中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.022 seconds)

    ELECTRONIC GAMING DIE
    3.
    发明申请
    ELECTRONIC GAMING DIE 审中-公开
    电子游戏机

    公开(公告)号：US20150014923A1

    公开(公告)日：2015-01-15

    申请号：US14327663

    申请日：2014-07-10

    Applicant: Board of Regents, The University of Texas System

    Inventor： Danny W. Muse ,  Ryan Wicker ,  Eric MacDonald ,  Rodolfo Salas ,  Francisco Medina

    IPC: A63F9/04

    CPC classification number: A63F9/0415 ,  A63F9/0468 ,  A63F2009/0497 ,  A63F2009/2447 ,  A63F2009/2454 ,  Y10T29/49146

    Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

    Abstract translation: 电子游戏模具包括外壳，柔性基板，多个发光二极管，传感器，处理器和电池。 外壳具有N侧，其中N等于或大于4.柔性基板折叠成N侧并且配合到外壳的内部，其中每侧具有内表面和外表面，并且被分配为从1到 发光二极管设置在柔性基板的每一侧的外表面上，其中发光二极管的数量等于分配给柔性基板一侧的整数。 传感器，处理器和电池设置在柔性基板的一个内表面上。

    Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
    5.
    发明申请
    Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices 审中-公开
    在3D结构，结构部件和结构电子，电磁和机电元件/器件中嵌入长丝的方法和系统

    公开(公告)号：US20140268604A1

    公开(公告)日：2014-09-18

    申请号：US13829723

    申请日：2013-03-14

    Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM

    Inventor： Ryan B. Wicker ,  Francisco Medina ,  Eric MacDonald ,  Danny W. Muse ,  David Espalin

    IPC: B29C70/88 ,  H05K1/02 ,  B29C70/82

    CPC classification number: B29C70/885 ,  B29C64/00 ,  B29C70/681 ,  B29C70/82 ,  B33Y10/00 ,  B33Y30/00 ,  H05K1/0284 ,  H05K3/103 ,  H05K2201/0129 ,  H05K2203/0285 ,  Y10T29/49171 ,  Y10T29/49172

    Abstract: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

    Abstract translation: 本发明提供了通过提供至少第一层衬底材料将长丝或细丝网嵌入三维结构，结构部件或结构电子，电磁或机电部件/装置中的系统和方法，并至少嵌入 丝网或丝网的一部分在基材材料的第一层内，丝或丝网的部分基本上与第一层的顶表面齐平，并且处于可流动状态的基底材料被部分 长丝并且基本上不突出在第一层的顶表面之上，允许在嵌入的长丝或细丝网上方继续进行添加剂制造工艺。 提供了一种用于在三维结构，结构部件或结构电子，电磁或机电部件/装置内使用细丝创建层间机械或电连接或连接的方法。

    Electronic gaming die
    8.
    发明授权
    Electronic gaming die 有权

    公开(公告)号：US10335673B2

    公开(公告)日：2019-07-02

    申请号：US15876084

    申请日：2018-01-19

    Applicant: Board of Regents, The University of Texas System

    Inventor： Danny W. Muse ,  Ryan Wicker ,  Eric MacDonald ,  Rodolfo Salas ,  Francisco Medina

    IPC: A63F9/24 ,  A63F9/04

    Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Patent Agency Ranking