Illumination device and assembling method thereof
    1.
    发明授权
    Illumination device and assembling method thereof 有权
    照明装置及其组装方法

    公开(公告)号:US08926130B2

    公开(公告)日:2015-01-06

    申请号:US13410307

    申请日:2012-03-02

    摘要: An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.

    摘要翻译: 提供一种包括基座,散热构件,至少一个柔性印刷电路板(FPC)和多个发光元件的照明装置。 设置在基座上的散热构件具有中心轴线,多个保持弯曲表面和沿着中心轴线延伸的多个散热通道,其中保持弯曲表面和散热通道围绕中心轴线交错布置 并且每个保持弯曲表面沿着中心轴线径向延伸。 柔性印刷电路板设置在保持弯曲表面上。 发光元件设置在柔性印刷电路板上。 还提供了一种照明装置的组装方法。

    ILLUMINATION DEVICE AND ASSEMBLING METHOD THEREOF
    2.
    发明申请
    ILLUMINATION DEVICE AND ASSEMBLING METHOD THEREOF 有权
    照明装置及其组装方法

    公开(公告)号:US20130010472A1

    公开(公告)日:2013-01-10

    申请号:US13410307

    申请日:2012-03-02

    IPC分类号: F21V29/00 H05K13/00

    摘要: An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.

    摘要翻译: 提供一种包括基座,散热构件,至少一个柔性印刷电路板(FPC)和多个发光元件的照明装置。 设置在基座上的散热构件具有中心轴线,多个保持弯曲表面和沿着中心轴线延伸的多个散热通道,其中保持弯曲表面和散热通道围绕中心轴线交错布置 并且每个保持弯曲表面沿着中心轴线径向延伸。 柔性印刷电路板设置在保持弯曲表面上。 发光元件设置在柔性印刷电路板上。 还提供了一种照明装置的组装方法。

    ILLUMINATION DEVICE, LIGHT SOURCE, AND LIGHT MODULE
    3.
    发明申请
    ILLUMINATION DEVICE, LIGHT SOURCE, AND LIGHT MODULE 有权
    照明设备,光源和光模块

    公开(公告)号:US20130114252A1

    公开(公告)日:2013-05-09

    申请号:US13410310

    申请日:2012-03-02

    IPC分类号: F21V21/005 F21V7/00

    摘要: An illumination device including a base, a light bar, and a cover is provided. The base has a cavity. The light bar is disposed at the bottom of the cavity and includes a plurality of dot light sources arranged along a first axial direction. The cover is assembled to the base for correspondingly covering the light bar and has a plurality of openings. The distribution density of the openings increases from a corresponding location of a dot light source towards two opposite ends along the first axial direction. A light source and a light module are also provided. Another illumination device including a base and a plurality of light sources is further provided.

    摘要翻译: 提供了包括基座,灯条和盖的照明装置。 基座有一个空腔。 光条设置在空腔的底部,并且包括沿着第一轴向布置的多个点光源。 将盖组装到基座上以对应地覆盖光条并具有多个开口。 开口的分布密度从点光源的相应位置朝着沿着第一轴向方向的两个相对端增加。 还提供了光源和光模块。 还提供了包括基座和多个光源的另一照明装置。

    Illumination device, light source, and light module
    4.
    发明授权
    Illumination device, light source, and light module 有权
    照明装置,光源和灯模块

    公开(公告)号:US08764228B2

    公开(公告)日:2014-07-01

    申请号:US13410310

    申请日:2012-03-02

    IPC分类号: F21V11/14 F21V11/08

    摘要: An illumination device including a base, a light bar, and a cover is provided. The base has a cavity. The light bar is disposed at the bottom of the cavity and includes a plurality of dot light sources arranged along a first axial direction. The cover is assembled to the base for correspondingly covering the light bar and has a plurality of openings. The distribution density of the openings increases from a corresponding location of a dot light source towards two opposite ends along the first axial direction. A light source and a light module are also provided. Another illumination device including a base and a plurality of light sources is further provided.

    摘要翻译: 提供了包括基座,灯条和盖的照明装置。 基座有一个空腔。 光条设置在空腔的底部,并且包括沿着第一轴向布置的多个点光源。 将盖组装到基座上以对应地覆盖光条并具有多个开口。 开口的分布密度从点光源的相应位置朝着沿着第一轴向方向的两个相对端增加。 还提供了光源和光模块。 还提供了包括基座和多个光源的另一照明装置。

    Light emitting diode structure having a conductive thin film for connecting a light emitting stack to an electrode and LED packaging structure using the same
    6.
    发明授权
    Light emitting diode structure having a conductive thin film for connecting a light emitting stack to an electrode and LED packaging structure using the same 有权
    具有用于将发光堆叠连接到电极的导电薄膜的发光二极管结构和使用其的LED封装结构

    公开(公告)号:US08193541B2

    公开(公告)日:2012-06-05

    申请号:US12980593

    申请日:2010-12-29

    IPC分类号: H01L33/00 H01L33/18

    摘要: A light emitting diode (LED) structure and a LED packaging structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.

    摘要翻译: 公开了一种发光二极管(LED)结构和LED封装结构。 LED结构包括子安装座,堆叠结构,电极,隔离层和导电薄膜层。 子安装座具有与第一表面相对的第一表面和第二表面。 叠层结构具有层压在第一表面上的第一半导体层,有源层和第二半导体层。 电极与第一表面上的堆叠结构隔开。 隔离层设置在第一表面上以包围堆叠结构以及覆盖有源层的侧面。 导电薄膜层将电极连接到堆叠结构并覆盖堆叠结构。