摘要:
An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
摘要:
An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
摘要:
An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
摘要:
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be brokenalong a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.
摘要:
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.
摘要:
An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
摘要:
Optically coherent, two-port, serially cascaded-form optical delay line circuits can realize arbitrary signal processing functions identical to those of FIR digital filters with complex filter coefficients whilst maintaining a maximum optical transmission characteristic of 100%. The invention provides an iterative process for transitioning in a step-wise manner a filter function of an optical delay line circuit filter from a start filter function to a target filter function. The invention also describes a dynamic gain equalizer incorporating an optical delay line circuit filter.
摘要:
An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.
摘要:
An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.
摘要:
A method of assembling an electro-optical device is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.