摘要:
Described herein are a device utilizing a gate electrode material with a single work function for both the pMOS and nMOS transistors where the magnitude of the transistor threshold voltages is modified by semiconductor band engineering and article made thereby. Further described herein are methods of fabricating a device formed of complementary (pMOS and nMOS) transistors having semiconductor channel regions which have been band gap engineered to achieve a low threshold voltage.
摘要:
A field-effect transistor for a narrow-body, multiple-gate transistor such as a FinFET, tri-gate or Ω-FET is described. The corners of the channel region disposed beneath the gate are rounded n, for instance, oxidation steps, to reduce the comer effect associated with conduction initiating in the corners of the channel region.
摘要:
A method utilizing a common gate electrode material with a single work function for both the pMOS and nMOS transistors where the magnitude of the transistor threshold voltages is modified by semiconductor band engineering and article made thereby.
摘要:
A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.
摘要:
A semiconductor device is described. That semiconductor device comprises a high-k gate dielectric layer that is formed over a channel that is positioned within a substrate, and a metal gate electrode that is formed on the high-k gate dielectric layer. The high-k gate dielectric layer has off-state leakage characteristics that are superior to those of a silicon dioxide based gate dielectric, and on-state mobility characteristics that are superior to those of a high-k gate dielectric that comprises an isotropic material.
摘要:
A method for making a semiconductor device is described. That method comprises forming on a substrate a dielectric layer and a sacrificial structure that comprises a first layer and a second layer, such that the second layer is formed on the first layer and is wider than the first layer. After the sacrificial structure is removed to generate a trench, a metal gate electrode is formed within the trench.
摘要:
The fabrication of a tri-gate transistor formed with a replacement gate process is described. A nitride dummy gate, in one embodiment, is used allowing the growth of epitaxial source and drain regions immediately adjacent to the dummy gate. This reduces the external resistance.
摘要:
Described herein are a device utilizing a gate electrode material with a single work function for both the pMOS and nMOS transistors where the magnitude of the transistor threshold voltages is modified by semiconductor band engineering and article made thereby. Further described herein are methods of fabricating a device formed of complementary (pMOS and nMOS) transistors having semiconductor channel regions which have been band gap engineered to achieve a low threshold voltage.
摘要:
A process capable of integrating both planar and non-planar transistors onto a bulk semiconductor substrate, wherein the channel of all transistors is definable over a continuous range of widths.
摘要:
Embodiments of the invention provide a substrate with a surface having different crystal orientations in different areas. Embodiments of the invention provide a substrate with a portion having a crystal orientation and another portion having a crystal orientation. N— and P-type devices may both be formed on the substrate, with each type of device having the proper crystal orientation for optimum performance.