公开(公告)号：US20240105670A1

公开(公告)日：2024-03-28

申请号：US17952348

申请日：2022-09-26

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Hung Su

IPC: H01L23/00 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: H01L24/73 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01Q1/48 ,  H01Q9/0407 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/0332 ,  H01L2224/0363 ,  H01L2224/05552 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1163 ,  H01L2224/11825 ,  H01L2224/13012 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13618 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16227 ,  H01L2224/27462 ,  H01L2224/2763 ,  H01L2224/29012 ,  H01L2224/29034 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32227 ,  H01L2224/73103 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1423

Abstract: An electronic component with high coplanarity, including a body with a functional circuit and a mounting plane, a first electrode with a first area deposited on the mounting plane, and a second electrode with a second area deposited on the mounting plane, wherein the first area is larger than the second area, and the first electrode and the second electrode includes a conductive layer and at least one first plating layer over the conductive layer, and a thickness of the conductive layer of the first electrode is smaller than a thickness of the conductive layer of the second electrode, and a thickness of the first plating layer of the first electrode is larger than a thickness of the first plating layer of the second electrode.