公开(公告)号：US07900066B2

公开(公告)日：2011-03-01

申请号：US11911404

申请日：2005-04-13

申请人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

发明人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

IPC分类号： G06F1/00 ,  H05K1/03 ,  H05K9/00 ,  H04B3/28

CPC分类号： H05K1/0233 ,  H01L2224/48247 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10689

摘要： An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.

摘要翻译： 一种电子设备，包括：布线基板，具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机，其中第一电源端子连接到第一电源配线，第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器，其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构，可以抑制由公共电流引起的不必要的电磁辐射。

公开(公告)号：US20110126030A1

公开(公告)日：2011-05-26

申请号：US13023491

申请日：2011-02-08

申请人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

发明人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

IPC分类号： G06F1/26

CPC分类号： H05K1/0233 ,  H01L2224/48247 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10689

摘要： An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.

摘要翻译： 一种电子设备，包括：布线基板，具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机，其中第一电源端子连接到第一电源配线，第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器，其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构，可以抑制由公共电流引起的不必要的电磁辐射。

公开(公告)号：US20090206951A1

公开(公告)日：2009-08-20

申请号：US11911404

申请日：2005-04-13

申请人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

发明人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

IPC分类号： H03H7/00

CPC分类号： H05K1/0233 ,  H01L2224/48247 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10689

摘要： An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.

摘要翻译： 一种电子设备，包括：布线基板，具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机，其中第一电源端子连接到第一电源配线，第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器，其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构，可以抑制由公共电流引起的不必要的电磁辐射。

公开(公告)号：US08205105B2

公开(公告)日：2012-06-19

申请号：US13023491

申请日：2011-02-08

申请人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

发明人： Atsushi Nakamura ,  Toru Hayashi ,  Yuichi Mabuchi

IPC分类号： G06F1/00 ,  H05K1/03 ,  H05K9/00 ,  H04B3/28

CPC分类号： H05K1/0233 ,  H01L2224/48247 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10689

摘要： An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.

摘要翻译： 一种电子设备，包括：布线基板，具有施加有第一电源电位的第一电源布线和施加低于所述第一电源电位的第二电源电位的第二电源布线 ; 具有第一和第二电源端子的微型计算机，其中第一电源端子连接到第一电源配线，第二电源端子连接到第二电源配线; 以及连接到第一和第二电源布线的连接器，其中用于校正第一和第二布线的阻抗误差的电感器元件串联连接到第一和第二电源布线中的任一个。 根据这种结构，可以抑制由公共电流引起的不必要的电磁辐射。

公开(公告)号：US20100283124A1

公开(公告)日：2010-11-11

申请号：US12747923

申请日：2009-01-07

申请人： Aya Ohmae ,  Yuichi Mabuchi ,  Atsushi Nakamura

发明人： Aya Ohmae ,  Yuichi Mabuchi ,  Atsushi Nakamura

IPC分类号： H01L27/06

CPC分类号： H01L23/50 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/64 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a semiconductor device in which impedances of power-supply wiring/GND wiring are matched with each other inside the semiconductor device to reduce a noise current without depending on a mounting layout of a circuit board. In a semiconductor device according to a typical embodiment of the present invention including: a package board; a semiconductor chip; a power-supply wiring; and a GND wiring, the semiconductor device includes a conductive plate, and further includes a first impedance adjusting element and a second impedance adjusting element. Parasitic capacitances of the power-supply wiring and the GND wiring are determined by the conductive plate, and the impedances of the power-supply wiring and the GND wiring are adjusted by the first impedance adjusting element and the second impedance adjusting element.

摘要翻译： 提供一种半导体器件，其中电源布线/ GND布线的阻抗在半导体器件内部彼此匹配，以降低噪声电流，而不依赖于电路板的安装布局。 在根据本发明的典型实施例的半导体器件中，包括：封装板; 半导体芯片; 电源线; 和GND布线，所述半导体器件包括导电板，并且还包括第一阻抗调节元件和第二阻抗调节元件。 电源布线和GND布线的寄生电容由导电板决定，并且电源布线和GND布线的阻抗由第一阻抗调节元件和第二阻抗调节元件调节。

公开(公告)号：US20050029648A1

公开(公告)日：2005-02-10

申请号：US10939491

申请日：2004-09-14

申请人： Motoo Suwa ,  Yuichi Mabuchi ,  Atsushi Nakamura ,  Hideshi Fukumoto

发明人： Motoo Suwa ,  Yuichi Mabuchi ,  Atsushi Nakamura ,  Hideshi Fukumoto

IPC分类号： H01L23/12 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01L27/04 ,  H01L31/0336

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser. A package substrate has, on its surface, a semiconductor chip having a plurality of output circuits and at least one electrode for supplying a voltage to each of the output circuits, and is provided with external terminals on its back surface and has a plurality of wiring layers.

摘要翻译： 半导体器件具有减少的外部电源端子数量并且在抑制功率噪声的同时进行缩小，并且电子设备有效地配备有旁路冷凝器。 封装基板在其表面上具有具有多个输出电路的半导体芯片和用于向每个输出电路提供电压的至少一个电极，并且在其背面上设置有外部端子，并且具有多个布线 层。

公开(公告)号：US07095117B2

公开(公告)日：2006-08-22

申请号：US10939491

申请日：2004-09-14

申请人： Motoo Suwa ,  Yuichi Mabuchi ,  Atsushi Nakamura ,  Hideshi Fukumoto

发明人： Motoo Suwa ,  Yuichi Mabuchi ,  Atsushi Nakamura ,  Hideshi Fukumoto

IPC分类号： H01L23/48

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser. A package substrate has, on its surface, a semiconductor chip having a plurality of output circuits and at least one electrode for supplying a voltage to each of the output circuits, and is provided with external terminals on its back surface and has a plurality of wiring layers.

摘要翻译： 半导体器件具有减少的外部电源端子数量并且在抑制功率噪声的同时进行缩小，并且电子设备有效地配备有旁路冷凝器。 封装基板在其表面上具有具有多个输出电路的半导体芯片和用于向每个输出电路提供电压的至少一个电极，并且在其背面上设置有外部端子，并且具有多个布线 层。

公开(公告)号：US06803659B2

公开(公告)日：2004-10-12

申请号：US10268700

申请日：2002-10-11

申请人： Motoo Suwa ,  Yuichi Mabuchi ,  Atsushi Nakamura ,  Hideshi Fukumoto

发明人： Motoo Suwa ,  Yuichi Mabuchi ,  Atsushi Nakamura ,  Hideshi Fukumoto

IPC分类号： H01L2348

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is provided that reduces the number of external power terminals. The device is intended for a flip-chip type BGA (ball grid array) package. On the surface of the packet substrate are a plurality of output circuits each outputting a signal formed by an internal circuit, a first voltage supply electrode which supplies an operating voltage to the internal circuit and a plurality of second voltage supply electrodes which supply operating voltages to the output circuits. On the back surface of the package substrate are external terminals and a plurality of wiring layers.

摘要翻译： 提供了减少外部电源端子的数量的半导体器件。 该器件适用于倒装芯片型BGA（球栅阵列）封装。 在分组基板的表面上是多个输出电路，每个输出电路输出由内部电路形成的信号，向内部电路提供工作电压的第一电压供给电极和向第一电压供给工作电压的多个第二电压供给电极 输出电路。 在封装基板的背面是外部端子和多个布线层。

公开(公告)号：US09348226B2

公开(公告)日：2016-05-24

申请号：US10541032

申请日：2003-12-24

申请人： Isao Nishimura ,  Kouichi Fujiwara ,  Eiichi Kobayashi ,  Tsutomu Shimokawa ,  Atsushi Nakamura ,  Eiji Yoneda ,  Yong Wang

发明人： Isao Nishimura ,  Kouichi Fujiwara ,  Eiichi Kobayashi ,  Tsutomu Shimokawa ,  Atsushi Nakamura ,  Eiji Yoneda ,  Yong Wang

IPC分类号： G03F7/039 ,  G03F7/004 ,  G03F7/20

CPC分类号： G03F7/039 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/2006

摘要： A radiation-sensitive resin composition comprising an acid-labile group-containing resin obtained by living radical polymerization having a specific structure which is insoluble or scarcely soluble in alkali, but becomes alkali soluble by the action of an acid, and a photoacid generator, wherein the ratio of weight average molecular weight to number average molecular weight (weight average molecular weight/number average molecular weight) of the acid-labile group-containing resin is smaller than 1.5.

公开(公告)号：US08759419B2

公开(公告)日：2014-06-24

申请号：US13599581

申请日：2012-08-30

申请人： Satoshi Okuda ,  Junichiro Sugimoto ,  Tatsunosuke Hoshi ,  Atsushi Nakamura ,  Mitsunori Maeda

发明人： Satoshi Okuda ,  Junichiro Sugimoto ,  Tatsunosuke Hoshi ,  Atsushi Nakamura ,  Mitsunori Maeda

IPC分类号： C09D11/00 ,  C08K3/00 ,  C08F8/30

CPC分类号： C09D11/38 ,  C09D11/324

摘要： A water-based ink for ink-jet recording includes a self-dispersible pigment modified by phosphate group; water; a water-soluble organic solvent; at least one of a cationic polymer and basic amino acid; and at least one selected from the group consisting of boric acids, a chelate agent, a reducing sugar and a sugar alcohol.

摘要翻译： 用于喷墨记录的水性油墨包括由磷酸酯基改性的自分散颜料; 水; 水溶性有机溶剂; 阳离子聚合物和碱性氨基酸中的至少一种; 和选自硼酸，螯合剂，还原糖和糖醇中的至少一种。