SEMICONDUCTOR DEVICE HAVING A TRENCH GATE AND METHOD FOR MANUFACTURING
    1.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A TRENCH GATE AND METHOD FOR MANUFACTURING 审中-公开
    具有TRENCH门的半导体器件和制造方法

    公开(公告)号:US20110309423A1

    公开(公告)日:2011-12-22

    申请号:US13218188

    申请日:2011-08-25

    摘要: A semiconductor device having a trench gate and method for manufacturing is disclosed. One embodiment includes a first semiconductor area and a second semiconductor area, a semiconductor body area between the first semiconductor area and the second semiconductor area, and a gate arranged in a trench and separated from the semiconductor body by an insulation layer, wherein the trench has a top trench portion which extends from the semiconductor surface at least to a depth which is greater than a depth of the first semiconductor area, wherein the trench further has a bottom trench portion extending subsequent to the top trench portion at least up to the second semiconductor area, and wherein the top trench portion has a first lateral dimension and the bottom trench portion has a second lateral dimension which is greater than the first lateral dimension.

    摘要翻译: 公开了一种具有沟槽栅的半导体器件及其制造方法。 一个实施例包括第一半导体区域和第二半导体区域,第一半导体区域和第二半导体区域之间的半导体主体区域以及布置在沟槽中并且通过绝缘层与半导体本体分离的栅极,其中沟槽具有 至少从所述半导体表面延伸到比所述第一半导体区域的深度大的深度的顶部沟槽部分,其中所述沟槽还具有在所述顶部沟槽部分之后延伸的底部沟槽部分,所述顶部沟槽部分至少直到所述第二半导体 并且其中顶部沟槽部分具有第一横向尺寸,并且底部沟槽部分具有大于第一横向尺寸的第二横向尺寸。

    SEMICONDUCTOR DEVICE HAVING A TRENCH GATE AND METHOD FOR MANUFACTURING
    2.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A TRENCH GATE AND METHOD FOR MANUFACTURING 审中-公开
    具有TRENCH门的半导体器件和制造方法

    公开(公告)号:US20080179666A1

    公开(公告)日:2008-07-31

    申请号:US12019295

    申请日:2008-01-24

    IPC分类号: H01L29/78 H01L21/336

    摘要: A semiconductor device having a trench gate and method for manufacturing is disclosed. One embodiment includes a first semiconductor area and a second semiconductor area, a semiconductor body area between the first semiconductor area and the second semiconductor area, and a gate arranged in a trench and separated from the semiconductor body by an insulation layer, wherein the trench has a top trench portion which extends from the semiconductor surface at least to a depth which is greater than a depth of the first semiconductor area, wherein the trench further has a bottom trench portion extending subsequent to the top trench portion at least up to the second semiconductor area, and wherein the top trench portion has a first lateral dimension and the bottom trench portion has a second lateral dimension which is greater than the first lateral dimension.

    摘要翻译: 公开了一种具有沟槽栅的半导体器件及其制造方法。 一个实施例包括第一半导体区域和第二半导体区域,第一半导体区域和第二半导体区域之间的半导体主体区域以及布置在沟槽中并且通过绝缘层与半导体本体分离的栅极,其中沟槽具有 至少从所述半导体表面延伸到比所述第一半导体区域的深度大的深度的顶部沟槽部分,其中所述沟槽还具有在所述顶部沟槽部分之后延伸的底部沟槽部分,所述顶部沟槽部分至少直到所述第二半导体 并且其中顶部沟槽部分具有第一横向尺寸,并且底部沟槽部分具有大于第一横向尺寸的第二横向尺寸。

    Semiconductor device having a floating semiconductor zone
    3.
    发明授权
    Semiconductor device having a floating semiconductor zone 有权
    具有浮动半导体区的半导体器件

    公开(公告)号:US08482062B2

    公开(公告)日:2013-07-09

    申请号:US13610240

    申请日:2012-09-11

    IPC分类号: H01L29/66

    摘要: A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

    摘要翻译: 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁,主体区域包括邻近源极结构的沟道部分,并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处,并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽,并且具有位于半导体本体内比底体区域的底侧更深的底侧。

    Semiconductor device having a floating semiconductor zone
    4.
    发明授权
    Semiconductor device having a floating semiconductor zone 有权
    具有浮动半导体区的半导体器件

    公开(公告)号:US08264033B2

    公开(公告)日:2012-09-11

    申请号:US12506844

    申请日:2009-07-21

    IPC分类号: H01L29/66

    摘要: A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

    摘要翻译: 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁,主体区域包括邻近源极结构的沟道部分,并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处,并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽,并且具有位于半导体本体内比底体区域的底侧更深的底侧。

    SEMICONDUCTOR DEVICE HAVING A FLOATING SEMICONDUCTOR ZONE
    5.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A FLOATING SEMICONDUCTOR ZONE 有权
    具有浮动半导体区域的半导体器件

    公开(公告)号:US20130001640A1

    公开(公告)日:2013-01-03

    申请号:US13610240

    申请日:2012-09-11

    IPC分类号: H01L29/739

    摘要: A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

    摘要翻译: 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁,主体区域包括邻近源极结构的沟道部分,并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处,并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽,并且具有位于半导体本体内比底体区域的底侧更深的底侧。

    SEMICONDUCTOR DEVICE HAVING A FLOATING SEMICONDUCTOR ZONE
    6.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A FLOATING SEMICONDUCTOR ZONE 有权
    具有浮动半导体区域的半导体器件

    公开(公告)号:US20110018029A1

    公开(公告)日:2011-01-27

    申请号:US12506844

    申请日:2009-07-21

    IPC分类号: H01L29/739

    摘要: A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

    摘要翻译: 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁,主体区域包括邻近源极结构的沟道部分,并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处,并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽,并且具有位于半导体本体内比底体区域的底侧更深的底侧。

    Bipolar semiconductor device and manufacturing method

    公开(公告)号:US10566462B2

    公开(公告)日:2020-02-18

    申请号:US12512285

    申请日:2009-07-30

    IPC分类号: H01L29/861

    摘要: A bipolar semiconductor device and method are provided. One embodiment provides a bipolar semiconductor device including a first semiconductor region of a first conductivity type having a first doping concentration, a second semiconductor region of a second conductivity type forming a pn-junction with the first semiconductor region, and a plurality of third semiconductor regions of the first conductivity type at least partially arranged in the first semiconductor region and having a doping concentration which is higher than the first doping concentration. Each of the third semiconductor regions is provided with at least one respective junction termination structure.

    Reverse Conducting IGBT
    9.
    发明申请
    Reverse Conducting IGBT 审中-公开
    反向导通IGBT

    公开(公告)号:US20130341673A1

    公开(公告)日:2013-12-26

    申请号:US13529166

    申请日:2012-06-21

    IPC分类号: H01L29/739

    摘要: A semiconductor device includes a first emitter region of a first conductivity type, a second emitter region of a second conductivity type complementary to the first conductivity type, and a drift region of the second conductivity type arranged in a semiconductor body. The first and second emitter regions are arranged between the drift region and a first electrode and are each connected to the first electrode. A device cell of a cell region includes a body region of the first conductivity type adjoining the drift region, a source region of the second conductivity type adjoining the body region, and a gate electrode adjacent the body region and dielectrically insulated from the body region by a gate dielectric. A second electrode is electrically connected to the source region and the body region. A floating parasitic region of the first conductivity type is disposed outside the cell region.

    摘要翻译: 半导体器件包括第一导电类型的第一发射极区域,与第一导电类型互补的第二导电类型的第二发射极区域和布置在半导体本体中的第二导电类型的漂移区域。 第一和第二发射极区域布置在漂移区域和第一电极之间并且各自连接到第一电极。 单元区域的器件单元包括邻接漂移区的第一导电类型的主体区域,与身体区域邻接的第二导电类型的源极区域和与身体区域相邻并且与身体区域电介质绝缘的栅电极, 栅极电介质。 第二电极电连接到源区域和身体区域。 第一导电类型的浮置寄生区域设置在单元区域的外部。