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公开(公告)号：US4515671A
公开(公告)日：1985-05-07
申请号：US575240
申请日：1984-01-30
申请人： Ned W. Polan , Chung-Yao Chao
发明人： Ned W. Polan , Chung-Yao Chao
CPC分类号： H05K3/384 , B32B38/00 , C25D5/16 , C25D5/18 , B32B2309/02 , B32B2310/021 , B32B2311/12 , B32B2457/08 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S204/09
摘要： A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.
摘要翻译： 一种用于处理金属箔以提高其与衬底结合的能力的方法和装置包括将金属箔浸入具有含铜电解液溶液的电解槽中，并施加具有规则循环脉冲的电流，优选仅在一个方向上流动 到细胞 电流导致铜的树突层以第一电流密度沉积在金属箔的至少一个表面上，并以第二电流密度与其键合。 该方法和设备特别适用于处理铜箔。
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公开(公告)号：US4468293A
公开(公告)日：1984-08-28
申请号：US460630
申请日：1983-01-24
申请人： Ned W. Polan , Chung-Yao Chao
发明人： Ned W. Polan , Chung-Yao Chao
CPC分类号： H05K3/384 , C25D5/16 , C25D5/18 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10S204/09 , Y10T428/12472 , Y10T428/1291 , Y10T428/12993
摘要： A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.
摘要翻译： 一种用于处理金属箔以提高其与衬底结合的能力的方法和装置包括将金属箔浸入具有含铜电解液溶液的电解槽中，并施加具有规则循环脉冲的电流，优选仅在一个方向上流动 到细胞 电流导致铜的树突层以第一电流密度沉积在金属箔的至少一个表面上，并以第二电流密度与其结合。 该方法和设备特别适用于处理铜箔。
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公开(公告)号：US4952285A
公开(公告)日：1990-08-28
申请号：US456038
申请日：1989-12-22
申请人： Lifun Lin , Chung-Yao Chao , Ned W. Polan
发明人： Lifun Lin , Chung-Yao Chao , Ned W. Polan
CPC分类号： H05K3/282 , C23C22/24 , C23C22/83 , C25D5/16 , C25D5/48 , H05K3/385 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723
摘要： A method of imparting tarnish and corrosion resistance to a copper or copper alloy foil, particularly wrought foil having one surface roughened by the application of nodules or dendrites. The foil is treated with an aqueous solution of chromic acid and sulfuric acid. The foil may then be rinsed in a basic solution having a pH greater than 8 and then dried.
摘要翻译： 对铜或铜合金箔，特别是通过应用结节或树突使一个表面粗糙化的锻造箔具有防腐和耐腐蚀性的方法。 箔用铬酸和硫酸的水溶液处理。 然后将箔可以在pH大于8的碱性溶液中漂洗，然后干燥。
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4.发明授权Surface topography optimization through control of chloride concentration in electroformed copper foil 失效通过控制电铸铜箔中的氯化物浓度来进行表面形貌优化
公开(公告)号：US5181770A
公开(公告)日：1993-01-26
申请号：US537215
申请日：1990-06-11
申请人： Andrew J. Brock , Lifun Lin , Paul Menkin , Ned W. Polan
发明人： Andrew J. Brock , Lifun Lin , Paul Menkin , Ned W. Polan
CPC分类号： C25D1/04 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K3/241
摘要： An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.
摘要翻译： 提供了用于金属箔（例如铜）的电铸的电解质溶液。 电解液含有有效浓度的氯离子以促进形成均匀的无光泽表面光洁度。 如此形成的箔在随后的层压过程中与电介质基底形成强烈的机械结合。
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5.发明授权
公开(公告)号：US4652346A
公开(公告)日：1987-03-24
申请号：US687687
申请日：1984-12-31
申请人： Ned W. Polan
发明人： Ned W. Polan
CPC分类号： C25D7/0614 , H05K3/241 , H05K3/382
摘要： The present invention relates to a process and apparatus for forming a substantially uniform electrodeposit on a metal or metal alloy foil. The apparatus includes a frame assembly for substantially preventing bowing and/or flapping of the metal or metal alloy foil and for promoting substantially uniform electrodeposits by maintaining the gap between the foil and each treatment anode substantially constant. The process and apparatus have particular utility in the treatment of delicate copper foil for use in electronic and electrical applications.
摘要翻译： 本发明涉及一种用于在金属或金属合金箔上形成基本均匀的电沉积物的方法和装置。 该装置包括框架组件，用于基本上防止金属或金属合金箔的弯曲和/或扑动，并且通过维持箔和每个处理阳极之间的间隙基本恒定来促进基本均匀的电沉积。 该方法和装置在用于电子和电气应用的精细铜箔的处理中具有特别的用途。
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公开(公告)号：US4549950A
公开(公告)日：1985-10-29
申请号：US670232
申请日：1984-11-13
CPC分类号： C25D21/06 , C25D21/18 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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公开(公告)号：US4568431A
公开(公告)日：1986-02-04
申请号：US748104
申请日：1985-06-24
CPC分类号： C25D21/18 , C25D21/06 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723 , Y10S204/13
摘要： The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.
摘要翻译： 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。
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公开(公告)号：US4532014A
公开(公告)日：1985-07-30
申请号：US670235
申请日：1984-11-13
CPC分类号： C25D1/04 , C25D7/0614 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.
摘要翻译： 本发明涉及一种用于对准金属或金属合金箔生产线中的多个辊的系统。 对准系统包括参考框架，其具有平行于通过生产线的箔片行进方向的纵向尺寸和可移动地安装到框架的光学对准系统。 光学对准系统包括激光束发生器，分束器和用于产生用于对准生产线中的每个箔接触辊的正交参考系的反射镜。
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公开(公告)号：US4674566A
公开(公告)日：1987-06-23
申请号：US701726
申请日：1985-02-14
申请人： Murray A. Heine , Ned W. Polan
发明人： Murray A. Heine , Ned W. Polan
CPC分类号： C22C9/04 , Y10S165/905
摘要： The present invention relates to a heat exchanger assembly having a plurality of heat exchange fluid passageways formed from a modified copper-zinc alloy. The copper-zinc alloy contains from about 21% to about 39% zinc, from about 1% to about 5% nickel, from about 0.02% to about 1% arsenic and the balance essentially copper. In a preferred embodiment, the copper-zinc alloy consists essentially of from about 25% to about 35% zinc, from about 2.5% to about 3.5% nickel, from about 0.03% to about 0.06% arsenic and the balance essentially copper. The heat exchanger assemblies of the present invention have particular utility as motor vehicle radiators.
摘要翻译： 本发明涉及具有由改性铜 - 锌合金形成的多个热交换流体通道的热交换器组件。 铜 - 锌合金含有约21％至约39％的锌，约1％至约5％的镍，约0.02％至约1％的砷，余量基本上为铜。 在优选实施方案中，铜 - 锌合金基本上由约25％至约35％的锌，约2.5％至约3.5％的镍，约0.03％至约0.06％的砷和余量基本上由铜组成。 本发明的热交换器组件具有作为机动车辆散热器的特殊用途。
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公开(公告)号：US4961828A
公开(公告)日：1990-10-09
申请号：US333212
申请日：1989-04-05
申请人： Lifun Lin , Ned W. Polan
发明人： Lifun Lin , Ned W. Polan
CPC分类号： C25D5/16 , C25D5/10 , C25D5/34 , C25D5/48 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0392 , H05K2203/0723
摘要： A treatment for metal foil, particularly copper or copper alloy foil, to be used in electrical and electronic applications wherein the bond strength of the foil is improved. The treatment includes applying an aqueous solution of chromic acid phosphoric acid to the foil, rinsing the foil in an aqueous solution having a pH of at least 8 and thereafter forming a plurality of copper or copper oxide dendritic structures on at least one side of the foil. The foil may be further treated by applying a coating of zinc or other suitable material over the dentritic structure and an anti-tarnish treatment applied. The anti-tarnish treatment includes applying a thin coating of zinc to the smooth side of the foil followed by treating the foil with a chromic acid sulfuric acid solution to provide a layer of chromate on both surfaces. The foil is then further treated by rinsing with an aqueous solution of a pH of at least 8 and dried.
摘要翻译： 用于电子和电子应用中的金属箔，特别是铜或铜合金箔的处理，其中箔的粘结强度得到改善。 该处理包括将铬酸磷酸水溶液施加到箔上，在pH至少为8的水溶液中冲洗该箔，此后在箔的至少一侧上形成多个铜或铜氧化物树枝状结构 。 可以通过在牙本质结构上施加锌或其它合适材料的涂层并施加抗晦暗处理来进一步处理箔。 防晦暗处理包括将薄的锌涂层施加到箔的光滑侧面，然后用铬酸硫酸溶液处理箔以在两个表面上提供一层铬酸盐。 然后通过用pH至少为8的水溶液冲洗进一步处理箔并干燥。
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