公开(公告)号：US08022309B2

公开(公告)日：2011-09-20

申请号：US11946859

申请日：2007-11-29

申请人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

发明人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

IPC分类号： H05K1/00

CPC分类号： H05K1/0245 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/0969 ,  Y10T29/49156

摘要： An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.

摘要翻译： 示例性FPCB包括具有由布置在其中的两条传输线组成的差分对的信号层，接地层和位于信号层和接地层之间的电介质层。 由导电材料制成的两片分别布置在差动对的相对两侧，并且都连接到地面。 纸张与传输线分开并平行。 接地层具有限定在其中的空隙，并且空隙位于两条传输线之下。

公开(公告)号：US07781680B2

公开(公告)日：2010-08-24

申请号：US11951290

申请日：2007-12-05

申请人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

发明人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

IPC分类号： H05K1/00

CPC分类号： H05K1/0245 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09336 ,  H05K2201/09672

摘要： An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals.

摘要翻译： 示例性FPCB包括由第一传输线和第二传输线组成的差分对，其中布置有第一传输线的信号层，具有包括第一传输线下面的区域的空隙的接地层，以及介电层 位于信号层和接地层之间。 第二传输线布置在沿水平方向偏离第一传输线的接地层中。 FPCB可以传输高速信号。

公开(公告)号：US07542303B2

公开(公告)日：2009-06-02

申请号：US11957419

申请日：2007-12-15

申请人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai

发明人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai

IPC分类号： H05K7/10 ,  H05K7/12

CPC分类号： H05K1/0245 ,  H05K1/0219 ,  H05K2201/09336 ,  H05K2201/09672

摘要： A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.

摘要翻译： 印刷电路板（PCB）包括夹在其间的电介质层的第一和第二信号层，以及分别设置在第一和第二信号层内的差分对。 两个接地部分分别布置在两个差分迹线中的每一个的相对侧。

公开(公告)号：US08203082B2

公开(公告)日：2012-06-19

申请号：US12272797

申请日：2008-11-18

申请人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu ,  Ying-Tso Lai

发明人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu ,  Ying-Tso Lai

IPC分类号： H05K1/11

CPC分类号： H05K1/116 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09636

摘要： A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.

摘要翻译： 印刷电路板包括第一布局层，第二布局层，铜箔层，第一通孔和第二通孔。 第一布局层具有第一信号线和第二信号线，每条信号线都具有弯曲的第一部分。 第二布局层具有第三信号线和第四信号线，每条信号线还具有弯曲的第一部分。 第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分耦合到第一通孔和第二通孔。 在这种情况下，第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分协同地产生螺旋电感特性。

公开(公告)号：US20110299263A1

公开(公告)日：2011-12-08

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。

公开(公告)号：US20110298341A1

公开(公告)日：2011-12-08

申请号：US12859283

申请日：2010-08-19

申请人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

发明人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

IPC分类号： H05K5/02

CPC分类号： H05K9/0086

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个具有多个屏蔽的通孔。 每个护罩包括一个离开板的突出部分。 至少两个间隔开的连接件将突片连接到对应的通孔，使得突出部基本上与相应的通孔对准并与之隔开。

公开(公告)号：US07968802B2

公开(公告)日：2011-06-28

申请号：US11967017

申请日：2007-12-29

申请人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

发明人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

IPC分类号： H05K1/11 ,  H01P1/00

CPC分类号： H05K1/0245 ,  H05K1/0228 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/09636 ,  H05K2201/097

摘要： A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes a first segment and a second segment, the second differential trace includes a third segment and a fourth segment. The first and the third segments are electrically coupled to the upper caps of the first and the second vias respectively. The second and the fourth segments are electrically coupled to the lower caps of the first and the second vias respectively. The first and the third segments extend from corresponding upper caps in different directions, the second and the fourth segments extend from corresponding lower caps in different directions.

摘要翻译： 印刷电路板（PCB）包括具有第一差分迹线和第二差分迹线的差分对，具有上盖和下盖的第一通孔以及具有上盖和下盖的第二通孔。 第一差分迹线包括第一段和第二段，第二差分迹线包括第三段和第四段。 第一和第三段分别电耦合到第一和第二通孔的上盖。 第二和第四段分别电耦合到第一和第二通孔的下盖。 第一和第三段从相应的上盖在不同的方向上延伸，第二和第四段从相应的下盖在不同的方向延伸。

公开(公告)号：US08389873B2

公开(公告)日：2013-03-05

申请号：US12841125

申请日：2010-07-21

申请人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00 ,  H02B1/56

CPC分类号： H05K9/0041 ,  H05K9/0024

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 多个屏蔽件从对应于通孔的板延伸。 每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US08305774B2

公开(公告)日：2012-11-06

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。

公开(公告)号：US08270180B2

公开(公告)日：2012-09-18

申请号：US12646888

申请日：2009-12-23

申请人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai ,  Po-Chuan Hsieh

发明人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai ,  Po-Chuan Hsieh

IPC分类号： H05K1/11 ,  H05K7/00 ,  H05K1/14

CPC分类号： H05K1/0251 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09636

摘要： A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.

摘要翻译： 印刷电路板包括多个信号层，多个接地层，第一传输线，第二传输线，第一通孔和第二通孔。 第一个传输位于多个信号层之一上。 第二传输线位于多个信号层的另一个上。 第一和第二通孔穿过印刷电路板。 第一通孔电耦合到第一和第二传输线，并且与接地层的数量隔离。 第二通孔电耦合到多个接地层中的一个或多个，并与多个接地层中的另一个隔离，以增加电感，从而补偿开路短路的电容特性并提高信号完整性。