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公开(公告)号:US20100283124A1
公开(公告)日:2010-11-11
申请号:US12747923
申请日:2009-01-07
申请人: Aya Ohmae , Yuichi Mabuchi , Atsushi Nakamura
发明人: Aya Ohmae , Yuichi Mabuchi , Atsushi Nakamura
IPC分类号: H01L27/06
CPC分类号: H01L23/50 , H01L23/3128 , H01L23/49822 , H01L23/49838 , H01L23/552 , H01L23/64 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01004 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Provided is a semiconductor device in which impedances of power-supply wiring/GND wiring are matched with each other inside the semiconductor device to reduce a noise current without depending on a mounting layout of a circuit board. In a semiconductor device according to a typical embodiment of the present invention including: a package board; a semiconductor chip; a power-supply wiring; and a GND wiring, the semiconductor device includes a conductive plate, and further includes a first impedance adjusting element and a second impedance adjusting element. Parasitic capacitances of the power-supply wiring and the GND wiring are determined by the conductive plate, and the impedances of the power-supply wiring and the GND wiring are adjusted by the first impedance adjusting element and the second impedance adjusting element.
摘要翻译: 提供一种半导体器件,其中电源布线/ GND布线的阻抗在半导体器件内部彼此匹配,以降低噪声电流,而不依赖于电路板的安装布局。 在根据本发明的典型实施例的半导体器件中,包括:封装板; 半导体芯片; 电源线; 和GND布线,所述半导体器件包括导电板,并且还包括第一阻抗调节元件和第二阻抗调节元件。 电源布线和GND布线的寄生电容由导电板决定,并且电源布线和GND布线的阻抗由第一阻抗调节元件和第二阻抗调节元件调节。
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公开(公告)号:US20050029648A1
公开(公告)日:2005-02-10
申请号:US10939491
申请日:2004-09-14
申请人: Motoo Suwa , Yuichi Mabuchi , Atsushi Nakamura , Hideshi Fukumoto
发明人: Motoo Suwa , Yuichi Mabuchi , Atsushi Nakamura , Hideshi Fukumoto
IPC分类号: H01L23/12 , H01L23/48 , H01L23/498 , H01L23/50 , H01L23/52 , H01L27/04 , H01L31/0336
CPC分类号: H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45099 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser. A package substrate has, on its surface, a semiconductor chip having a plurality of output circuits and at least one electrode for supplying a voltage to each of the output circuits, and is provided with external terminals on its back surface and has a plurality of wiring layers.
摘要翻译: 半导体器件具有减少的外部电源端子数量并且在抑制功率噪声的同时进行缩小,并且电子设备有效地配备有旁路冷凝器。 封装基板在其表面上具有具有多个输出电路的半导体芯片和用于向每个输出电路提供电压的至少一个电极,并且在其背面上设置有外部端子,并且具有多个布线 层。
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公开(公告)号:US08205105B2
公开(公告)日:2012-06-19
申请号:US13023491
申请日:2011-02-08
申请人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
发明人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
CPC分类号: H05K1/0233 , H01L2224/48247 , H05K1/0231 , H05K1/165 , H05K2201/09263 , H05K2201/1003 , H05K2201/10189 , H05K2201/10689
摘要: An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.
摘要翻译: 一种电子设备,包括:布线基板,具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机,其中第一电源端子连接到第一电源配线,第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器,其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构,可以抑制由公共电流引起的不必要的电磁辐射。
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公开(公告)号:US06803659B2
公开(公告)日:2004-10-12
申请号:US10268700
申请日:2002-10-11
申请人: Motoo Suwa , Yuichi Mabuchi , Atsushi Nakamura , Hideshi Fukumoto
发明人: Motoo Suwa , Yuichi Mabuchi , Atsushi Nakamura , Hideshi Fukumoto
IPC分类号: H01L2348
CPC分类号: H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45099 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device is provided that reduces the number of external power terminals. The device is intended for a flip-chip type BGA (ball grid array) package. On the surface of the packet substrate are a plurality of output circuits each outputting a signal formed by an internal circuit, a first voltage supply electrode which supplies an operating voltage to the internal circuit and a plurality of second voltage supply electrodes which supply operating voltages to the output circuits. On the back surface of the package substrate are external terminals and a plurality of wiring layers.
摘要翻译: 提供了减少外部电源端子的数量的半导体器件。 该器件适用于倒装芯片型BGA(球栅阵列)封装。 在分组基板的表面上是多个输出电路,每个输出电路输出由内部电路形成的信号,向内部电路提供工作电压的第一电压供给电极和向第一电压供给工作电压的多个第二电压供给电极 输出电路。 在封装基板的背面是外部端子和多个布线层。
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公开(公告)号:US07900066B2
公开(公告)日:2011-03-01
申请号:US11911404
申请日:2005-04-13
申请人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
发明人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
CPC分类号: H05K1/0233 , H01L2224/48247 , H05K1/0231 , H05K1/165 , H05K2201/09263 , H05K2201/1003 , H05K2201/10189 , H05K2201/10689
摘要: An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.
摘要翻译: 一种电子设备,包括:布线基板,具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机,其中第一电源端子连接到第一电源配线,第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器,其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构,可以抑制由公共电流引起的不必要的电磁辐射。
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公开(公告)号:US07095117B2
公开(公告)日:2006-08-22
申请号:US10939491
申请日:2004-09-14
申请人: Motoo Suwa , Yuichi Mabuchi , Atsushi Nakamura , Hideshi Fukumoto
发明人: Motoo Suwa , Yuichi Mabuchi , Atsushi Nakamura , Hideshi Fukumoto
IPC分类号: H01L23/48
CPC分类号: H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45099 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser. A package substrate has, on its surface, a semiconductor chip having a plurality of output circuits and at least one electrode for supplying a voltage to each of the output circuits, and is provided with external terminals on its back surface and has a plurality of wiring layers.
摘要翻译: 半导体器件具有减少的外部电源端子数量并且在抑制功率噪声的同时进行缩小,并且电子设备有效地配备有旁路冷凝器。 封装基板在其表面上具有具有多个输出电路的半导体芯片和用于向每个输出电路提供电压的至少一个电极,并且在其背面上设置有外部端子,并且具有多个布线 层。
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公开(公告)号:US20110126030A1
公开(公告)日:2011-05-26
申请号:US13023491
申请日:2011-02-08
申请人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
发明人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
IPC分类号: G06F1/26
CPC分类号: H05K1/0233 , H01L2224/48247 , H05K1/0231 , H05K1/165 , H05K2201/09263 , H05K2201/1003 , H05K2201/10189 , H05K2201/10689
摘要: An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.
摘要翻译: 一种电子设备,包括:布线基板,具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机,其中第一电源端子连接到第一电源配线,第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器,其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构,可以抑制由公共电流引起的不必要的电磁辐射。
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公开(公告)号:US20090206951A1
公开(公告)日:2009-08-20
申请号:US11911404
申请日:2005-04-13
申请人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
发明人: Atsushi Nakamura , Toru Hayashi , Yuichi Mabuchi
IPC分类号: H03H7/00
CPC分类号: H05K1/0233 , H01L2224/48247 , H05K1/0231 , H05K1/165 , H05K2201/09263 , H05K2201/1003 , H05K2201/10189 , H05K2201/10689
摘要: An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.
摘要翻译: 一种电子设备,包括:布线基板,具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机,其中第一电源端子连接到第一电源配线,第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器,其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构,可以抑制由公共电流引起的不必要的电磁辐射。
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公开(公告)号:US06871334B2
公开(公告)日:2005-03-22
申请号:US10270498
申请日:2002-10-16
申请人: Yuichi Mabuchi , Hideshi Fukumoto
发明人: Yuichi Mabuchi , Hideshi Fukumoto
IPC分类号: G06F17/50
CPC分类号: G06F17/5036
摘要: The invention provides a method of calculating an equivalent circuit, which reduces the number of elements constituting a network to a large extent with a target accuracy secured. The method of the invention calculates an equivalent circuit by a computer, with regard to an object that has a conductor, a dielectric to support the conductor, and plural input/output terminals to the outside. Step 1 in the method receives inputs of geometry information to specify a shape of a conductor in a circuit board being the object of determining the equivalent circuit, and material information to specify a material of the circuit board; Step 2 partitions the shape of the objective conductor into meshes on the basis of the geometry information received, and creates mesh data to be expressed; Step 3 calculates a nodal admittance matrix from the mesh data, and stores the result; step 4 calculates the number of nodes and the number of independent networks on the basis of the mesh data, determines an incidence matrix, and determines the structure of an equivalent network by means of the calculated nodal admittance matrix and incidence matrix; and Step 5 determines the values of elements of the equivalent network.
摘要翻译: 本发明提供了一种计算等效电路的方法,其在确保目标精度的情况下大大减少了构成网络的元件的数量。 本发明的方法通过计算机对具有导体的物体,用于支撑导体的电介质和多个输入/输出端子连接到外部来计算等效电路。 该方法中的步骤1接收几何信息的输入,以指定作为确定等效电路的目的的电路板中的导体的形状,以及用于指定电路板的材料的材料信息; 步骤2根据接收到的几何信息将客观导体的形状划分成网格,并创建要表达的网格数据; 步骤3从网格数据计算节点导纳矩阵,并存储结果; 步骤4基于网格数据计算节点数量和独立网络数量,确定入射矩阵,并通过计算的节点导纳矩阵和入射矩阵确定等效网络的结构; 并且步骤5确定等效网络的元素的值。
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公开(公告)号:US20080236964A1
公开(公告)日:2008-10-02
申请号:US12017927
申请日:2008-01-22
申请人: Kenji Kikuchi , Yuichi Kuramochi , Yuichi Mabuchi
发明人: Kenji Kikuchi , Yuichi Kuramochi , Yuichi Mabuchi
IPC分类号: B60T13/00
CPC分类号: F16D65/18 , B60T13/741 , F16D2066/001 , F16D2066/005 , F16D2121/24 , F16D2125/38 , F16D2125/40 , H02K5/225 , H02K11/33 , H02K2211/03
摘要: An electric braking apparatus including a motor for pressing brake pads on disks, a metal housing for housing the motor, a positive-polarity power line for transmitting power from a battery to the electric motor, a negative-polarity ground line for connecting the electric motor to the ground of a vehicle, and a conductor for electrically connecting the metal housing to the negative polarity of battery or the negative-polarity of an inverter.
摘要翻译: 一种电动制动装置,包括:用于将盘上的制动块加压的马达,用于容纳马达的金属壳体,用于将电力从电池传递到电动机的正极性电力线;负极接地线, 到车辆的地面,以及用于将金属壳体电连接到电池的负极性或逆变器的负极性的导体。
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