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公开(公告)号：US06428745B2
公开(公告)日：2002-08-06
申请号：US09818905
申请日：2001-03-28
IPC分类号： C22C1302
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。
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公开(公告)号：US06267823B1
公开(公告)日：2001-07-31
申请号：US09125013
申请日：1998-11-12
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译： 公开了用于将电子部件焊接到电路板的焊料和焊膏。 该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。 或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。
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3.发明授权Solder, electronic component mounted by soldering, and electronic circuit board 失效焊接，通过焊接安装的电子部件和电子电路板
公开(公告)号：US5962133A
公开(公告)日：1999-10-05
申请号：US981565
申请日：1997-12-19
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/26 , H01L23/49582 , H05K3/3463 , H05K3/3484 , B23K35/025 , H01L2924/0002 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , H05K3/3421 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。 提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。 焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。
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公开(公告)号：US5136150A
公开(公告)日：1992-08-04
申请号：US632735
申请日：1990-12-26
CPC分类号： H04N1/02835 , H04N1/0311 , H04N1/0312 , H04N1/0314
摘要： Disclosed is an image sensor including a circuit board, an array of light emitting elements for emitting light to an image plane, an array of light receiving elements for receiving image information transmitted by reflected light from the image plane, and plural pairs of light wave guides interposed between the light emitting elements and the image plane and between the image plane and the light receiving elements. Both the light emitting elements and the light receiving elements are mounted on the same surface of the circuit board.
摘要翻译： 公开了一种图像传感器，包括电路板，用于向像平面发射光的发光元件的阵列，用于接收从图像平面反射的光透射的图像信息的光接收元件阵列，以及多对光波导 插入在发光元件和图像平面之间以及图像平面和光接收元件之间。 发光元件和光接收元件都安装在电路板的同一表面上。
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公开(公告)号：US5858481A
公开(公告)日：1999-01-12
申请号：US791132
申请日：1997-01-30
CPC分类号： H01L23/295 , H05K3/284 , H01L2924/0002 , Y10T428/1064 , Y10T428/23 , Y10T428/232 , Y10T428/239 , Y10T428/25 , Y10T428/251 , Y10T428/252 , Y10T428/257
摘要： An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.
摘要翻译： 通过分散混合在密封材料中的复合填料，用由热塑性树脂制成的密封材料密封电子电路基板，该密封材料的热膨胀系数接近陶瓷基板的热膨胀系数。 填料包括至少两种碾磨纤维，玻璃纤维和片状填料。
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6.发明授权Image reading device having a light waveguide means widened toward an end nearest to an image surface 失效具有轻微波浪形图像的图像读取装置在图像面附近趋向一端
公开(公告)号：US5198655A
公开(公告)日：1993-03-30
申请号：US642271
申请日：1991-01-15
CPC分类号： H04N1/02835 , H04N1/02855 , H04N1/02865 , H04N1/0311 , H04N1/0312 , H04N1/0314
摘要： An image reading device includes: a light emitting element for irradiating light on an image surface; a light receiving element for receiving image information in the form of reflected light from the image surface; and light waveguide passages provided between the light emitting element and the image surface and between the light receiving element and the image surface, respectively, and at least the light waveguide passage for the light emitting element is widened at an end surface thereof at the image surface to a width wider than at the end surface at the light emitting element.
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公开(公告)号：US5037233A
公开(公告)日：1991-08-06
申请号：US447356
申请日：1989-12-07
申请人： Munekazu Nishihara , Kenichiro Suetsugu , Tetsuo Fukushima , Jyunji Ikeda , Yakeshi Yoshii , Masato Tanida , Kazumi Nishimura
发明人： Munekazu Nishihara , Kenichiro Suetsugu , Tetsuo Fukushima , Jyunji Ikeda , Yakeshi Yoshii , Masato Tanida , Kazumi Nishimura
CPC分类号： F16B21/183 , B62K19/22 , F16B11/008 , F16B1/0014 , F16B11/006 , F16B7/00 , Y10T403/471 , Y10T403/60 , Y10T403/74
摘要： A bicycle frame comprising a lug and a pipe to be fitted onto a projection at the lug, annular grooves opposite to each other being disposed at the mutual contact surfaces of the lug projection and pipe, wherein an unidirectional form memory alloy changeable of its outer diameter by heating is disposed in one of the opposite annular grooves, and the projection of the lug and the pipe are bonded at the fitting surfaces by means of a thermosetting adhesive, whereby the bicycle frame is high in safety and superior in productivity and has an improved bonding strength and mechanical juncture.
摘要翻译： 一种自行车车架，包括：凸耳和配合在凸耳上的突出部上的管道;相对于彼此相对的环形槽设置在凸耳突起和管道的相互接触表面处，其中单向形式记忆合金可改变其外径 通过加热设置在一个相对的环形槽中，并且凸耳和管的突出部通过热固性粘合剂结合在配合表面，由此自行车车架的安全性高，生产率优异，并且具有改进的 接合强度和机械接合面。
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公开(公告)号：US6052893A
公开(公告)日：2000-04-25
申请号：US077670
申请日：1998-06-03
IPC分类号： B29C45/14 , B29C70/68 , B29L31/34 , C08L83/00 , C08L83/02 , C09D201/00 , H01L21/56 , H01L23/29 , H01L23/31 , H05K3/28 , A05K3/30
CPC分类号： H05K3/284 , B29C45/14639 , B29C45/14655 , B29C45/14836 , B29C70/683 , H01L21/565 , H01L23/3135 , H01L2924/0002 , Y10T29/49002 , Y10T29/49004 , Y10T29/4913 , Y10T29/49146
摘要： The present invention provides a method of manufacturing a small electronic component, by which its yield can be enhanced. The invention comprises the steps of: a component mounting step of mounting a necessary electronic component 2-4 on a substrate 1; a coating layer forming step of forming a coating layer 14 for covering and sealing the substrate 1 in its entirety including the electronic component 2-4 with a coating material having high heat resistance; and a package layer forming step of forming a package layer 17 for covering and sealing a circumference of the coating layer 14 with a thermoplastic resin material 12. In the package layer forming step, adverse effects by the heat from the thermoplastic resin 12 to the electronic components 2-4 and the substrate 1 are inhibited with the coating layer 14.
摘要翻译： PCT No.PCT / JP96 / 03578 Sec。 371日期1998年6月3日第 102（e）1998年6月3日PCT PCT 1996年12月6日PCT公布。 公开号WO97 / 20673 日期：1997年6月12日本发明提供一种小型电子部件的制造方法，能够提高其收率。 本发明包括以下步骤：将必要的电子部件2-4安装在基板1上的部件安装步骤; 涂覆层形成步骤，形成涂覆层14，用于利用具有高耐热性的涂层材料来覆盖和密封包括电子部件2-4的基板1整体; 以及封装层形成步骤，用热塑性树脂材料12形成用于覆盖和密封涂层14的周围的封装层17.在封装层形成步骤中，由热塑性树脂12的热量到电子 组件2-4和衬底1被涂层14抑制。
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9.发明授权Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method 失效用于模制与多层柔性电路集成的制品的方法和用于实施该方法的装置
公开(公告)号：US5118458A
公开(公告)日：1992-06-02
申请号：US731274
申请日：1991-07-17
CPC分类号： H05K3/4664 , B29C45/14467 , B29C45/14639 , H05K3/284 , H05K3/4069 , B29K2105/0097 , H05K1/0393 , H05K1/095 , H05K2201/09118 , H05K2203/0126 , H05K2203/0195 , H05K2203/0278 , H05K2203/068 , H05K2203/0763 , H05K2203/1327 , H05K2203/1453 , H05K3/0047 , H05K3/005 , H05K3/0088 , H05K3/1241 , H05K3/4611 , H05K3/4635
摘要： A method for molding an article integrated with a multi-layer flexible circuit by embedding the circuit in a molding material to be shaped into a certain configuration. A first flexible circuit layer is sandwiched between a fixed mold and a movable mold so as to perform an injection shaping of one side of the molding material. A plurality of flexible circuits from the second layer of flexible circuit and subsequent flexible circuits are sequentially sandwiched between the fixed mold and the movable mold and they are layered one on the other. The movable mold contains a heater. The pattern of each flexible circuit is traced with thermosetting conductive paste which is hardened by the heater of the movable mold when flexible circuits are laminated on each other. Each flexible circuit has a hot-melt type adhesive layer on the rear surface thereof. The adhesive layer is melted by the heater of the movable mold so as to place each flexible circuit layer in position when flexible circuits are laminated on each other. Through-holes are formed by punching and conductive paste is charged into the through-holes with the last layer of flexible circuit sandwiched between the fixed mold and the movable mold. Then, the injection shaping of the other side of the material is carried out.
摘要翻译： 一种通过将电路嵌入成型材料中以形成一定构造的用于模制与多层柔性电路集成的制品的方法。 第一柔性电路层被夹在固定模具和可移动模具之间，以便对成型材料的一侧进行注射成型。 来自第二柔性电路层和随后的柔性电路的多个柔性电路依次夹在固定模具和可移动模具之间，并且彼此分层。 活动模具包含加热器。 每个柔性电路的图案用热固性导电膏追踪，当柔性电路彼此层压时，热固性导电膏被可移动模具的加热器硬化。 每个柔性电路在其后表面上具有热熔型粘合剂层。 粘合剂层由可动模具的加热器熔化，以便当柔性电路彼此层压时，将每个柔性电路层放置就位。 通孔是通过冲孔形成的，并且导电膏被填充到通孔中，最后一层柔性电路夹在固定模具和可移动模具之间。 然后，进行材料的另一侧的注射成型。
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10.发明授权Optical wave guide sheet comprising plurality of doubly-clad core members with light scatterers in outer cladding 失效光波导片，其包括多个具有外包层中的光散射体的双包层核心部件
公开(公告)号：US5113470A
公开(公告)日：1992-05-12
申请号：US433209
申请日：1989-11-08
CPC分类号： G02B6/06 , G02B6/4403
摘要： An optical waveguide device includes a plurality of optical waveguides extending adjacent each other in a sheet-like form. Each of the waveguides includes core portion, an inner cladding layer formed on a periphery of the core portion, and an outer cladding layer formed on a periphery of the inner cladding layer. The inner cladding layer is devoid of light scatterers, whereas the outer cladding layer has light scatterers disposed therein. As light travels within the core portion, such light is efficiently reflected at the surface of the inner cladding layer. The outer cladding layer having the light scatterers disposed therein functions to inhibit crosstalk between adjacent waveguides.
摘要翻译： 光波导器件包括以片状形式彼此相邻地延伸的多个光波导。 每个波导包括芯部，形成在芯部的周边上的内包层和形成在内包层的周边上的外包层。 内包层没有光散射体，而外包层具有设置在其中的光散射体。 当光在芯部内行进时，这种光在内包层的表面被有效地反射。 具有设置在其中的散射体的外包层用于抑制相邻波导之间的串扰。
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