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16 条记录 (耗时 0.031 秒)

    Bi-layer covering sheath
    1.
    发明授权
    Bi-layer covering sheath 有权
    双层包覆护套

    公开(公告)号：US06403889B1

    公开(公告)日：2002-06-11

    申请号：US09587088

    申请日：2000-05-31

    申请人： Ashok K. Mehan ,  Rene Jairo Revueltas ,  Bryan Williams ,  Daniel A. Chandler

    发明人： Ashok K. Mehan ,  Rene Jairo Revueltas ,  Bryan Williams ,  Daniel A. Chandler

    IPC分类号： H01B902

    CPC分类号： B32B1/08 ,  B32B5/18 ,  F16L7/00

    摘要： A bi-layer covering sheath has a foamable polymeric inner layer, and a non-foamable non-heat-shrinkable polymeric outer layer surrounding and in intimate contact with the inner layer; the outer layer having a melting point that is at least 60° above the melting point of the inner layer, and the thickness and mechanical strength of the outer layer being such that the sheath retains substantially constant outer dimensions at a temperature sufficient to cause foaming of the inner layer. These sheaths are tubes for covering, generally, elongated substrates such as tubes, rods, wires, and cables, especially tubes, and caps for covering an end of such substrates.

    摘要翻译： 双层覆盖护套具有可发泡的聚合物内层和围绕内层并与内层紧密接触的不可发泡的不可热收缩的聚合物外层; 外层具有比内层熔点高至少60°的熔点，外层的厚度和机械强度使得护套在足以引起发泡的温度下保持基本恒定的外形尺寸 内层。 这些护套是用于覆盖（通常）细长衬底的管，例如管，棒，电线和电缆，特别是管和用于覆盖这种衬底的端部的盖。

    Electrical device
    6.
    发明授权
    Electrical device 失效
    电气设备

    公开(公告)号：US5801612A

    公开(公告)日：1998-09-01

    申请号：US910865

    申请日：1997-08-13

    申请人： Daniel A. Chandler ,  Luis A. Navarro ,  Edward F. Chu

    发明人： Daniel A. Chandler ,  Luis A. Navarro ,  Edward F. Chu

    IPC分类号： H01C7/02 ,  H01C7/13 ,  H01M2/34 ,  H01M6/50 ,  H01C7/10

    CPC分类号： H01M2/348 ,  H01C7/027 ,  H01C7/13 ,  H01M2/34 ,  H01M2200/106

    摘要： A circuit protection device for protecting batteries is formed from a resistive element composed of a PTC conductive polymer composition and two electrodes. The device has a resistive element thickness of 0.025 to 0.20 mm; a crosslinking level equivalent to 1 to 20 Mrads; a surface area of at most 120 mm.sup.2 ; a resistance at 20.degree. C., R.sub.20, of at most 0.030 ohm; and a resistivity at 20.degree. C., .rho..sub.20, of at most 2.0 ohm-cm. Devices of the invention are sufficiently small to be easily inserted into an assembly comprising a battery, particularly a rechargeable battery, and the device. Such assemblies are used for powering portable electronic equipment such as cellular telephones.

    摘要翻译： 用于保护电池的电路保护装置由由PTC导电聚合物组合物和两个电极构成的电阻元件形成。 该器件的电阻元件厚度为0.025至0.20mm; 交联水平相当于1至20Mrad; 表面积至多120mm2; 在20℃，R20，最高为0.030欧姆的电阻; 并且在20℃，rho 20处的电阻率最大为2.0ohm-cm。 本发明的装置足够小以便容易地插入到包括电池，特别是可充电电池和装置的组件中。 这样的组件用于为诸如蜂窝电话的便携式电子设备供电。

    Surface Mountable PPTC Device with Integral Weld Plate
    7.
    发明申请
    Surface Mountable PPTC Device with Integral Weld Plate 有权
    具有整体焊接板的可表面安装的PPTC设备

    公开(公告)号：US20110183162A1

    公开(公告)日：2011-07-28

    申请号：US13080570

    申请日：2011-04-05

    申请人： Daniel A. Chandler ,  Matthew P. Galla

    发明人： Daniel A. Chandler ,  Matthew P. Galla

    IPC分类号： H01M10/42 ,  H01C1/01

    CPC分类号： H01C1/1406 ,  H01C1/144 ,  H01C7/02 ,  H05K3/328 ,  H05K2201/10492 ,  H05K2201/10643

    摘要： A surface mount circuit protection device includes a laminar PTC resistive element having first and second major surfaces and a thickness therebetween. A first electrode layer substantially coextensive the first surface is formed of a first metal material of a type adapted to be soldered to a printed circuit substrate. A second electrode layer formed at the second major surface includes structure forming or defining a weld plate. The metal weld plate has a thermal mass and thickness capable of withstanding resistance micro spot welding of a strap interconnect without significant resultant damage to the device. The device is preferably surface mounted to a printed circuit board assembly forming a battery protection circuit connected to a battery/cell by battery strap interconnects, wherein one of the battery strap interconnects is micro spot welded to the weld plate of the device.

    摘要翻译： 表面安装电路保护装置包括具有第一和第二主表面的层状PTC电阻元件和它们之间的厚度。 基本上共同延伸第一表面的第一电极层由适于焊接到印刷电路基板的第一金属材料形成。 形成在第二主表面处的第二电极层包括形成或限定焊接板的结构。 金属焊接板具有热质量和厚度，能够耐受带状互连的电阻微点焊，而不会对器件造成严重的损害。 该装置优选地表面安装到印刷电路板组件，其形成通过电池带互连连接到电池/电池的电池保护电路，其中电池带互连中的一个被微点焊接到装置的焊接板。

    Electrically resistive PTC devices containing conductive polymers
    9.
    发明授权
    Electrically resistive PTC devices containing conductive polymers 失效
    含导电聚合物的电阻PTC器件

    公开(公告)号：US06570483B1

    公开(公告)日：2003-05-27

    申请号：US08816471

    申请日：1997-03-13

    申请人： Daniel A. Chandler ,  Martin Matthiesen ,  Derek Leong

    发明人： Daniel A. Chandler ,  Martin Matthiesen ,  Derek Leong

    IPC分类号： H01L710

    CPC分类号： H01C7/027 ,  H01C1/14 ,  H01C1/1406

    摘要： An electrical resistive device in which an element composed of a conductive polymer is positioned in contact with the surface layer of one or more metal electrodes. The metal electrode contains a base layer which includes a first metal, an intermediate metal layer which includes a metal that is different from the first metal, and a surface layer which (i) includes a second metal, (ii) has a center line average roughness {overscore (Ra)} of at least 1.3, and (iii) has a reflection density Rd of at least 0.60. The conductive polymer composition preferably exhibits PTC behavior density requirements, which may be, for example, circuit protection devices or heaters, have improved thermal and electrical performance over devices prepared with electrodes which do not meet the center line average roughness and reflection density requirements.

    摘要翻译： 一种电阻器件，其中由导电聚合物组成的元件与一个或多个金属电极的表面层接触。 金属电极包含基层，该基层包括第一金属，包含不同于第一金属的金属的中间金属层，以及（i）包括第二金属的表面层，（ii）具有中心线平均 粗糙度（超晶格（Ra至少为1.3，（iii））的反射密度Rd至少为0.60。导电聚合物组合物优选表现出PTC行为密度要求，其可以是例如电路保护装置或加热器， 在不符合中心线平均粗糙度和反射密度要求的电极制备的器件上的热和电性能。