公开(公告)号：US07019409B2

公开(公告)日：2006-03-28

申请号：US10948066

申请日：2004-09-23

申请人： Atsushi Nakano ,  Atsushi Kato

发明人： Atsushi Nakano ,  Atsushi Kato

IPC分类号： H01L23/06 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.

摘要翻译： 提供了一种实现电路元件和其它构成部件之间增加的粘性的电路装置。 电路装置包括导电图案，覆盖除了第一开口部分之外的导电图案的覆盖树脂，以及半导体元件，电连接到通过导电浆从第一开口部分露出的导电图案。 第一开口部分的尺寸小于半导体元件的尺寸，并且导电浆料与从第一开口部分露出的覆盖树脂和导电图案两者接触。

公开(公告)号：US20050088806A1

公开(公告)日：2005-04-28

申请号：US10941181

申请日：2004-09-15

申请人： Atsushi Kato ,  Atsushi Nakano

发明人： Atsushi Kato ,  Atsushi Nakano

IPC分类号： H01L23/50 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H02B1/00

CPC分类号： H01L24/48 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.

摘要翻译： 提供一种具有用于在其中形成电路的布线部分的电路装置。 其中形成电路的电路元件和导电图案被一体地树脂成型的电路装置包括：电信号通过的导电图案，电信号在电路和电路之间输入/输出 外; 以及从导电图案分支并且电信号通过的布线部分，电信号被输入到电路的另一部分。 根据本发明的电路装置，可以通过在装置内形成的布线将输入/输出的内置电路与外部的电信号输入到电路的另一个点。 因此，可以简化安装板的图案结构。

公开(公告)号：US20050087857A1

公开(公告)日：2005-04-28

申请号：US10948066

申请日：2004-09-23

申请人： Atsushi Nakano ,  Atsushi Kato

发明人： Atsushi Nakano ,  Atsushi Kato

IPC分类号： H05K3/28 ,  H01L21/52 ,  H01L21/56 ,  H01L21/58 ,  H01L23/12 ,  H01L23/498 ,  H05K1/18 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.

摘要翻译： 提供了一种实现电路元件和其它构成部件之间增加的粘性的电路装置。 电路装置包括导电图案，覆盖除了第一开口部分之外的导电图案的覆盖树脂，以及半导体元件，电连接到通过导电浆从第一开口部分露出的导电图案。 第一开口部分的尺寸小于半导体元件的尺寸，并且导电浆料与从第一开口部分露出的覆盖树脂和导电图案两者接触。

公开(公告)号：US07563988B2

公开(公告)日：2009-07-21

申请号：US10941181

申请日：2004-09-15

申请人： Atsushi Kato ,  Atsushi Nakano

发明人： Atsushi Kato ,  Atsushi Nakano

IPC分类号： H01R12/04

CPC分类号： H01L24/48 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.

摘要翻译： 提供一种具有用于在其中形成电路的布线部分的电路装置。 其中形成电路的电路元件和导电图案被一体地树脂成型的电路装置包括：电信号通过的导电图案，电信号在电路和电路之间输入/输出 外; 以及从导电图案分支并且电信号通过的布线部分，电信号被输入到电路的另一部分。 根据本发明的电路装置，可以通过在装置内形成的布线将输入/输出的内置电路与外部的电信号输入到电路的另一个点。 因此，可以简化安装板的图案结构。

公开(公告)号：US20050092508A1

公开(公告)日：2005-05-05

申请号：US10947652

申请日：2004-09-22

申请人： Atsushi Kato ,  Atsushi Nakano

发明人： Atsushi Kato ,  Atsushi Nakano

IPC分类号： H05K1/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/48 ,  H01L23/495 ,  H01L23/66 ,  H05K1/00 ,  H05K1/18 ,  H05K5/06

CPC分类号： H01L23/66 ,  H01L23/49517 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6622 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： Provided is a circuit device having a structure for suppressing a leakage current between patterns. A circuit device of the embodiments has a constitution in which a circuit element and desired conductive patterns are integrally resin-molded. Furthermore, the circuit device includes: a first conductive pattern connected to a high impedance input terminal of the circuit element; a second conductive pattern provided close to the first conductive pattern; and a guard conductive pattern extended between the first and second conductive patterns. Accordingly, the circuit device is constituted to prevent a leakage current between the first and second conductive patterns.

摘要翻译： 提供了具有抑制图案之间的漏电流的结构的电路装置。 实施例的电路装置具有其中电路元件和期望的导电图案被一体地树脂模制的构造。 此外，电路装置包括：连接到电路元件的高阻抗输入端的第一导电图案; 设置在第一导电图案附近的第二导电图案; 以及在第一和第二导电图案之间延伸的保护导电图案。 因此，电路装置被构造成防止第一和第二导电图案之间的漏电流。

公开(公告)号：US20050067712A1

公开(公告)日：2005-03-31

申请号：US10951214

申请日：2004-09-27

申请人： Toshikazu Imaoka ,  Ryosuke Usui ,  Atsushi Nakano ,  Atsushi Kato

发明人： Toshikazu Imaoka ,  Ryosuke Usui ,  Atsushi Nakano ,  Atsushi Kato

IPC分类号： H01L23/12 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor apparatus includes a first conductive film and a second conductive film provided on respective sides of an insulating resin film. A circuit element is mounted on the second conductive film. The circuit element is electrically connected to the second conductive film. The second conductive film is provided to cover a via plug. The via plug is tapered with a progressively smaller diameter toward the second conductive film and away from the first conductive film.

摘要翻译： 半导体装置包括设置在绝缘树脂膜的两侧的第一导电膜和第二导电膜。 电路元件安装在第二导电膜上。 电路元件电连接到第二导电膜。 第二导电膜被设置成覆盖通孔塞。 通孔塞逐渐变细，朝向第二导电膜逐渐变小，并远离第一导电膜。

公开(公告)号：US09584780B2

公开(公告)日：2017-02-28

申请号：US14655695

申请日：2012-12-27

申请人： Atsushi Kato

发明人： Atsushi Kato

IPC分类号： G03B35/26 ,  H04N13/04 ,  H04N9/31 ,  G03B21/20 ,  G03B33/12 ,  G03B35/16 ,  G02B26/08 ,  G02B27/10 ,  G02B27/22 ,  G02B27/26 ,  G02B27/09

CPC分类号： H04N9/3164 ,  G02B26/0883 ,  G02B27/0927 ,  G02B27/0994 ,  G02B27/1026 ,  G02B27/2264 ,  G02B27/26 ,  G03B21/2066 ,  G03B33/12 ,  G03B35/16 ,  G03B35/26 ,  H04N9/3108 ,  H04N9/3111 ,  H04N9/312 ,  H04N9/3152 ,  H04N9/3182 ,  H04N13/324 ,  H04N13/334 ,  H04N13/346 ,  H04N13/363 ,  H04N13/365

摘要： The projector comprises: at least one light source; a light separation unit separating light emitted from the light source into a first and second lights in different wavelength bands; a TIR prism through which the first and second lights pass; an optical modulating element irradiated with and modulating the first and second lights to emit the modulated first and second lights toward the TIR prism; a projection lens expanding and projecting the light which is modulated by the optical modulating element and passes the TIR prism; a rotating prism which is rotatably arranged in the light path between the light separation unit and the TIR prism and emits, from different positions in accordance with rotation, the first and second lights emitted from the light separation unit; and a control unit which, when the image signals representing a first and second images are supplied, causes the optical modulating element to perform modulation according to the image signal of the first image with regard to the area irradiated by the first light and to perform modulation according to the image signal of the second image with regard to the area irradiated by the second light.

摘要翻译： 该投影仪包括：至少一个光源; 光分离单元，将从所述光源发射的光分离成不同波长带的第一和第二光; 第一和第二个光通过的TIR棱镜; 照射并调制第一和第二光的光调制元件，以朝向TIR棱镜发射调制的第一和第二光; 投影透镜，使由光调制元件调制的光通过TIR棱镜， 可旋转地布置在光分离单元和TIR棱镜之间的光路中的旋转棱镜，并且从光分离单元发射的第一和第二光从旋转的不同位置发射; 以及控制单元，当提供表示第一和第二图像的图像信号时，光调制元件根据第一图像的图像信号相对于由第一光照射的面积进行调制，并且执行调制 根据第二图像的图像信号相对于由第二光照射的面积。

公开(公告)号：US09377746B2

公开(公告)日：2016-06-28

申请号：US13851332

申请日：2013-03-27

申请人： Shuichi Kato ,  Seiichi Senda ,  Atsushi Kato ,  Masanari Yoshikawa

发明人： Shuichi Kato ,  Seiichi Senda ,  Atsushi Kato ,  Masanari Yoshikawa

IPC分类号： G03G21/16

CPC分类号： G03G21/1619 ,  G03G21/1623 ,  G03G2221/1684 ,  G03G2221/1869

摘要： An image forming apparatus comprises: a casing including a side wall having an opening; a drawer member configured to support a plurality of cartridges in such a manner as to allow the cartridges to be detachably attached thereto, and to be movable through the opening from an inside position in which the drawer member is located inside the casing to an outside position in which the drawer member is located outside the casing in a moving direction; and a leg portion configured to support the casing. In this image forming apparatus, the leg portion includes a portion located downstream from the opening in the moving direction of the drawer member.

摘要翻译： 图像形成装置包括：壳体，其包括具有开口的侧壁; 抽屉构件，其构造成以允许所述盒可拆卸地附接到其上的方式支撑多个盒，并且能够通过所述开口从所述抽屉构件位于所述壳体内部的内部位置移动到外部位置 其中所述抽屉构件沿着移动方向位于所述壳体外部; 以及腿部，其构造成支撑所述壳体。 在该图像形成装置中，腿部包括沿着抽屉构件的移动方向位于开口下游的部分。

公开(公告)号：US09280126B2

公开(公告)日：2016-03-08

申请号：US13851332

申请日：2013-03-27

申请人： Shuichi Kato ,  Seiichi Senda ,  Atsushi Kato ,  Masanari Yoshikawa

发明人： Shuichi Kato ,  Seiichi Senda ,  Atsushi Kato ,  Masanari Yoshikawa

IPC分类号： G03G21/16

摘要： An image forming apparatus comprises: a casing including a side wall having an opening; a drawer member configured to support a plurality of cartridges in such a manner as to allow the cartridges to be detachably attached thereto, and to be movable through the opening from an inside position in which the drawer member is located inside the casing to an outside position in which the drawer member is located outside the casing in a moving direction; and a leg portion configured to support the casing. In this image forming apparatus, the leg portion includes a portion located downstream from the opening in the moving direction of the drawer member.

公开(公告)号：US08994314B2

公开(公告)日：2015-03-31

申请号：US13556305

申请日：2012-07-24

申请人： Atsushi Kato ,  Hiroshi Morita ,  Hiroyuki Mizuno ,  Noritaka Okada

发明人： Atsushi Kato ,  Hiroshi Morita ,  Hiroyuki Mizuno ,  Noritaka Okada

IPC分类号： G05D23/275 ,  H02P6/00 ,  B29C45/76 ,  B29C45/17

CPC分类号： H02P6/00 ,  B29C45/7666 ,  B29C2045/1792 ,  B29C2045/7673 ,  Y02P70/26 ,  Y02P70/261

摘要： An injection molding machine according to the invention includes a motor, a driver circuit that drives the motor; and a rectifying part that supplies electric power to the driver circuit. A regenerative line for regenerative electric power of the motor is connected to the rectifying part in parallel. A converting part and a harmonics component reducing part are provided in the regenerative line. The converting part converts direct electric power between the driver circuit and the rectifying part into alternating electric power which is input to the harmonics component reducing part.

摘要翻译： 根据本发明的注射成型机包括马达，驱动马达的驱动电路; 以及向驱动电路供给电力的整流部。 马达的再生电力再生线并联连接到整流部。 在再生线路中设置A转换部和谐波成分减少部。 转换部分将驱动电路和整流部分之间的直接电力转换成输入到谐波分量减少部分的交流电力。