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公开(公告)号：US5278535A
公开(公告)日：1994-01-11
申请号：US928034
申请日：1992-08-11
申请人： Antai Xu , Roger C. Stephenson
发明人： Antai Xu , Roger C. Stephenson
CPC分类号： H01C7/12 , H01C7/112 , H01R13/6666 , H01R4/48 , H05K1/0254 , H05K1/189 , H05K3/326 , Y10S428/901 , Y10T428/12799 , Y10T428/24917
摘要： A thin flexible laminate for overlay application on the pins of a connector or other circuit element, having an electrically insulating substrate, a conductive lamina of apertured pin receiving pads and a separate ground strip adjacent the pads, and an electrically insulating cover lamina, the substrate and cover having apertures aligned with the pad apertures, the cover having second apertures exposing adjacent edges of said pads and ground strip, with an electrical overstress pulse responsive composite material positioned in the second apertures and bridging the pads and the ground strip.
摘要翻译： 用于覆盖应用于连接器或其它电路元件的引脚上的薄柔性层压板，其具有电绝缘基板，有孔销接收垫的导电层和邻近焊盘的单独的接地片，以及电绝缘覆盖层 以及盖，其具有与所述焊盘孔对准的孔，所述盖具有暴露所述焊盘和接地条的相邻边缘的第二孔，其中电应力复合材料定位在所述第二孔中并桥接所述焊盘和所述接地条。
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公开(公告)号：US07997684B2
公开(公告)日：2011-08-16
申请号：US12271707
申请日：2008-11-14
申请人： Kevin von Essen , Antai Xu , Andreas Bibl , John A. Higginson
发明人： Kevin von Essen , Antai Xu , Andreas Bibl , John A. Higginson
CPC分类号： B41J2/14072 , B41J2002/14491 , H05K1/118 , H05K1/189 , H05K2201/053 , H05K2201/10689
摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.
摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。
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公开(公告)号：US07631962B2
公开(公告)日：2009-12-15
申请号：US11305824
申请日：2005-12-16
申请人： Andreas Bibl , John A. Higginson , Kevin Von Essen , Antai Xu
发明人： Andreas Bibl , John A. Higginson , Kevin Von Essen , Antai Xu
CPC分类号： B41J2/145 , B41J2/14233 , B41J2/16 , B41J2/161 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1646 , B41J2/17553 , B41J2002/14362 , B41J2002/1437 , B41J2002/14403 , B41J2002/14419 , B41J2002/14491 , B41J2202/20
摘要： A printhead assembly including one or more nozzles is described that can include a droplet ejection module. In one embodiment, the droplet ejection module includes a liquid supply assembly, a housing and a droplet ejection body. The liquid supply assembly includes a self-contained liquid reservoir and a liquid outlet. The housing is configured to permanently connect to the liquid supply assembly and includes a liquid channel configured to receive a liquid from the liquid outlet of the liquid supply assembly and to deliver the liquid to a droplet ejection body. The droplet ejection body is permanently connected to the housing and includes one or more liquid inlets configured to receive liquid from the housing and one or more nozzles configured to selectively eject droplets.
摘要翻译： 描述了包括一个或多个喷嘴的打印头组件，其可以包括液滴喷射模块。 在一个实施例中，液滴喷射模块包括液体供应组件，壳体和液滴喷射体。 液体供应组件包括独立的液体储存器和液体出口。 壳体被配置为永久地连接到液体供应组件并且包括液体通道，该液体通道构造成从液体供应组件的液体出口接收液体并将液体输送到液滴喷射体。 液滴喷射体永久地连接到壳体并且包括被配置为从壳体接收液体的一个或多个液体入口和被配置为选择性地喷射液滴的一个或多个喷嘴。
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公开(公告)号：US07452057B2
公开(公告)日：2008-11-18
申请号：US11119308
申请日：2005-04-28
申请人： Kevin Von Essen , Antai Xu , Andreas Bibl , John A. Higginson
发明人： Kevin Von Essen , Antai Xu , Andreas Bibl , John A. Higginson
CPC分类号： B41J2/14072 , B41J2002/14491 , H05K1/118 , H05K1/189 , H05K2201/053 , H05K2201/10689
摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.
摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。
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公开(公告)号：US20060158489A1
公开(公告)日：2006-07-20
申请号：US11305824
申请日：2005-12-16
申请人： Andreas Bibl , John Higginson , Kevin Essen , Antai Xu
发明人： Andreas Bibl , John Higginson , Kevin Essen , Antai Xu
IPC分类号： B41J2/175
CPC分类号： B41J2/145 , B41J2/14233 , B41J2/16 , B41J2/161 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1646 , B41J2/17553 , B41J2002/14362 , B41J2002/1437 , B41J2002/14403 , B41J2002/14419 , B41J2002/14491 , B41J2202/20
摘要： A printhead assembly including one or more nozzles is described that can include a droplet ejection module. In one embodiment, the droplet ejection module includes a liquid supply assembly, a housing and a droplet ejection body. The liquid supply assembly includes a self-contained liquid reservoir and a liquid outlet. The housing is configured to permanently connect to the liquid supply assembly and includes a liquid channel configured to receive a liquid from the liquid outlet of the liquid supply assembly and to deliver the liquid to a droplet ejection body. The droplet ejection body is permanently connected to the housing and includes one or more liquid inlets configured to receive liquid from the housing and one or more nozzles configured to selectively eject droplets.
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公开(公告)号：US20090066758A1
公开(公告)日：2009-03-12
申请号：US12271707
申请日：2008-11-14
申请人： Kevin Von Essen , Antai Xu , Andreas Bibl , John A. Higginson
发明人： Kevin Von Essen , Antai Xu , Andreas Bibl , John A. Higginson
IPC分类号： B41J2/14
CPC分类号： B41J2/14072 , B41J2002/14491 , H05K1/118 , H05K1/189 , H05K2201/053 , H05K2201/10689
摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.
摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。
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公开(公告)号：US06680436B2
公开(公告)日：2004-01-20
申请号：US09821549
申请日：2001-03-29
IPC分类号： H01L2328
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/351 , H05K3/284 , H05K3/3436 , H05K2201/0209 , H05K2201/10977 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.
摘要翻译： 回流密封剂与基板和电子设备一起使用。 密封剂构造成当组件被加热时固化，以便回流连接衬底和电子器件的焊料凸块。 密封剂包括8重量％至20重量％的无机填料。 所提供的填料量足够高以降低密封剂的CTE，从而提高固化材料性能并防止不适当的膨胀和焊点损坏，但足够低以使焊点在回流期间不受填料颗粒的影响。
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公开(公告)号：US20050243130A1
公开(公告)日：2005-11-03
申请号：US11119308
申请日：2005-04-28
申请人： Kevin Essen , Antai Xu , Andreas Bibl , John Higginson
发明人： Kevin Essen , Antai Xu , Andreas Bibl , John Higginson
CPC分类号： B41J2/14072 , B41J2002/14491 , H05K1/118 , H05K1/189 , H05K2201/053 , H05K2201/10689
摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.
摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。
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公开(公告)号：US5340641A
公开(公告)日：1994-08-23
申请号：US11859
申请日：1993-02-01
申请人： Antai Xu
发明人： Antai Xu
CPC分类号： H01C7/105 , H01T4/08 , H05K1/0257 , H05K1/167 , H05K2201/0738 , Y10S428/901 , Y10T428/24917
摘要： An electrical overstress responsive composite is formed on an electrically insulative substrate, has a pair of electrodes associated with the substrate and defining a gap between the electrodes and over the interposed portion of the substrate, a pattern of closely spaced electrically conductive elements span said gap and are affixed to said substrate, and a dielectric resin overlies said conductive elements and also spans said gap. The dielectric resin may include conductive and/or semiconductive fine particles. The composite presents a high resistance to a low voltage applied across said electrodes and a low resistance to a high voltage applied across said electrodes.
摘要翻译： 电绝缘响应复合材料形成在电绝缘衬底上，具有与衬底相关联的一对电极，并且在电极之间和衬底的插入部分之间限定间隔，间隔开的导电元件的图案跨越所述间隙，并且 固定在所述基板上，并且电介质树脂覆盖所述导电元件并且还跨越所述间隙。 电介质树脂可以包括导电和/或半导体细颗粒。 复合材料对施加在所述电极上的低电压具有高电阻，并且对跨所述电极施加的高电压具有低电阻。
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