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    Multiple high-resolution serum proteomic features for ovarian cancer detection
    3.
    发明申请
    Multiple high-resolution serum proteomic features for ovarian cancer detection 审中-公开
    用于卵巢癌检测的多种高分辨率血清蛋白质组学特征

    公开(公告)号：US20060064253A1

    公开(公告)日：2006-03-23

    申请号：US11093018

    申请日：2005-03-30

    申请人： Ben Hitt ,  Peter Levine

    发明人： Ben Hitt ,  Peter Levine

    IPC分类号： G06F19/00

    CPC分类号： G16B20/00 ,  G16B40/00

    摘要： A well-controlled serum study set (n=248) from women being followed and evaluated for the presence of ovarian cancer was used to extend serum proteomic pattern analysis to a higher resolution mass spectrometer instrument platform to explore the existence of multiple distinct highly accurate diagnostic sets of features present in the same mass spectrum. Multiple highly accurate diagnostic proteomic feature sets exist within human sera mass spectra. Using high-resolution mass spectral data, at least 56 different patterns were discovered that achieve greater than 85% sensitivity and specificity in testing and validation. Four of those feature sets exhibited 100% sensitivity and specificity in blinded validation. The sensitivity and specificity of diagnostic models generated from high-resolution mass spectral data were superior (P

    摘要翻译： 使用来自妇女的良好控制的血清研究组（n = 248）并评估卵巢癌的存在，将血清蛋白质组学模式分析扩展到更高分辨率的质谱仪仪器平台，以探索存在多种不同的高精度诊断 在同一质谱中存在的特征集合。 人血清质谱中存在多个高度准确的诊断蛋白质组特征集。 使用高分辨率质谱数据，发现了至少56种不同的模式，其在测试和验证中实现了大于85％的灵敏度和特异性。 其中四个特征集在盲法验证中表现出100％的灵敏度和特异性。 从高分辨率质谱数据生成的诊断模型的灵敏度和特异性优于使用相同输入样本的低分辨率质谱数据产生的诊断模型的灵敏度和特异性（P <0.00001）。

    Method of diagnosing biological states through the use of a centralized, adaptive model, and remote sample processing
    4.
    发明申请
    Method of diagnosing biological states through the use of a centralized, adaptive model, and remote sample processing 有权
    通过使用集中式自适应模型和远程采样处理来诊断生物状态的方法

    公开(公告)号：US20050209786A1

    公开(公告)日：2005-09-22

    申请号：US11008784

    申请日：2004-12-10

    申请人： Tzong-Hao Chen ,  Ben Hitt ,  Peter Levine

    发明人： Tzong-Hao Chen ,  Ben Hitt ,  Peter Levine

    IPC分类号： G01N33/48 ,  G01N33/50 ,  G06F19/24 ,  G06F19/28 ,  G06F19/00

    CPC分类号： G06K9/6221 ,  G06F19/24 ,  G06F19/28 ,  G06K9/6262 ,  G16H50/50 ,  Y10T436/24

    摘要： A model of a particular biological state can be developed. The model may be used to determine if an unknown biological sample exhibits a particular biological state. This can be done by receiving either a biological sample or data associated with the biological sample. After the data is received, the data may be input into the model. In one embodiment, the acquisition of the data associated with the biological sample is performed at a first location and the imputing of the data into the model is performed at a second location different than the first location. Unless the data maps identically to the model, the data would have an inherent effect on the position of the particular clusters within the discriminatory pattern, if it is allowed to affect the model. The modeling software can keep track of the net effect on the model that each sample received has on the position of the model. If the model has drifted outside of a predetermined tolerance, the model can be updated. Various business relationships may be developed to undertake various steps of the overall method for providing a diagnosis to a patient.

    摘要翻译： 可以开发出特定生物状态的模型。 该模型可用于确定未知的生物样品是否表现出特定的生物学状态。 这可以通过接收生物样品或与生物样品相关的数据来完成。 在接收到数据之后，可以将数据输入到模型中。 在一个实施例中，在第一位置处执行与生物样本相关联的数据的获取，并且在与第一位置不同的第二位置处执行将数据推算到模型中。 除非数据与模型相同，如果允许影响模型，数据将会对特定群集在歧视模式中的位置产生固有的影响。 建模软件可以跟踪每个样本收到的模型对模型的净效应。 如果模型已经偏移到预定的公差之外，则可以更新模型。 可以开发各种业务关系以承担向患者提供诊断的整体方法的各种步骤。

    Quality Assurance/Quality Control for High Throughput Bioassay Process
    5.
    发明申请
    Quality Assurance/Quality Control for High Throughput Bioassay Process 审中-公开
    高通量生物测定过程的质量保证/质量控制

    公开(公告)号：US20080103063A1

    公开(公告)日：2008-05-01

    申请号：US11968262

    申请日：2008-01-02

    申请人： Ben Hitt ,  Peter Levine ,  Emanuel Petricoin

    发明人： Ben Hitt ,  Peter Levine ,  Emanuel Petricoin

    IPC分类号： C40B50/02

    CPC分类号： G01N33/6848 ,  C40B30/04 ,  G01N33/6803 ,  G16B25/00 ,  G16B40/00 ,  Y10T436/24

    摘要： The present invention relates to a method of quality assurance/quality control for high-throughput bioassay processes. The method includes generating a bioassay process model, and then comparing spectral data based on a combination of a biochip and a test serum to the bioassay process model to determine if the test sample and the bioassay process are producing acceptable data. Alternatively, the method may include comparing spectral data based on a combination of serum and diluents used in an electrospray process to the bioassay process model. If the bioassay process and test sample fall within the model, then the spectrum produced may be further analyzed.

    摘要翻译： 本发明涉及高通量生物测定方法的质量保证/质量控制方法。 该方法包括生成生物测定过程模型，然后将基于生物芯片和测试血清的组合的光谱数据与生物测定过程模型进行比较，以确定测试样品和生物测定过程是否产生可接受的数据。 或者，该方法可以包括将基于电喷雾过程中使用的血清和稀释剂的组合的光谱数据与生物测定过程模型进行比较。 如果生物测定过程和测试样品落在模型中，则可以进一步分析产生的光谱。

    Array column integrator
    6.
    发明授权
    Array column integrator 有权
    阵列列积分器

    公开(公告)号：US08432149B2

    公开(公告)日：2013-04-30

    申请号：US13174465

    申请日：2011-06-30

    申请人： Peter Levine

    发明人： Peter Levine

    IPC分类号： G01R27/00

    CPC分类号： G01N27/4148 ,  C12Q1/6869 ,  G01J1/46 ,  G01N27/4143 ,  G01N27/4145 ,  G01N33/00 ,  G01R29/26 ,  H01L27/14609 ,  H01L27/14632 ,  H01L27/14643 ,  H01L29/66 ,  H01L2924/0002 ,  H04N5/374 ,  Y10T436/25875 ,  H01L2924/00

    摘要： The described embodiments may provide a chemical detection circuit with an improved signal-to-noise ration. The chemical detection circuit may include a current source, a chemical detection pixel, an amplifier and a capacitor. The chemical detection pixel may comprise a chemical-sensitive transistor that may have a first and second terminals and a row-select switch coupled between the current source and chemically-sensitive transistor. The amplifier may have a first input and a second input, with the first input coupled to an output of the chemically-sensitive transistor via a switch and the second input coupled to an offset voltage line. The capacitor may be coupled between an output of the amplifier and the first input of the amplifier. The capacitor and amplifier may form an integrator and may be shared by a column of chemical detection pixels.

    摘要翻译： 所描述的实施例可以提供具有改进的信噪比的化学检测电路。 化学检测电路可以包括电流源，化学检测像素，放大器和电容器。 化学检测像素可以包括可以具有第一和第二端子的化学敏感晶体管和耦合在电流源和化学敏感晶体管之间的行选择开关。 放大器可以具有第一输入和第二输入，其中第一输入经由开关耦合到化学敏感晶体管的输出，并且第二输入耦合到偏移电压线。 电容器可以耦合在放大器的输出端和放大器的第一输入端之间。 电容器和放大器可以形成积分器，并且可以被一列化学检测像素共享。

    Method and Apparatus for Reducing Smear in Back-Illuminated Imaging Sensors
    7.
    发明申请
    Method and Apparatus for Reducing Smear in Back-Illuminated Imaging Sensors 有权
    用于减少后照射成像传感器中的涂片的方法和装置

    公开(公告)号：US20080061390A1

    公开(公告)日：2008-03-13

    申请号：US11844775

    申请日：2007-08-24

    申请人： Pradyumna Kumar Swain ,  Bhaskaran Mahalingam ,  Peter Levine ,  Norman Goldsmith

    发明人： Pradyumna Kumar Swain ,  Bhaskaran Mahalingam ,  Peter Levine ,  Norman Goldsmith

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L27/14818 ,  H01L27/1464 ,  H01L27/14683

    摘要： A method for fabricating a back-illuminated semiconductor imaging device and resulting imaging device is disclosed, which includes the steps providing a substrate having a front surface and a back surface; growing an epitaxial layer substantially overlying the front surface of the substrate; forming at least one barrier layer substantially within the epitaxial layer; fabricating at least one imaging structure overlying and extending into the epitaxial layer, the imaging structure at least one charge transfer region, the at least one barrier layer substantially underlying the at least one charge transfer region, wherein light incident on the back surface of the substrate generates charge carriers which are diverted away from the at least one charge transfer region by the at least one barrier layer. At least a portion of the epitaxial layer is grown using an epitaxial lateral overgrowth technique. The barrier layer can be a high energy implant formed substantially within the epitaxial layer, an optical shield made of an optically opaque material surrounded by oxide on all sides, or a combination of both. The imaging structure can be a CCD or CMOS imaging structure.

    摘要翻译： 公开了一种用于制造背照式半导体成像装置和所得到的成像装置的方法，其包括提供具有前表面和后表面的基板的步骤; 生长基本上覆盖在衬底的前表面上的外延层; 在所述外延层中基本上形成至少一个阻挡层; 制造覆盖并延伸到所述外延层中的至少一个成像结构，所述成像结构至少一个电荷转移区域，所述至少一个阻挡层基本上位于所述至少一个电荷转移区域的下方，其中入射在所述基底的背面上的光 产生通过至少一个阻挡层从所述至少一个电荷转移区域转移的电荷载流子。 使用外延横向过度生长技术生长外延层的至少一部分。 阻挡层可以是基本上在外延层内形成的高能量注入，由在所有侧面被氧化物包围的光学不透明材料制成的光屏蔽，或两者的组合。 该成像结构可以是CCD或CMOS成像结构。

    METHOD OF FABRICATING BACK-ILLUMINATED IMAGING SENSORS USING A BUMP BONDING TECHNIQUE
    9.
    发明申请
    METHOD OF FABRICATING BACK-ILLUMINATED IMAGING SENSORS USING A BUMP BONDING TECHNIQUE 有权
    使用BUMP BONDING技术制造背照式成像传感器的方法

    公开(公告)号：US20090256227A1

    公开(公告)日：2009-10-15

    申请号：US12431150

    申请日：2009-04-28

    申请人： Mahalingam Bhaskaran ,  Pradyumna Kumar Swain ,  Peter Levine ,  Norman Goldsmith

    发明人： Mahalingam Bhaskaran ,  Pradyumna Kumar Swain ,  Peter Levine ,  Norman Goldsmith

    IPC分类号： H01L31/0232

    CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552

    摘要： A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate, and resulting imaging device is disclosed. The method for manufacturing the imaging device includes the steps of providing a substrate comprising an insulator layer, and an epitaxial layer substantially overlying the insulator layer; fabricating at least one imaging component at least partially overlying and extending into the epitaxial layer; forming a plurality of bond pads substantially overlying the epitaxial layer; fabricating a dielectric layer substantially overlying the epitaxial layer and the at least one imaging component; providing a handle wafer; forming a plurality of conductive trenches in the handle wafer; forming a plurality of conductive bumps on a first surface of the handle wafer substantially underlying the conductive trenches; and bonding the plurality of conductive bumps to the plurality of bond pads.

    摘要翻译： 公开了一种用于在绝缘体上半导体衬底上制造背照式半导体成像器件的方法，以及所得成像器件。 用于制造成像装置的方法包括以下步骤：提供包括绝缘体层的基板和基本上覆盖绝缘体层的外延层; 制造至少部分地覆盖并延伸到所述外延层中的至少一个成像部件; 形成基本上覆盖所述外延层的多个接合焊盘; 制造基本上覆盖所述外延层和所述至少一个成像部件的电介质层; 提供处理晶片; 在所述手柄晶片中形成多个导电沟槽; 在所述处理晶片的位于所述导电沟槽下面的第一表面上形成多个导电凸块; 以及将所述多个导电凸块接合到所述多个接合焊盘。

    Method of fabricating back-illuminated imaging sensors using a bump bonding technique
    10.
    发明授权
    Method of fabricating back-illuminated imaging sensors using a bump bonding technique 有权
    使用凸块接合技术制造背照式成像传感器的方法

    公开(公告)号：US07932575B2

    公开(公告)日：2011-04-26

    申请号：US12431150

    申请日：2009-04-28

    申请人： Mahalingam Bhaskaran ,  Pradyumna Kumar Swain ,  Peter Levine ,  Norman Goldsmith

    发明人： Mahalingam Bhaskaran ,  Pradyumna Kumar Swain ,  Peter Levine ,  Norman Goldsmith

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552

    摘要： A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate, and resulting imaging device is disclosed. The method for manufacturing the imaging device includes the steps of providing a substrate comprising an insulator layer, and an epitaxial layer substantially overlying the insulator layer; fabricating at least one imaging component at least partially overlying and extending into the epitaxial layer; forming a plurality of bond pads substantially overlying the epitaxial layer; fabricating a dielectric layer substantially overlying the epitaxial layer and the at least one imaging component; providing a handle wafer; forming a plurality of conductive trenches in the handle wafer; forming a plurality of conductive bumps on a first surface of the handle wafer substantially underlying the conductive trenches; and bonding the plurality of conductive bumps to the plurality of bond pads.

    摘要翻译： 公开了一种用于在绝缘体上半导体衬底上制造背照式半导体成像器件的方法，以及所得成像器件。 用于制造成像装置的方法包括以下步骤：提供包括绝缘体层的基板和基本上覆盖绝缘体层的外延层; 制造至少部分地覆盖并延伸到所述外延层中的至少一个成像部件; 形成基本上覆盖所述外延层的多个接合焊盘; 制造基本上覆盖所述外延层和所述至少一个成像部件的电介质层; 提供处理晶片; 在所述手柄晶片中形成多个导电沟槽; 在所述处理晶片的位于所述导电沟槽下面的第一表面上形成多个导电凸块; 以及将所述多个导电凸块接合到所述多个接合焊盘。