Electron confinement inside magent of ion implanter
    1.
    发明申请
    Electron confinement inside magent of ion implanter 有权
    离子注入机内部的电子限制

    公开(公告)号:US20060169911A1

    公开(公告)日:2006-08-03

    申请号:US11272193

    申请日:2005-11-10

    IPC分类号: H01J1/50

    摘要: A method and apparatus are disclosed for improving space charge neutralization adjacent a magnet of an ion implanter by confining the electrons inside a magnetic region thereof to reduce electron losses and therefore improve the transport efficiency of a low energy beam. A magnetic pole member for a magnet of an ion implanter is provided that includes an outer surface having a plurality of magnetic field concentration members that form magnetic field concentrations adjacent the magnetic pole member. Electrons that encounter this increased magnetic field are repelled back along the same magnetic field line rather than allowed to escape. An analyzer magnet and ion implanter including the magnet pole are also provided so that a method of improving low energy ion beam space charge neutralization in an ion implanter is realized.

    摘要翻译: 公开了一种用于通过将电子限制在其磁性区域内以减少电子损失并因此提高低能量束的传输效率来改进邻近离子注入机的磁体的空间电荷中和的方法和装置。 提供了一种用于离子注入机的磁体的磁极构件,其包括具有与磁极构件相邻形成磁场浓度的多个磁场浓度构件的外表面。 遇到这种增加的磁场的电子沿着相同的磁场线被击退,而不是允许逃逸。 还提供了包括磁极的分析器磁体和离子注入机,从而实现了在离子注入机中提高低能量离子束空间电荷中和的方法。

    Ion beam implant current, spot width and position tuning
    2.
    发明申请
    Ion beam implant current, spot width and position tuning 有权
    离子束注入电流,光斑宽度和位置调整

    公开(公告)号:US20060076510A1

    公开(公告)日:2006-04-13

    申请号:US10960904

    申请日:2004-10-07

    IPC分类号: H01J37/317

    摘要: An ion beam tuning method, system and program product for tuning an ion implanter system are disclosed. The invention obtains an ion beam profile of the ion beam by, for example, scanning the ion beam across a profiler that is within an implant chamber; and tunes the ion implanter system to maximize an estimated implant current based on the ion beam profile to simultaneously optimize total ion beam current and ion beam spot width, and maximize implant current. In addition, the tuning can also position the ion beam along a desired ion beam path based on the feedback of the spot beam center, which improves ion implanter system productivity and performance by reducing ion beam setup time and provides repeatable beam angle performance for each ion beam over many setups.

    摘要翻译: 公开了用于调整离子注入机系统的离子束调谐方法,系统和程序产品。 本发明通过例如扫描离子束通过植入室内的轮廓仪获得离子束的离子束轮廓; 并调整离子注入系统,以根据离子束轮廓最大化估计的注入电流,以同时优化总离子束电流和离子束斑点宽度,并最大化注入电流。 此外,调谐还可以基于点光束中心的反馈沿着期望的离子束路径定位离子束,其通过减少离子束建立时间改善离子注入系统的生产率和性能,并为每个离子提供可重复的射束角度性能 横跨许多设置。

    Ion implant ion beam parallelism and direction integrity determination and adjusting
    4.
    发明申请
    Ion implant ion beam parallelism and direction integrity determination and adjusting 审中-公开
    离子注入离子束平行度和方向完整性确定和调整

    公开(公告)号:US20060169922A1

    公开(公告)日:2006-08-03

    申请号:US11246410

    申请日:2005-10-07

    IPC分类号: H01J37/08

    摘要: A system, method and program product for controlling parallelism and/or direction integrity of an ion beam generated by an ion implanter system are disclosed. The invention utilizes multiple faraday cups to measure a profile of at least a portion of the ion beam. The results of the measurement are then processed to determine parallelism and/or direction integrity of the ion beam. The results of the parallelism and/or direction integrity determination are then used to adjust the ion implanter system operating parameters to control parallelism and the direction of the ion beam.

    摘要翻译: 公开了一种用于控制由离子注入机系统产生的离子束的并行性和/或方向完整性的系统,方法和程序产品。 本发明利用多个法拉第杯来测量离子束的至少一部分的轮廓。 然后处理测量结果以确定离子束的平行度和/或方向完整性。 然后使用平行度和/或方向完整性确定的结果来调整离子注入系统的操作参数以控制离子束的平行度和方向。

    WEAKENING FOCUSING EFFECT OF ACCELERATION-DECELERATION COLUMN OF ION IMPLANTER
    6.
    发明申请
    WEAKENING FOCUSING EFFECT OF ACCELERATION-DECELERATION COLUMN OF ION IMPLANTER 有权
    弱化加速离子注入柱的影响

    公开(公告)号:US20060108543A1

    公开(公告)日:2006-05-25

    申请号:US10993346

    申请日:2004-11-19

    IPC分类号: H01J37/317

    摘要: A method and apparatus for weakening a strong focus effect of an acceleration-deceleration column of an ion implanter during a deceleration mode are disclosed. The apparatus includes a tube lens surrounding the ion beam adjacent to a deceleration lens of the acceleration-deceleration column. The tube lens causes a defocusing of the ion beam at the entrance of the tube lens, which reduces the ion dispersion problem generated by the column. The invention also includes an accel-decel column and ion implanter incorporating the tube lens. An additional deceleration-suppression electrode may also be added subsequent to the tube lens for confining electrons within the tube lens.

    摘要翻译: 公开了一种用于在减速模式期间减弱离子注入机的加速 - 减速列的强焦点效应的方法和装置。 该装置包括围绕加速减速柱的减速透镜的离子束的管透镜。 管透镜引起离子束在管透镜入口处的散焦,这降低了柱产生的离子色散问题。 本发明还包括加速减速柱和并入管透镜的离子注入机。 还可以在管透镜之后添加附加减速抑制电极,以将电子限制在管透镜内。

    Technique for uniformity tuning in an ion implanter system
    7.
    发明申请
    Technique for uniformity tuning in an ion implanter system 有权
    离子注入机系统均匀性调整技术

    公开(公告)号:US20060266957A1

    公开(公告)日:2006-11-30

    申请号:US11135307

    申请日:2005-05-24

    IPC分类号: H01J37/302

    摘要: A technique for uniformity tuning in an ion implanter system is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for uniformity tuning in an ion implanter system. The method may comprise measuring an ion beam at a plurality of predetermined locations along a beam path. The method may also comprise calculating an ion beam profile along the beam path based at least in part on the ion beam measurements at the plurality of predetermined locations. The method may further comprise determining a desired velocity profile along the beam path based at least in part on the calculated ion beam profile such that the ion beam, when scanned according to the desired velocity profile, produces a desired ion beam profile along the beam path.

    摘要翻译: 公开了一种用于离子注入机系统中均匀性调谐的技术。 在一个特定的示例性实施例中,该技术可以被实现为用于离子注入机系统中的均匀性调谐的方法。 该方法可以包括在沿着光束路径的多个预定位置处测量离子束。 该方法还可以包括至少部分地基于多个预定位置处的离子束测量来计算沿着光束路径的离子束分布。 该方法可以进一步包括至少部分地基于所计算的离子束分布来确定沿着光束路径的期望速度分布,使得当根据期望的速度分布扫描时,离子束沿着光束路径产生期望的离子束分布 。

    Technique for tuning an ion implanter system
    8.
    发明申请
    Technique for tuning an ion implanter system 有权
    调整离子注入机系统的技术

    公开(公告)号:US20060249696A1

    公开(公告)日:2006-11-09

    申请号:US11123082

    申请日:2005-05-06

    IPC分类号: H01J37/302 H01J37/317

    摘要: A technique for tuning an ion implanter system is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for tuning an ion implanter system having multiple beam-line elements. The method may comprise establishing one or more relationships among the multiple beam-line elements. The method may also comprise adjusting the multiple beam-line elements in a coordinated manner, based at least in part on the one or more established relationships, to produce a desired beam output.

    摘要翻译: 公开了一种用于调整离子注入机系统的技术。 在一个特定的示例性实施例中,该技术可以被实现为用于调整具有多个光束线元件的离子注入系统的方法。 该方法可以包括在多个波束线元件之间建立一个或多个关系。 该方法还可以包括至少部分地基于一个或多个已建立的关系以协调的方式调整多个光束线元件以产生期望的光束输出。

    Methods and apparatus for adjusting ion implant parameters for improved process control
    9.
    发明申请
    Methods and apparatus for adjusting ion implant parameters for improved process control 审中-公开
    用于调整离子注入参数以改进过程控制的方法和设备

    公开(公告)号:US20060240651A1

    公开(公告)日:2006-10-26

    申请号:US11114593

    申请日:2005-04-26

    IPC分类号: H01L21/425

    CPC分类号: H01L22/20

    摘要: A method for processing a substrate, such as a semiconductor wafer, includes performing a measurement to determine a substrate parameter distribution to be compensated, determining an adjusted implant parameter distribution to compensate for the substrate parameter distribution, and implanting the substrate in accordance with the adjusted implant parameter distribution. The substrate parameter distribution to be compensated may result from another process step and may be uniform or non-uniform. In another embodiment, an implant parameter may be varied as a function of implant position on the substrate to achieve different substrate parameter values in different areas of the substrate.

    摘要翻译: 用于处理诸如半导体晶片的衬底的方法包括执行测量以确定要补偿的衬底参数分布,确定调整的植入参数分布以补偿衬底参数分布,以及根据所调整的衬底参数分布来植入衬底 植入参数分布。 要补偿的衬底参数分布可以由另一个工艺步骤产生,并且可以是均匀的或不均匀的。 在另一个实施例中,植入参数可以作为衬底上的植入位置的函数而变化,以在衬底的不同区域中实现不同的衬底参数值。