公开(公告)号：US08259217B2

公开(公告)日：2012-09-04

申请号：US12784762

申请日：2010-05-21

申请人： Chan-Min Chou ,  Chia-Lun Tsai ,  Chih-Pin Yen

发明人： Chan-Min Chou ,  Chia-Lun Tsai ,  Chih-Pin Yen

IPC分类号： H04N5/232

CPC分类号： G03B13/36 ,  G06K9/00228 ,  G06K9/3233 ,  H04N5/23212 ,  H04N5/23219

摘要： A fast focusing method for a digital camera is applied in an auto focusing stage for judging whether the digital camera needs to be refocused. The fast focusing method includes recording a system time after a previous focusing (defined as a first time); capturing a system time before a current focusing (defined as a second time); performing a fuzziness detection procedure to acquire a focus value when a difference obtained by subtracting the first time from the second time is greater than a focusing time threshold; setting a focusing focal length range covering a reference focal length when the focus value is between a lower limit focusing threshold and an upper limit focusing threshold; capturing images at different focusing focal lengths respectively in the focusing focal length range; calculating a contrast value of each image; calculating a target focal length from the contrast values through a quadratic curve approximation method.

摘要翻译： 用于数码相机的快速聚焦方法被应用于自动对焦阶段，用于判断数码相机是否需要重新聚焦。 快速聚焦方法包括在先前聚焦（定义为第一次）之后记录系统时间; 在当前对焦之前捕获系统时间（定义为第二次）; 当通过从第二时间减去第一次获得的差大于聚焦时间阈值时，执行模糊检测过程以获取聚焦值; 当聚焦值在下限聚焦阈值和上限聚焦阈值之间时，设置覆盖参考焦距的聚焦焦距范围; 在聚焦焦距范围内分别拍摄不同聚焦焦距的图像; 计算每个图像的对比度值; 通过二次曲线近似法从对比度值计算目标焦距。

公开(公告)号：US08284296B2

公开(公告)日：2012-10-09

申请号：US12772458

申请日：2010-05-03

申请人： Chan-Min Chou ,  Chia-Lun Tsai ,  Chih-Pin Yen

发明人： Chan-Min Chou ,  Chia-Lun Tsai ,  Chih-Pin Yen

IPC分类号： H04N5/232 ,  H04N5/228 ,  G03B13/00

CPC分类号： H04N5/23212 ,  H04N5/23241

摘要： A continuous focusing method for a digital camera is described, which is applicable to determine whether the digital camera performs a focusing procedure or not when the digital camera switches from a first scene to a second scene in a live view stage. The continuous focusing method includes the following steps. A preview image of a second scene is obtained. A blur detection procedure is performed on the preview image, so as to acquire a corresponding focus value. It is determined whether the focus value exceeds a focusing threshold value or not; if not, a focusing procedure is performed; otherwise, if the focus value is greater than the focusing threshold value, the digital camera still maintains a current focusing focal length, which represents that a focusing focal length of the second scene is the same as that of the first scene.

摘要翻译： 描述了用于数字照相机的连续聚焦方法，其可应用于当数字照相机在实时显示阶段从第一场景切换到第二场景时，确定数字照相机是否执行聚焦程序。 连续聚焦方法包括以下步骤。 获得第二场景的预览图像。 对预览图像执行模糊检测过程，以获得相应的聚焦值。 确定焦点值是否超过聚焦阈值; 如果不是，则进行聚焦过程; 否则，如果聚焦值大于聚焦阈值，则数字照相机仍保持当前聚焦焦距，其表示第二场景的聚焦焦距与第一场景相同。

公开(公告)号：US08436934B2

公开(公告)日：2013-05-07

申请号：US12784727

申请日：2010-05-21

申请人： Chan-Min Chou ,  Chia-Lun Tsai ,  Tsung-Pin Lu ,  Tzu-Huang Huang ,  Chih-Pin Yen

发明人： Chan-Min Chou ,  Chia-Lun Tsai ,  Tsung-Pin Lu ,  Tzu-Huang Huang ,  Chih-Pin Yen

IPC分类号： H04N5/232 ,  H04N5/222

CPC分类号： G03B13/00

摘要： A method for assisting in focal length detection is applicable to a digital camera having the flash. The method includes the following steps. First, the flash of the digital camera is actuated and a first image is captured. Afterwards, a characteristic exposure value of the first image is calculated. A focus range comparison table is looked up according to the characteristic exposure value to obtain an initial focus position. Then, a focus procedure is performed according to the initial focus position to obtain a target focal length.

摘要翻译： 用于辅助焦距检测的方法适用于具有闪光灯的数字照相机。 该方法包括以下步骤。 首先，激活数码相机的闪光并捕获第一图像。 之后，计算第一图像的特征曝光值。 根据特征曝光值查找对焦范围比较表以获得初始聚焦位置。 然后，根据初始聚焦位置执行聚焦过程以获得目标焦距。

公开(公告)号：US20110069190A1

公开(公告)日：2011-03-24

申请号：US12772571

申请日：2010-05-03

申请人： Chan-Min Chou ,  Chia-Lun Tsai ,  Chih-Pin Yen

发明人： Chan-Min Chou ,  Chia-Lun Tsai ,  Chih-Pin Yen

IPC分类号： H04N5/228

CPC分类号： H04N5/23212 ,  H04N5/23241

摘要： A fast focusing method for a digital camera is applied in the digital camera to judge whether a focusing focal length of the digital camera needs to be adjusted in an auto focusing stage. The fast focusing method includes capturing a target image at a reference focal length; performing a blur detection procedure on the target image to acquire a focus value; setting a focusing focal length range covering the reference focal length when the focus value is between a lower limit focusing threshold and an upper limit focusing threshold; capturing corresponding comparison images at different focusing focal lengths respectively in the focusing focal length range; calculating a contrast value of each comparison image; and calculating the contrast values and a target focal length through a quadratic curve approximation method, and adjusting lenses of the digital camera to the set target focal length to perform shooting.

摘要翻译： 在数码相机中应用数字照相机的快速聚焦方法，以判断在自动对焦阶段是否需要调整数码相机的聚焦焦距。 快速聚焦方法包括以参考焦距捕获目标图像; 对目标图像执行模糊检测过程以获得聚焦值; 当聚焦值在下限聚焦阈值和上限聚焦阈值之间时，设置覆盖参考焦距的聚焦焦距范围; 在聚焦焦距范围内分别捕获不同聚焦焦距处的对应比较图像; 计算每个比较图像的对比度值; 以及通过二次曲线近似方法计算对比度值和目标焦距，以及将数字照相机的镜头调整到设定的目标焦距以进行拍摄。

公开(公告)号：US08233787B2

公开(公告)日：2012-07-31

申请号：US12963760

申请日：2010-12-09

申请人： Chih-Pin Yen ,  Chia-Lun Tsai ,  Li-Wen Kuo

发明人： Chih-Pin Yen ,  Chia-Lun Tsai ,  Li-Wen Kuo

IPC分类号： G03B17/00 ,  G03B3/00 ,  G03B13/00 ,  H04N5/262 ,  H04N2/232 ,  G02B7/04

CPC分类号： G03B3/10 ,  G03B13/34 ,  G03B13/36

摘要： A photographic device using a focus method includes a zoom lens, an image analyzing module, a focus distance providing module and a processing module. The zoom lens is used for capturing image information of a plurality of positions. The image analyzing module is used for analyzing contrast values of the image information of the plurality of positions. The focus distance providing module is used for providing a non-equivalent and a constant focus distance interval for capturing the image information of the plurality of positions. The processing module is electrically connected with the zoom lens, the image analyzing module, and the focus distance providing module. Whereby, the photographic device acquires the image information of the plurality of positions by the non-equivalent focus distance interval, acquires a coarse focus position, and acquires an accurate focus position by the constant focus distance according to the coarse focus position.

摘要翻译： 使用聚焦方法的摄影装置包括变焦镜头，图像分析模块，对焦距离提供模块和处理模块。 变焦镜头用于拍摄多个位置的图像信息。 图像分析模块用于分析多个位置的图像信息的对比度值。 聚焦距离提供模块用于提供用于捕获多个位置的图像信息的非等效和恒定焦距距离间隔。 处理模块与变焦镜头，图像分析模块和对焦距离提供模块电连接。 由此，拍摄装置通过非等效对焦距离间隔获取多个位置的图像信息，获取粗略聚焦位置，并且通过根据粗焦点位置的恒定焦距来获取准确的聚焦位置。

公开(公告)号：US08294810B2

公开(公告)日：2012-10-23

申请号：US12833377

申请日：2010-07-09

申请人： Chih-Pin Yen ,  Chia-Lun Tsai ,  Li-Wen Kuo

发明人： Chih-Pin Yen ,  Chia-Lun Tsai ,  Li-Wen Kuo

IPC分类号： H04N5/232

CPC分类号： G03B13/36 ,  G03B3/10 ,  H04N5/23212 ,  H04N5/23219

摘要： An assisting focusing method is applicable in an image capture device having an auto focusing (AF) procedure. The AF procedure has a preset sampling interval. The assisting focusing method includes the following steps. An image for focusing is captured. A face parameter of a face block in the image for focusing is calculated. According to the face parameter, a parameter-to-focus conversion table is looked up to acquire a focusing section. According to the focusing section and a face sampling interval, the AF procedure is performed to acquire a target focus. The face sampling interval is smaller than the preset sampling interval.

摘要翻译： 辅助对焦方法适用于具有自动聚焦（AF）过程的图像捕获装置。 AF程序具有预设的采样间隔。 辅助聚焦方法包括以下步骤。 捕获用于聚焦的图像。 计算用于聚焦的图像中的面部块的面部参数。 根据面部参数，查找参数对焦转换表以获取聚焦部分。 根据聚焦部分和面部采样间隔，执行AF过程以获取目标焦点。 面部采样间隔小于预设采样间隔。

公开(公告)号：US20110194848A1

公开(公告)日：2011-08-11

申请号：US12963760

申请日：2010-12-09

申请人： Chih-Pin Yen ,  Chia-Lun Tsai ,  Li-Wen Kuo

发明人： Chih-Pin Yen ,  Chia-Lun Tsai ,  Li-Wen Kuo

IPC分类号： G03B17/00

CPC分类号： G03B3/10 ,  G03B13/34 ,  G03B13/36

摘要： A focus method and a photographic device using the method are disclosed. The photographic device comprises a zoom lens, an image analyzing module, a focus distance providing module and a processing module. The zoom lens is used for capturing image information of a plurality of positions; the image analyzing module is used for analyzing contrast values of the image information of the plurality of positions; the focus distance providing module is used for providing a non-equivalent and a constant focus distance interval for capturing the image information of the plurality of positions; and the processing module is electrically connected with the zoom lens, the image analyzing module, and the focus distance providing module. Whereby, the photographic device acquires the image information of the plurality of positions by the non-equivalent focus distance interval and acquires a coarse focus position, and acquires an accurate focus position by the constant focus distance according to the coarse focus position.

摘要翻译： 公开了使用该方法的聚焦方法和照相装置。 摄影装置包括变焦镜头，图像分析模块，对焦距离提供模块和处理模块。 变焦镜头用于拍摄多个位置的图像信息; 图像分析模块用于分析多个位置的图像信息的对比度值; 聚焦距离提供模块用于提供用于捕获多个位置的图像信息的非等效和恒定焦距距离间隔; 并且处理模块与变焦镜头，图像分析模块和对焦距离提供模块电连接。 由此，拍摄装置通过非等效对焦距离间隔取得多个位置的图像信息，并获取粗略聚焦位置，并且通过根据粗焦点位置的恒定焦距来获取准确的聚焦位置。

公开(公告)号：US08866268B2

公开(公告)日：2014-10-21

申请号：US13183446

申请日：2011-07-15

申请人： Shang-Yi Wu ,  Wen-Cheng Chien ,  Chia-Lun Tsai ,  Tien-Hao Huang

发明人： Shang-Yi Wu ,  Wen-Cheng Chien ,  Chia-Lun Tsai ,  Tien-Hao Huang

IPC分类号： H01L29/41 ,  H01L21/283 ,  H01L23/367 ,  H01L33/64 ,  H01L23/00 ,  H01L33/44 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L23/3677 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L33/44 ,  H01L33/642 ,  H01L2224/2401 ,  H01L2224/2405 ,  H01L2224/24101 ,  H01L2224/24247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/73277 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/141 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2933/0075 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package structure and a manufacturing method thereof are provided. The semiconductor package structure includes a semiconductor die, a thermally conductive film, a substrate, a plurality of electrically conductive film patterns, and at least one insulator. The thermally conductive film is disposed on the bottom of the semiconductor die. The substrate is substantially comprised of the electrically conductive material or semiconductor material. Furthermore, a first hole is disposed on and passed all the way through the substrate, and the semiconductor die is disposed in the first hole. The electrically conductive film patterns are disposed on the substrate, and not contacting with each other. In addition, the insulator is connected between the semiconductor die and the substrate.

摘要翻译： 提供半导体封装结构及其制造方法。 半导体封装结构包括半导体管芯，导热膜，衬底，多个导电膜图案和至少一个绝缘体。 导热膜设置在半导体管芯的底部。 衬底基本上由导电材料或半导体材料构成。 此外，第一孔设置在基板上并通过基板，并且半导体管芯设置在第一孔中。 导电膜图案设置在基板上，并且不彼此接触。 此外，绝缘体连接在半导体管芯和衬底之间。

公开(公告)号：US08399963B2

公开(公告)日：2013-03-19

申请号：US12896277

申请日：2010-10-01

申请人： Chia-Lun Tsai ,  Tsang-Yu Liu ,  Chia-Ming Cheng

发明人： Chia-Lun Tsai ,  Tsang-Yu Liu ,  Chia-Ming Cheng

IPC分类号： H01L23/544 ,  H01L23/48

CPC分类号： H01L21/78 ,  H01L21/76898 ,  H01L23/552 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/023 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/2919 ,  H01L2224/73253 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05552

摘要： A chip package includes a substrate having a pad region, a device region, and a remained scribe region located at a periphery of the substrate; a signal and an EMI ground pads disposed on the pad region; a first and a second openings penetrating into the substrate to expose the signal and the EMI ground pads, respectively; a first and a second conducting layers located in the first and the second openings and electrically connecting the signal and the EMI ground pads, respectively, wherein the first conducting layer and the signal pad are separated from a periphery of the remained scribe region, and wherein a portion of the second conducting layer and/or the EMI ground pad extend(s) to a periphery of the remained scribe region; and a third conducting layer surrounding the periphery of the remained scribe region to electrically connect the second conducting layer and/or the EMI ground pad.

摘要翻译： 芯片封装包括具有焊盘区域，器件区域和位于衬底周围的残留刻划区域的衬底; 设置在所述焊盘区域上的信号和EMI接地焊盘; 分别穿入基板以暴露信号和EMI接地焊盘的第一和第二开口; 位于所述第一和第二开口中的第一和第二导电层，分别电连接所述信号和所述EMI接地焊盘，其中所述第一导电层和所述信号焊盘与所述残留划线区域的外围分离，并且其中 所述第二导电层和/或所述EMI接地垫的一部分延伸到所述残留划线区域的周边; 以及围绕剩余划线区域的周边的第三导电层，以电连接第二导电层和/或EMI接地垫。

公开(公告)号：US20090283877A1

公开(公告)日：2009-11-19

申请号：US12466656

申请日：2009-05-15

申请人： Chia-Lun Tsai ,  Ching-Yu Ni ,  Jack Chen ,  Wen-Cheng Chien

发明人： Chia-Lun Tsai ,  Ching-Yu Ni ,  Jack Chen ,  Wen-Cheng Chien

IPC分类号： H01L23/552 ,  H01L23/532 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor device and manufacturing method thereof are disclosed. The device comprises a semiconductor die, a passivation layer, a wiring redistribution layer (RDL), an Ni/Au layer, and a solder mask. The semiconductor die comprises a top metal exposed in an active surface thereof. The passivation layer overlies the active surface of the semiconductor die, and comprises a through passivation opening overlying the top metal. The wiring RDL, comprising an Al layer, overlies the passivation layer, and electrically connects to the top metal via the passivation opening. The solder mask overlies the passivation layer and the wiring RDL, exposing a terminal of the wiring RDL.

摘要翻译： 公开了一种半导体器件及其制造方法。 该器件包括半导体管芯，钝化层，布线再分布层（RDL），Ni / Au层和焊料掩模。 半导体管芯包括在其活性表面中暴露的顶部金属。 钝化层覆盖半导体管芯的有源表面，并且包括覆盖顶部金属的贯通钝化开口。 包括Al层的布线RDL覆盖钝化层，并通过钝化开口电连接到顶部金属。 焊接掩模覆盖钝化层和布线RDL，露出布线RDL的端子。