Uniformity control using multiple tilt axes, rotating wafer and variable scan velocity
    4.
    发明申请
    Uniformity control using multiple tilt axes, rotating wafer and variable scan velocity 有权
    使用多个倾斜轴,旋转晶片和可变扫描速度的均匀性控制

    公开(公告)号:US20050263721A1

    公开(公告)日:2005-12-01

    申请号:US11021420

    申请日:2004-12-23

    IPC分类号: G21K5/10 H01J37/08

    摘要: A system, method and program product for enhancing dose uniformity during ion implantation are disclosed. The present invention is directed to allowing the use of an at least partially untuned ion beam to obtain a uniform implant by scanning the beam in multiple rotationally-fixed orientations (scan directions) of the target at variable or non-uniform scan velocities. The non-uniform scan velocities are dictated by a scan velocity profile that is generated based on the ion beam profile and/or the scan direction. The beam can be of any size, shape or tuning. A platen holding a wafer is rotated to a new desired rotationally-fixed orientation after a scan, and a subsequent scan occurs at the same scan velocity profile or a different scan velocity profile. Also included is a method, system and program product for conducting a uniform dose ion implantation in which the target is rotated and tilted about greater than one axes relative to the ion beam.

    摘要翻译: 公开了一种用于在离子注入期间增强剂量均匀性的系统,方法和程序产品。 本发明旨在允许使用至少部分未经调制的离子束以可变或不均匀的扫描速度扫描靶的多个旋转固定取向(扫描方向)来获得均匀的注入。 不均匀的扫描速度由基于离子束分布和/或扫描方向产生的扫描速度分布决定。 光束可以是任何尺寸,形状或调谐。 在扫描之后,保持晶片的压板旋转到新的期望的旋转固定取向,并且随后的扫描以相同的扫描速度分布或不同的扫描速度分布发生。 还包括用于进行均匀剂量离子注入的方法,系统和程序产品,其中靶相对于离子束旋转并且倾斜大于大于一个轴。

    Uniformity control using multiple fixed wafer orientations and variable scan velocity
    5.
    发明申请
    Uniformity control using multiple fixed wafer orientations and variable scan velocity 有权
    使用多个固定晶片取向和可变扫描速度的均匀性控制

    公开(公告)号:US20050258379A1

    公开(公告)日:2005-11-24

    申请号:US11008764

    申请日:2004-12-08

    IPC分类号: G21K5/10 H01J37/08

    摘要: A system, method and program product for enhancing dose uniformity during ion implantation are disclosed. The present invention is directed to allowing the use of an at least partially un-tuned ion beam to obtain a uniform implant by scanning the beam in multiple rotationally-fixed orientations (scan directions) of the target at variable or non-uniform scan velocities. The non-uniform scan velocities are dictated by a scan velocity profile that is generated based on the ion beam profile and/or the scan direction. The beam can be of any size, shape or tuning. A platen holding a wafer is rotated to a new desired rotationally-fixed orientation after a scan, and a subsequent scan occurs at the same scan velocity profile or a different scan velocity profile. This technique may be used independently or in conjunction with other uniformity approaches to achieve the required level of uniformity.

    摘要翻译: 公开了一种用于在离子注入期间增强剂量均匀性的系统,方法和程序产品。 本发明旨在允许使用至少部分未调谐的离子束通过以可变或不均匀的扫描速度以目标的多个旋转固定取向(扫描方向)扫描光束来获得均匀的注入。 不均匀的扫描速度由基于离子束分布和/或扫描方向产生的扫描速度分布决定。 光束可以是任何尺寸,形状或调谐。 在扫描之后,保持晶片的压板旋转到新的期望的旋转固定取向,并且随后的扫描以相同的扫描速度分布或不同的扫描速度分布发生。 该技术可以独立地使用或与其他均匀性方法结合使用以实现所需的均匀性水平。

    Technique for improving ion implantation throughput and dose uniformity
    6.
    发明授权
    Technique for improving ion implantation throughput and dose uniformity 有权
    提高离子注入量和剂量均匀性的技术

    公开(公告)号:US07683347B2

    公开(公告)日:2010-03-23

    申请号:US11537050

    申请日:2006-09-29

    IPC分类号: H01J37/317 H01L21/265

    摘要: A technique for improving ion implantation throughput and dose uniformity is disclosed. In one exemplary embodiment, a method for improving ion implantation throughput and dose uniformity may comprise measuring an ion beam density distribution in an ion beam. The method may also comprise calculating an ion dose distribution across a predetermined region of a workpiece that results from a scan velocity profile, wherein the scan velocity profile comprises a first component and a second component that control a relative movement between the ion beam and the workpiece in a first direction and a second direction respectively, and wherein the ion dose distribution is based at least in part on the ion beam density distribution. The method may further comprise adjusting at least one of the first component and the second component of the scan velocity profile to achieve a desired ion dose distribution in the predetermined region of the workpiece.

    摘要翻译: 公开了一种改善离子注入通量和剂量均匀性的技术。 在一个示例性实施例中,用于改善离子注入生产量和剂量均匀性的方法可包括测量离子束中的离子束密度分布。 该方法还可以包括计算由扫描速度分布导致的工件的预定区域上的离子剂量分布,其中扫描速度分布包括第一组分和第二组分,其控制离子束和工件之间的相对运动 在第一方向和第二方向上,并且其中所述离子剂量分布至少部分地基于所述离子束密度分布。 该方法还可以包括调整扫描速度分布的第一分量和第二分量中的至少一个,以在工件的预定区域中实现期望的离子剂量分布。

    Plasma immersion ion implantion apparatus and method
    7.
    发明申请
    Plasma immersion ion implantion apparatus and method 审中-公开
    等离子体浸没离子注入装置及方法

    公开(公告)号:US20050205211A1

    公开(公告)日:2005-09-22

    申请号:US10805966

    申请日:2004-03-22

    IPC分类号: H01J37/32 C23F1/00

    CPC分类号: H01J37/32412

    摘要: A plasma immersion ion implant apparatus and method, and a plasma chamber, each configured to provide a uniform ion flux and to dissipate the effects of secondary electrons are disclosed. The invention includes a plasma chamber including a dielectric tophat configuration and a conductive top section that may be liquid cooled. In addition, the invention provides a radio frequency (RF) antenna configuration including an active antenna that is coupled to an RF source and a parasitic antenna that is not directly coupled to any RF source, but may be grounded. The RF antenna allows for tuning of the RF coupling.

    摘要翻译: 公开了一种等离子体浸没离子注入装置和方法以及等离子体室,每个等离子体室被配置成提供均匀的离子通量并消散二次电子的作用。 本发明包括一个等离子体室,该等离子体室包括一个电介质构造和一个可以被液体冷却的导电顶部。 此外,本发明提供了一种射频(RF)天线配置,其包括耦合到RF源的有源天线和不直接耦合到任何RF源但可以接地的寄生天线。 RF天线允许调谐RF耦合。