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    Anodic bonding of a stack of conductive and glass layers
    3.
    发明申请
    Anodic bonding of a stack of conductive and glass layers 失效
    一层导电和玻璃层的阳极结合

    公开(公告)号：US20020069960A1

    公开(公告)日：2002-06-13

    申请号：US09739078

    申请日：2000-12-13

    申请人： Applied Materials, Inc.

    发明人： Harald S. Gross

    IPC分类号： B32B031/00

    CPC分类号： C03C27/04 ,  B32B37/00 ,  B32B2310/021 ,  B32B2311/00 ,  B32B2315/08

    摘要： We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.

    摘要翻译： 我们已经开发了一种阳极结合方法，其将阳离子引导到远离临界粘结表面的接合结构内的位置。 这防止在临界粘合表面形成包含阳离子的化合物。 阳极结合电极触点以将阳离子和其化合物浓缩在结合结构的一部分中的方式制成，其可被除去或清洁以从结构中除去化合物。 由结合结构形成的器件包含最弱的（如果有的话）含有阳离子的化合物，其弱化了结构内的结合强度。 或者，其阳离子和化合物指向不影响包括结合结构的装置的功能的接合结构的一部分。

    Solid phase bonding method
    5.
    发明授权
    Solid phase bonding method 失效
    固相键合法

    公开(公告)号：US5536354A

    公开(公告)日：1996-07-16

    申请号：US223683

    申请日：1994-04-06

    申请人： Masatake Akaike ,  Hiroshi Matsuda

    发明人： Masatake Akaike ,  Hiroshi Matsuda

    IPC分类号： B32B37/26 ,  B32B38/00 ,  H01L21/18 ,  H01L21/20 ,  B32B31/00

    CPC分类号： B32B37/26 ,  H01L21/187 ,  H01L21/2007 ,  B32B2310/021 ,  B32B2457/00

    摘要： A solid phase junction method using a simpler process for accurately bonding solid phases without operating in an ultra-high vacuum. This method for bonding at least two solid members includes a step (A) of forming at least one of i) a monomolecular film; and ii) a monomolecular built-up film on at least one of the two junction surfaces, a step (B) of adhering the members through the junction surfaces, a step (C) of applying an electric field to the junction surfaces, and, if necessary, a step (D) of heating the junction surfaces or a step (E) of irradiating the junction surfaces with laser light.

    摘要翻译： 一种使用更简单的工艺来固相固相而不在超高真空中操作的固相接合方法。 用于粘合至少两个固体成分的方法包括形成i）单分子膜中的至少一种的步骤（A） 和ii）在所述两个接合面中的至少一个上的单分子组合膜，通过所述接合表面粘合所述构件的步骤（B），向所述接合表面施加电场的步骤（C） 如果需要，加热接合面的步骤（D）或用激光照射接合面的台阶（E）。