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公开(公告)号:US20120205808A1
公开(公告)日:2012-08-16
申请号:US13459268
申请日:2012-04-30
申请人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
发明人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
IPC分类号: H01L23/48
CPC分类号: H01L24/02 , B81B2207/015 , B81B2207/07 , B81B2207/115 , B81C1/00246 , B81C2203/0714 , H01L23/585 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/1461 , H01L2924/00
摘要: A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
摘要翻译: 提供垫的保护结构。 衬垫设置在半导体衬底上的电介质层中,衬垫包括连接区域和包围连接区域的周边区域。 保护结构至少包括屏障,绝缘层和掩模层。 阻挡层设置在周边区域的电介质层中。 绝缘层设置在电介质层上。 掩模层设置在电介质层上并覆盖绝缘层,掩模层包括露出焊盘连接区域的开口。
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公开(公告)号:US08193640B2
公开(公告)日:2012-06-05
申请号:US12538168
申请日:2009-08-10
申请人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
发明人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
IPC分类号: H01L23/48
CPC分类号: H01L24/02 , B81B2207/015 , B81B2207/07 , B81B2207/115 , B81C1/00246 , B81C2203/0714 , H01L23/585 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/1461 , H01L2924/00
摘要: A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
摘要翻译: 提供垫的保护结构。 衬垫设置在半导体衬底上的电介质层中,衬垫包括连接区域和包围连接区域的周边区域。 保护结构至少包括屏障,绝缘层和掩模层。 阻挡层设置在周边区域的电介质层中。 绝缘层设置在电介质层上。 掩模层设置在电介质层上并覆盖绝缘层,掩模层包括露出焊盘连接区域的开口。
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公开(公告)号:US08587078B2
公开(公告)日:2013-11-19
申请号:US12754610
申请日:2010-04-06
申请人: Chien-Hsin Huang , Li-Che Chen , Ming-I Wang , Bang-Chiang Lan , Tzung-Han Tan , Hui-Min Wu , Tzung-I Su
发明人: Chien-Hsin Huang , Li-Che Chen , Ming-I Wang , Bang-Chiang Lan , Tzung-Han Tan , Hui-Min Wu , Tzung-I Su
CPC分类号: H01L27/0617 , B81B2201/0257 , B81B2207/015 , B81C1/00246 , B81C2203/0714 , B81C2203/0742 , B81C2203/0771
摘要: A fabricating method of integrated circuit is provided. During the fabricating process of an interconnecting structure of the integrated circuit, a micro electromechanical system (MENS) diaphragm is formed between two adjacent dielectric layers of the interconnecting structure. The method of forming the MENS diaphragm includes the following steps. Firstly, a plurality of first openings is formed within any dielectric layer to expose corresponding conductive materials of the interconnecting structure. Secondly, a bottom insulating layer is formed on the dielectric layer and filling into the first openings. Third, portions of the bottom insulating layer located in the first openings are removed to form at least a first trench for exposing the corresponding conductive materials. Then, a first electrode layer and a top insulating layer are sequentially formed on the bottom insulating layer, and the first electrode layer filled into the first trench and is electrically connected to the conductive materials.
摘要翻译: 提供了集成电路的制造方法。 在集成电路的互连结构的制造过程中,在互连结构的两个相邻电介质层之间形成微机电系统(MENS)隔膜。 形成MENS隔膜的方法包括以下步骤。 首先,在任何电介质层内形成多个第一开口以暴露互连结构的相应的导电材料。 其次,在电介质层上形成底部绝缘层并填充到第一开口中。 第三,去除位于第一开口中的底部绝缘层的部分,以形成用于暴露相应导电材料的至少第一沟槽。 然后,第一电极层和顶部绝缘层依次形成在底部绝缘层上,第一电极层被填充到第一沟槽中并与导电材料电连接。
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公开(公告)号:US08502382B2
公开(公告)日:2013-08-06
申请号:US13459268
申请日:2012-04-30
申请人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
发明人: Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Min Chen , Chien-Hsin Huang , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Li-Che Chen , Meng-Jia Lin
IPC分类号: H01L23/48
CPC分类号: H01L24/02 , B81B2207/015 , B81B2207/07 , B81B2207/115 , B81C1/00246 , B81C2203/0714 , H01L23/585 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/1461 , H01L2924/00
摘要: A protection structure of a pad is provided. The pad is disposed in a dielectric layer on a semiconductor substrate and the pad includes a connection region and a peripheral region which encompasses the connection region. The protection structure includes at least a barrier, an insulation layer and a mask layer. The barrier is disposed in the dielectric layer in the peripheral region. The insulation layer is disposed on the dielectric layer. The mask layer is disposed on the dielectric layer and covers the insulation layer and the mask layer includes an opening to expose the connection region of the pad.
摘要翻译: 提供垫的保护结构。 衬垫设置在半导体衬底上的电介质层中,衬垫包括连接区域和包围连接区域的周边区域。 保护结构至少包括屏障,绝缘层和掩模层。 阻挡层设置在周边区域的电介质层中。 绝缘层设置在电介质层上。 掩模层设置在电介质层上并覆盖绝缘层,掩模层包括露出焊盘连接区域的开口。
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5.
公开(公告)号:US08558336B2
公开(公告)日:2013-10-15
申请号:US12542671
申请日:2009-08-17
申请人: Tzung-I Su , Bang-Chiang Lan , Chao-An Su , Hui-Min Wu , Ming-I Wang , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin , Wen-Yu Su
发明人: Tzung-I Su , Bang-Chiang Lan , Chao-An Su , Hui-Min Wu , Ming-I Wang , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin , Wen-Yu Su
IPC分类号: H01L31/0232 , H01L31/18 , H01L31/08
CPC分类号: H01L31/035281 , H01L27/1461 , H01L31/105 , H01L31/1804 , H01L31/1808 , Y02E10/547 , Y02P70/521
摘要: A semiconductor photodetector structure is provided. The structure includes a substrate, a photodetecting element and a semiconductor layer disposed on the photodetecting element. The substrate includes a first semiconductor material and includes a deep trench. The surface of the deep trench includes a first type dopant. The photodetecting element is disposed in the deep trench. The photodetecting element includes a second semiconductor material. The semiconductor layer includes a second type dopant.
摘要翻译: 提供半导体光电检测器结构。 该结构包括基板,受光元件和设置在光电检测元件上的半导体层。 衬底包括第一半导体材料并且包括深沟槽。 深沟槽的表面包括第一类型的掺杂剂。 光检测元件设置在深沟槽中。 光检测元件包括第二半导体材料。 半导体层包括第二种掺杂剂。
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6.
公开(公告)号:US20110115040A1
公开(公告)日:2011-05-19
申请号:US12618774
申请日:2009-11-15
申请人: Tzung-I Su , Chao-An Su , Ming-I Wang , Bang-Chiang Lan , Tzung-Han Tan , Hui-Min Wu , Chien-Hsin Huang , Min Chen , Meng-Jia Lin
发明人: Tzung-I Su , Chao-An Su , Ming-I Wang , Bang-Chiang Lan , Tzung-Han Tan , Hui-Min Wu , Chien-Hsin Huang , Min Chen , Meng-Jia Lin
IPC分类号: H01L31/0232 , H01L31/18
CPC分类号: G02B6/1228 , G02B6/12002 , G02B6/12004 , G02B6/136 , G02B6/428
摘要: A method of fabricating a semiconductor optoelectronic structure is provided. First, a substrate is provided, and a waveguide is formed therein, and then a plurality of dielectric layers is formed on the waveguide. Next, a contact pad and a passivation layer are provided on the dielectric layers and a patterned mask layer is formed thereon. Last, an etching process is provided by using the patterned mask layer to expose the contact pad and remove a portion of the passivation layer and the dielectric layers to form a transformer.
摘要翻译: 提供一种制造半导体光电子结构的方法。 首先,提供基板,并且在其中形成波导,然后在波导上形成多个电介质层。 接下来,在电介质层上设置接触焊盘和钝化层,并且在其上形成图案化的掩模层。 最后,通过使用图案化掩模层来暴露接触焊盘并去除钝化层和介电层的一部分以形成变压器来提供蚀刻工艺。
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公开(公告)号:US20110097033A1
公开(公告)日:2011-04-28
申请号:US12605891
申请日:2009-10-26
申请人: Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Hui-Min Wu , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin
发明人: Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Hui-Min Wu , Chien-Hsin Huang , Tzung-Han Tan , Min Chen , Meng-Jia Lin
CPC分类号: G02B6/12004 , G02B6/305
摘要: A focusing member and an optoelectronic device having the same are provided. The focusing member includes multiple levels of conductive plugs and multiple levels of conductive layers that together form an inversed half-boat shape. The optoelectronic device includes a bottom layer, an optical waveguide above the bottom layer, a dielectric layer covering the optical waveguide, and the above focusing member disposed at an edge of the optoelectronic device and located in the dielectric layer above the optical waveguide. A wider end of the inversed half-boat shape of the focusing member faces the outside of the optoelectronic device. The refractive indexes of the bottom layer and the dielectric layer are smaller than that of the optical waveguide.
摘要翻译: 提供聚焦构件和具有该聚焦构件的光电子器件。 聚焦构件包括多个级别的导电插塞和多层导电层,这些导电层一起形成反转的半舟形状。 光电子器件包括底层,底层上方的光波导,覆盖光波导的电介质层,以及设置在光电子器件的边缘并位于光波导上方的电介质层中的上述聚焦构件。 聚焦构件的反转半舟形的较宽端面向光电器件的外侧。 底层和电介质层的折射率小于光波导的折射率。
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公开(公告)号:US08710601B2
公开(公告)日:2014-04-29
申请号:US12621526
申请日:2009-11-19
申请人: Chien-Hsin Huang , Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Min Chen , Meng-Jia Lin
发明人: Chien-Hsin Huang , Bang-Chiang Lan , Ming-I Wang , Hui-Min Wu , Tzung-I Su , Chao-An Su , Tzung-Han Tan , Min Chen , Meng-Jia Lin
IPC分类号: H01L29/84
CPC分类号: H04R19/005 , B81B3/0072 , B81B2201/0221 , B81B2201/0257 , B81B2203/0127 , H01L29/84
摘要: A micro electro mechanical system (MEMS) structure is disclosed. The MEMS structure includes a backplate electrode and a 3D diaphragm electrode. The 3D diaphragm electrode has a composite structure so that a dielectric is disposed between two metal layers. The 3D diaphragm electrode is adjacent to the backplate electrode to form a variable capacitor together.
摘要翻译: 公开了一种微机电系统(MEMS)结构。 MEMS结构包括背板电极和3D隔膜电极。 3D隔膜电极具有复合结构,使得电介质设置在两个金属层之间。 3D隔膜电极与背板电极相邻,以形成可变电容器。
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公开(公告)号:US08139907B2
公开(公告)日:2012-03-20
申请号:US12648861
申请日:2009-12-29
申请人: Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Chien-Hsin Huang , Hui-Min Wu , Tzung-Han Tan , Min Chen , Meng-Jia Lin
发明人: Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Chien-Hsin Huang , Hui-Min Wu , Tzung-Han Tan , Min Chen , Meng-Jia Lin
IPC分类号: G02B6/12
CPC分类号: G02B6/12004 , G02B2006/12061
摘要: An optoelectronic device including a substrate, a half-boat-shaped material layer, a deep trench isolation structure, and an optical waveguide is provided. The substrate has a first area. The half-boat-shaped material layer is disposed in the substrate within the first area. The refractive index of the half-boat-shaped material layer is lower than that of the substrate. A top surface of the half-boat-shaped material layer is coplanar with the surface of the substrate. The deep trench isolation structure is disposed in the substrate within the first area and located at one side of a bow portion of the half-boat-shaped material layer. The optical waveguide is disposed on the substrate within the first area. The optical waveguide overlaps a portion of the deep trench isolation structure and at least a portion of the half-boat-shaped material layer.
摘要翻译: 提供了包括基板,半舟形材料层,深沟槽隔离结构和光波导的光电子器件。 衬底具有第一区域。 半船形材料层设置在第一区域内的基板内。 半舟状材料层的折射率低于基板的折射率。 半舟状材料层的上表面与基板的表面共面。 深沟槽隔离结构设置在第一区域内的基板中,并且位于半舟形材料层的弓形部分的一侧。 光波导路设置在第一区域内的基板上。 光波导与深沟槽隔离结构的一部分和半舟形材料层的至少一部分重叠。
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公开(公告)号:US20110158581A1
公开(公告)日:2011-06-30
申请号:US12648861
申请日:2009-12-29
申请人: Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Chien-Hsin Huang , Hui-Min Wu , Tzung-Han Tan , Min Chen , Meng-Jia Lin
发明人: Tzung-I Su , Ming-I Wang , Bang-Chiang Lan , Te-Kan Liao , Chao-An Su , Chien-Hsin Huang , Hui-Min Wu , Tzung-Han Tan , Min Chen , Meng-Jia Lin
CPC分类号: G02B6/12004 , G02B2006/12061
摘要: An optoelectronic device including a substrate, a half-boat-shaped material layer, a deep trench isolation structure, and an optical waveguide is provided. The substrate has a first area. The half-boat-shaped material layer is disposed in the substrate within the first area. The refractive index of the half-boat-shaped material layer is lower than that of the substrate. A top surface of the half-boat-shaped material layer is coplanar with the surface of the substrate. The deep trench isolation structure is disposed in the substrate within the first area and located at one side of a bow portion of the half-boat-shaped material layer. The optical waveguide is disposed on the substrate within the first area. The optical waveguide overlaps a portion of the deep trench isolation structure and at least a portion of the half-boat-shaped material layer.
摘要翻译: 提供了包括基板,半舟形材料层,深沟槽隔离结构和光波导的光电子器件。 衬底具有第一区域。 半船形材料层设置在第一区域内的基板内。 半舟状材料层的折射率低于基板的折射率。 半舟状材料层的上表面与基板的表面共面。 深沟槽隔离结构设置在第一区域内的基板中,并且位于半舟形材料层的弓形部分的一侧。 光波导路设置在第一区域内的基板上。 光波导与深沟槽隔离结构的一部分和半舟形材料层的至少一部分重叠。
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