工具执行的处理。

    System and method for using first-principles simulation to characterize a semiconductor manufacturing process
    6.
    发明授权
    System and method for using first-principles simulation to characterize a semiconductor manufacturing process 有权
    使用第一原理模拟来表征半导体制造工艺的系统和方法

    公开(公告)号:US08014991B2

    公开(公告)日:2011-09-06

    申请号:US10673501

    申请日:2003-09-30

    摘要: A method, system and computer readable medium for facilitating a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool, and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is then performed using the input data and the physical model to provide a simulation result for the process performed by the semiconductor processing tool, and the simulation result is used as part of a data set that characterizes the process performed by the semiconductor processing tool.

    摘要翻译: 一种用于促进由半导体处理工具执行的处理的方法,系统和计算机可读介质。 该方法包括输入与半导体处理工具执行的处理相关的数据,以及输入与半导体处理工具相关的第一原理物理模型。 然后使用输入数据和物理模型执行第一原理模拟,以提供由半导体处理工具执行的处理的仿真结果,并且将模拟结果用作表征由半导体处理执行的处理的数据集的一部分 工具。

    Method and structure to segment RF coupling to silicon electrode
    7.
    发明授权
    Method and structure to segment RF coupling to silicon electrode 有权
    RF耦合到硅电极的方法和结构

    公开(公告)号:US06806653B2

    公开(公告)日:2004-10-19

    申请号:US10355203

    申请日:2003-01-31

    IPC分类号: H01J724

    CPC分类号: H01J37/32174 H01J37/32082

    摘要: An electrode assembly for use in a plasma processing system including a base electrode adapted to be coupled to a source of RF energy, a removable electrode removably coupled to the base electrode, and a material interposed between a surface of the base electrode and a surface of the removable electrode.

    摘要翻译: 一种用于等离子体处理系统的电极组件,其包括适于耦合到RF能量源的基极电极,可移除地耦合到所述基极电极的可移除电极以及插入所述基极电极的表面和 可拆卸电极。

    Dry non-plasma treatment system and method of using
    8.
    发明授权
    Dry non-plasma treatment system and method of using 有权
    干式非等离子体处理系统及其使用方法

    公开(公告)号:US07718032B2

    公开(公告)日:2010-05-18

    申请号:US11425883

    申请日:2006-06-22

    IPC分类号: C23F1/00

    摘要: A dry non-plasma treatment system and method for removing oxide material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry, including HF and optionally NH3, under controlled conditions including surface temperature and gas pressure. Furthermore, the treatment system is configured to provide thermal treatment of each substrate, wherein each substrate is thermally treated to remove the chemically treated surfaces on each substrate.

    摘要翻译: 描述了干燥的非等离子体处理系统和用于去除氧化物材料的方法。 处理系统被配置为提供一个或多个基底的化学处理,其中每个基底在包括表面温度和气体压力的受控条件下暴露于包括HF和任选的NH 3的气态化学物质。 此外,处理系统被配置为提供每个基板的热处理,其中每个基板被热处理以去除每个基板上的经化学处理的表面。

    Directed gas injection apparatus for semiconductor processing
    9.
    发明授权
    Directed gas injection apparatus for semiconductor processing 有权
    用于半导体加工的定向气体注入装置

    公开(公告)号:US07217336B2

    公开(公告)日:2007-05-15

    申请号:US10482210

    申请日:2002-06-20

    申请人: Eric J. Strang

    发明人: Eric J. Strang

    摘要: A method and system (1) for utilizing shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system (20) as part of a plasma process system. By utilizing the shaped orifices, directionality of gas flow (25) can be improved. This improvement is especially beneficial in high aspect ratio processing.

    摘要翻译: 一种用于在气体注入系统(20)中利用成形孔(例如,声音和简单孔和发散喷嘴)作为等离子体处理系统的一部分的方法和系统(1)。 通过利用成形孔,可以提高气流(25)的方向性。 这种改进在高纵横比处理中特别有益。

    Method and system for electron density measurement
    10.
    发明授权
    Method and system for electron density measurement 有权
    电子密度测量方法和系统

    公开(公告)号:US07177781B2

    公开(公告)日:2007-02-13

    申请号:US10521118

    申请日:2003-07-23

    IPC分类号: G06F11/30

    摘要: The present invention provides a diagnostic system for plasma processing, wherein the diagnostic system comprises a multi-modal resonator, a power source, a detector, and a controller. The controller is coupled to the power source and the detector and it is configured to provide a man-machine interface for performing several monitoring and controlling functions associated with the diagnostic system including: a Gunn diode voltage monitor, a Gunn diode current monitor, a varactor diode voltage monitor, a detector voltage monitor, a varactor voltage control, a varactor voltage sweep control, a resonance lock-on control, a graphical user control, and an electron density monitor. The diagnostic system can further provide a remote controller coupled to the controller and configured to provide a remote man-machine interface. The remote man-machine interface. The remote man-machine interface can provide a graphical user interface in order to permit remote control of the diagnostic system by an operator. In addition, the present invention provides several methods of controlling the diagnostic system in order to perform both monitor and control functions.

    摘要翻译: 本发明提供了一种用于等离子体处理的诊断系统,其中诊断系统包括多模谐振器,电源,检测器和控制器。 控制器耦合到电源和检测器,并且其被配置为提供用于执行与诊断系统相关联的多个监视和控制功能的人机接口,包括:耿氏二极管电压监视器,耿氏二极管电流监视器,变容二极管 二极管电压监视器,检测器电压监视器,变容二极管电压控制,变容二极管电压扫描控制,共振锁定控制,图形用户控制和电子密度监视器。 诊断系统还可以提供耦合到控制器并被配置为提供远程人机界面的遥控器。 远程人机界面。 远程人机界面可以提供图形用户界面,以便允许操作者对诊断系统进行远程控制。 此外,本发明提供了几种控制诊断系统以便执行监视和控制功能的方法。