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公开(公告)号：US4549950A
公开(公告)日：1985-10-29
申请号：US670232
申请日：1984-11-13
CPC分类号： C25D21/06 , C25D21/18 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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公开(公告)号：US4568431A
公开(公告)日：1986-02-04
申请号：US748104
申请日：1985-06-24
CPC分类号： C25D21/18 , C25D21/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723 , Y10S204/13
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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公开(公告)号：US4532014A
公开(公告)日：1985-07-30
申请号：US670235
申请日：1984-11-13
CPC分类号： C25D1/04 , C25D7/0614 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.
摘要翻译： 本发明涉及一种用于对准金属或金属合金箔生产线中的多个辊的系统。 对准系统包括参考框架，其具有平行于通过生产线的箔片行进方向的纵向尺寸和可移动地安装到框架的光学对准系统。 光学对准系统包括激光束发生器，分束器和用于产生用于对准生产线中的每个箔接触辊的正交参考系的反射镜。
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公开(公告)号：US4647315A
公开(公告)日：1987-03-03
申请号：US750573
申请日：1985-07-01
申请人： Arvind Parthasarathi , Ned W. Polan
发明人： Arvind Parthasarathi , Ned W. Polan
CPC分类号： C23C22/33 , C23C22/83 , H05K3/282 , H05K2203/0307 , H05K2203/0723
摘要： The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper base alloy materials. The technique of the present invention involves immersing the copper or copper base alloy material in a dilute aqueous chromic acid-phosphoric acid solution. After emerging from the chromic acid-phosphoric acid solution, the copper or copper base alloy material is preferably rinsed with a dilute aqueous caustic solution and dried. Copper and copper base alloy materials treated in accordance with the present invention have particular utility in printed circuit applications.
摘要翻译： 本发明涉及一种提高铜和铜基合金材料的抗褪色和抗氧化性能的技术。 本发明的技术包括将铜或铜基合金材料浸入稀酸铬酸 - 磷酸水溶液中。 在从铬酸 - 磷酸溶液中出来之后，铜或铜基合金材料优选用稀的苛性碱水溶液冲洗并干燥。 根据本发明处理的铜和铜基合金材料在印刷电路应用中具有特殊的用途。
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5.发明授权Electrochemical surface preparation for improving the adhesive properties of metallic surfaces 失效用于改善金属表面的粘合性能的电化学表面处理
公开(公告)号：US4549941A
公开(公告)日：1985-10-29
申请号：US670236
申请日：1984-11-13
申请人： Arvind Parthasarathi , Ned W. Polan
发明人： Arvind Parthasarathi , Ned W. Polan
CPC分类号： C25D5/16 , C25D5/34 , C25D5/48 , H05K3/384 , H05K2201/0355 , H05K2203/0278 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723 , Y10T428/12472
摘要： The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.
摘要翻译： 本发明涉及一种用于改善用于电气和电子应用的金属箔的粘合性能的处理。 本发明的处理包括在表面上形成多个树枝状结构之前，在金属箔的至少一个表面上施加光基本均匀的金属层。 金属层使待处理的表面或表面更均匀地具有电化学活性，因此更容易接受后续的树枝状处理。 本发明的处理在提高锻铜和铜合金箔的粘合性方面具有特别的用途。 还描述了用于执行本处理的装置。
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6.发明授权Surface topography optimization through control of chloride concentration in electroformed copper foil 失效通过控制电铸铜箔中的氯化物浓度来进行表面形貌优化
公开(公告)号：US5181770A
公开(公告)日：1993-01-26
申请号：US537215
申请日：1990-06-11
申请人： Andrew J. Brock , Lifun Lin , Paul Menkin , Ned W. Polan
发明人： Andrew J. Brock , Lifun Lin , Paul Menkin , Ned W. Polan
CPC分类号： C25D1/04 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K3/241
摘要： An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.
摘要翻译： 提供了用于金属箔（例如铜）的电铸的电解质溶液。 电解液含有有效浓度的氯离子以促进形成均匀的无光泽表面光洁度。 如此形成的箔在随后的层压过程中与电介质基底形成强烈的机械结合。
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7.发明授权
公开(公告)号：US4652346A
公开(公告)日：1987-03-24
申请号：US687687
申请日：1984-12-31
申请人： Ned W. Polan
发明人： Ned W. Polan
CPC分类号： C25D7/0614 , H05K3/241 , H05K3/382
摘要： The present invention relates to a process and apparatus for forming a substantially uniform electrodeposit on a metal or metal alloy foil. The apparatus includes a frame assembly for substantially preventing bowing and/or flapping of the metal or metal alloy foil and for promoting substantially uniform electrodeposits by maintaining the gap between the foil and each treatment anode substantially constant. The process and apparatus have particular utility in the treatment of delicate copper foil for use in electronic and electrical applications.
摘要翻译： 本发明涉及一种用于在金属或金属合金箔上形成基本均匀的电沉积物的方法和装置。 该装置包括框架组件，用于基本上防止金属或金属合金箔的弯曲和/或扑动，并且通过维持箔和每个处理阳极之间的间隙基本恒定来促进基本均匀的电沉积。 该方法和装置在用于电子和电气应用的精细铜箔的处理中具有特别的用途。
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公开(公告)号：US4674566A
公开(公告)日：1987-06-23
申请号：US701726
申请日：1985-02-14
申请人： Murray A. Heine , Ned W. Polan
发明人： Murray A. Heine , Ned W. Polan
CPC分类号： C22C9/04 , Y10S165/905
摘要： The present invention relates to a heat exchanger assembly having a plurality of heat exchange fluid passageways formed from a modified copper-zinc alloy. The copper-zinc alloy contains from about 21% to about 39% zinc, from about 1% to about 5% nickel, from about 0.02% to about 1% arsenic and the balance essentially copper. In a preferred embodiment, the copper-zinc alloy consists essentially of from about 25% to about 35% zinc, from about 2.5% to about 3.5% nickel, from about 0.03% to about 0.06% arsenic and the balance essentially copper. The heat exchanger assemblies of the present invention have particular utility as motor vehicle radiators.
摘要翻译： 本发明涉及具有由改性铜 - 锌合金形成的多个热交换流体通道的热交换器组件。 铜 - 锌合金含有约21％至约39％的锌，约1％至约5％的镍，约0.02％至约1％的砷，余量基本上为铜。 在优选实施方案中，铜 - 锌合金基本上由约25％至约35％的锌，约2.5％至约3.5％的镍，约0.03％至约0.06％的砷和余量基本上由铜组成。 本发明的热交换器组件具有作为机动车辆散热器的特殊用途。
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公开(公告)号：US4515671A
公开(公告)日：1985-05-07
申请号：US575240
申请日：1984-01-30
申请人： Ned W. Polan , Chung-Yao Chao
发明人： Ned W. Polan , Chung-Yao Chao
CPC分类号： H05K3/384 , B32B38/00 , C25D5/16 , C25D5/18 , B32B2309/02 , B32B2310/021 , B32B2311/12 , B32B2457/08 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S204/09
摘要： A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.
摘要翻译： 一种用于处理金属箔以提高其与衬底结合的能力的方法和装置包括将金属箔浸入具有含铜电解液溶液的电解槽中，并施加具有规则循环脉冲的电流，优选仅在一个方向上流动 到细胞 电流导致铜的树突层以第一电流密度沉积在金属箔的至少一个表面上，并以第二电流密度与其键合。 该方法和设备特别适用于处理铜箔。
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公开(公告)号：US4468293A
公开(公告)日：1984-08-28
申请号：US460630
申请日：1983-01-24
申请人： Ned W. Polan , Chung-Yao Chao
发明人： Ned W. Polan , Chung-Yao Chao
CPC分类号： H05K3/384 , C25D5/16 , C25D5/18 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S204/09 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.
摘要翻译： 一种用于处理金属箔以提高其与衬底结合的能力的方法和装置包括将金属箔浸入具有含铜电解液溶液的电解槽中，并施加具有规则循环脉冲的电流，优选仅在一个方向上流动 到细胞 电流导致铜的树突层以第一电流密度沉积在金属箔的至少一个表面上，并以第二电流密度与其结合。 该方法和设备特别适用于处理铜箔。
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