AEROSOL DEPOSITION COATING FOR SEMICONDUCTOR CHAMBER COMPONENTS
    6.
    发明申请
    AEROSOL DEPOSITION COATING FOR SEMICONDUCTOR CHAMBER COMPONENTS 有权
    用于半导体室组件的气溶胶沉积涂料

    公开(公告)号:US20140349073A1

    公开(公告)日:2014-11-27

    申请号:US14282824

    申请日:2014-05-20

    CPC classification number: H01J37/32807 C23C24/04 H01J37/3244 Y10T428/24413

    Abstract: A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.

    Abstract translation: 用于涂覆用于等离子体蚀刻的半导体室中的部件的方法包括提供部件并将部件装载到沉积室中。 沉积室中的压力降低到低于大气压。 通过在大约室温下将包含第一类金属氧化物纳米颗粒和第二类型的金属氧化物纳米颗粒的悬浮液的气溶胶喷涂到组分上来将组分沉积在组分上。

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