公开(公告)号：US20100323099A1

公开(公告)日：2010-12-23

申请号：US12867112

申请日：2009-02-27

申请人： Christian Sparing ,  Dirk Tews ,  Norbert Luetzow ,  Martin Thoms

发明人： Christian Sparing ,  Dirk Tews ,  Norbert Luetzow ,  Martin Thoms

IPC分类号： H05K3/38 ,  C09D7/12

CPC分类号： H05K3/389 ,  C23C22/02 ,  C23C22/52 ,  C23F11/12 ,  C23F11/128 ,  C23F11/149 ,  C23F11/16 ,  C23F11/165 ,  C23F11/173 ,  H05K3/064 ,  H05K3/108 ,  H05K3/282 ,  H05K2203/12 ,  H05K2203/122 ,  H05K2203/124

摘要： To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N+(R3)(R4)—(CH2)a—N(H)—C(Y)—N(H)—(CH2)b—N+(R3)(R4)—R5}n2n X−, with R1, R2, R3, R4, R5, Y and X− being defined as claimed.

摘要翻译： 为了在不损害铜基极非常薄的同时确保抗蚀剂涂层，更具体地，可光致抗蚀剂涂层对铜基材的良好粘合性，用于处理铜基材的非蚀刻非抗蚀剂组合物是 所述组合物包含至少一种选自以下的粘合剂：（i）包含至少一个硫醇部分的杂环化合物和（ii）具有以下一般化学式的季铵聚合物：{N +（R3）（R4） - （ CH2）a-N（H）-C（Y）-N（H） - （CH2）b-N +（R3）（R4）-R5} n2n X-，其中R1，R2，R3，R4，R5，Y 和X-被定义为所要求保护的。

公开(公告)号：US08945298B2

公开(公告)日：2015-02-03

申请号：US12867112

申请日：2009-02-27

申请人： Christian Sparing ,  Dirk Tews ,  Norbert Luetzow ,  Martin Thoms

发明人： Christian Sparing ,  Dirk Tews ,  Norbert Luetzow ,  Martin Thoms

IPC分类号： H05K3/28 ,  C23C22/02 ,  C23C22/52 ,  C23F11/173 ,  C23F11/14 ,  C23F11/16 ,  H05K3/38 ,  C23F11/12 ,  H05K3/06 ,  H05K3/10

CPC分类号： H05K3/389 ,  C23C22/02 ,  C23C22/52 ,  C23F11/12 ,  C23F11/128 ,  C23F11/149 ,  C23F11/16 ,  C23F11/165 ,  C23F11/173 ,  H05K3/064 ,  H05K3/108 ,  H05K3/282 ,  H05K2203/12 ,  H05K2203/122 ,  H05K2203/124

摘要： To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N+(R3)(R4)—(CH2)a—N(H)—C(Y)—N(H)—(CH2)b—N+(R3)(R4)—R5}n 2n X−, with R1, R2, R3, R4, R5, Y and X− being defined as claimed.

摘要翻译： 为了在不损害铜基极非常薄的同时确保抗蚀剂涂层，更具体地，可光致抗蚀剂涂层对铜基材的良好粘合性，用于处理铜基材的非蚀刻非抗蚀剂组合物是 所述组合物包含至少一种选自以下的粘合剂：（i）包含至少一个硫醇部分的杂环化合物和（ii）具有以下一般化学式的季铵聚合物：{N +（R3）（R4） - （ CH2）a-N（H）-C（Y）-N（H） - （CH2）b-N +（R3）（R4）-R5} n 2n -X-，其中R1，R2，R3，R4，R5， Y和X被定义为所要求保护的。

公开(公告)号：US08758634B2

公开(公告)日：2014-06-24

申请号：US13634913

申请日：2010-05-26

申请人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

发明人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

IPC分类号： H01B13/00

CPC分类号： C23F1/18 ,  H05K3/28 ,  H05K3/383

摘要： Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm.

摘要翻译： 公开了一种用于印刷电路板制造过程中用于和应用所述铜或铜合金微蚀刻方法的组合物。 所述组合物包含铜盐，卤离子源，缓冲体系和苯并噻唑化合物作为蚀刻精炼机。 本发明的组合物和方法对于具有结构特征为＆amp;100μm的印刷电路板的制造特别有用。

公开(公告)号：US20130056438A1

公开(公告)日：2013-03-07

申请号：US13634913

申请日：2010-05-26

申请人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

发明人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

IPC分类号： C23F1/18 ,  H05K3/22 ,  C09K13/08 ,  C09K13/00 ,  C09K13/06

CPC分类号： C23F1/18 ,  H05K3/28 ,  H05K3/383

摘要： Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm.

摘要翻译： 公开了一种用于印刷电路板制造过程中用于和应用所述铜或铜合金微蚀刻方法的组合物。 所述组合物包含铜盐，卤离子源，缓冲体系和苯并噻唑化合物作为蚀刻精炼机。 本发明的组合物和方法对于具有结构特征为＆amp;100μm的印刷电路板的制造特别有用。

公开(公告)号：US20120118753A1

公开(公告)日：2012-05-17

申请号：US13260756

申请日：2010-03-30

申请人： Norbert Lützow ,  Christian Sparing ,  Dirk Tews ,  Martin Thoms

发明人： Norbert Lützow ,  Christian Sparing ,  Dirk Tews ,  Martin Thoms

IPC分类号： H05K3/46 ,  C25D5/02

CPC分类号： H05K3/205 ,  H05K2203/124

摘要： In order to be able to produce high density circuits on a dielectric substrate wherein the conductor lines of said circuit have a good adhesion to the dielectric substrate surface, a method is provided which comprises the following method steps: a) providing an auxiliary substrate having two sides, at least one of said sides having an electrically conductive surface; b) treating at least one of the at least one electrically conductive surface with at least one release layer forming compound, the at least one release layer forming compound being a heterocyclic compound having at least one thiol group, c) forming a patterned resist coating on at least one of said at least one electrically conductive surface which has been treated with said at least one release layer forming compound, the patterned resist coating having at least one resist opening thereby exposing the electrically conductive surface; d) forming an electrically conductive pattern in the at least one resist opening by electrodepositing a metal on the exposed electrically conductive surface; e) embedding each electrically conductive pattern into a dielectric material by forming a respective dielectric material layer on the respective side of the auxiliary substrate; and f) separating each dielectric material layer comprising the respective embedded electrically conductive pattern and the auxiliary substrate from each other.

摘要翻译： 为了能够在电介质基板上制造高密度电路，其中所述电路的导体线对电介质基板表面具有良好的粘附性，提供了一种方法，其包括以下方法步骤：a）提供具有两个 所述侧面中的至少一个具有导电表面; b）用至少一种释放层形成化合物处理所述至少一个导电表面中的至少一个，所述至少一种形成隔离层的化合物是具有至少一个硫醇基的杂环化合物，c）在 所述至少一个导电表面中的至少一个已经用所述至少一个释放层形成化合物处理，所述图案化抗蚀剂涂层具有至少一个抗蚀剂开口，从而暴露所述导电表面; d）通过在暴露的导电表面上电沉积金属，在所述至少一个抗蚀剂开口中形成导电图案; e）通过在辅助基板的相应侧上形成相应的介电材料层，将每个导电图案嵌入电介质材料中; 以及f）将包括相应的嵌入的导电图案和辅助基板的每个介电材料层彼此分离。

公开(公告)号：US08192636B2

公开(公告)日：2012-06-05

申请号：US12090990

申请日：2006-10-23

申请人： Dirk Tews ,  Christian Sparing

发明人： Dirk Tews ,  Christian Sparing

IPC分类号： H01L21/306 ,  C09K13/00

CPC分类号： H05K3/383 ,  C23F1/18 ,  C23F1/46 ,  C23F3/06 ,  C23G1/103 ,  H05K2203/0796 ,  H05K2203/124

摘要： The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.

摘要翻译： 本发明涉及一种用于处理铜或铜合金表面以紧密粘合到聚合物基材上的方法，例如在多层印刷电路板中发现的焊接掩模。 基板通常是半导体器件，引线框架或印刷电路板。

公开(公告)号：US20100035435A1

公开(公告)日：2010-02-11

申请号：US12090990

申请日：2006-10-23

申请人： Dirk Tews ,  Christian Sparing

发明人： Dirk Tews ,  Christian Sparing

IPC分类号： H01L21/306 ,  C09K13/00

CPC分类号： H05K3/383 ,  C23F1/18 ,  C23F1/46 ,  C23F3/06 ,  C23G1/103 ,  H05K2203/0796 ,  H05K2203/124

摘要： The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.

摘要翻译： 本发明涉及一种用于处理铜或铜合金表面以紧密粘合到聚合物基材上的方法，例如在多层印刷电路板中发现的焊接掩模。 基板通常是半导体器件，引线框架或印刷电路板。

公开(公告)号：US20050175780A1

公开(公告)日：2005-08-11

申请号：US10513250

申请日：2003-05-27

申请人： Christian Sparing ,  Hartmut Mahlkow

发明人： Christian Sparing ,  Hartmut Mahlkow

IPC分类号： C23C18/18 ,  C23C18/42 ,  C23F1/18 ,  H05K3/24 ,  B05D3/04 ,  B05D1/18 ,  C23C18/31

CPC分类号： C23C18/42 ,  C23C18/54 ,  H05K3/244

摘要： A processing solution and a method are used for producing solderable and bondable silver layers that properties of which are not degraded even after storing, with no anti-tarnishing compounds being utilized as contrasted with prior art solutions and methods. The acidic solution for silver deposition contains silver ions and at least one Cu(I) complexing agent, said Cu(I) complexing agent being selected from the group consisting of having the structure element (I).

摘要翻译： 处理溶液和方法用于生产可焊接和可粘合的银层，其性能即使在储存后也不会降解，与现有技术的溶液和方法不同，没有使用抗玷污化合物。 用于银沉积的酸性溶液含有银离子和至少一种Cu（I）络合剂，所述Cu（I）络合剂选自具有结构单元（I）的组。

公开(公告)号：US09504161B2

公开(公告)日：2016-11-22

申请号：US13884711

申请日：2011-10-24

申请人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

发明人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

IPC分类号： C23C22/48 ,  C23F1/18 ,  H05K3/00 ,  H05K3/38

CPC分类号： H05K3/383 ,  C23F1/18 ,  H05K3/00 ,  H05K2203/124

摘要： The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

摘要翻译： 本发明涉及一种用于预处理铜表面的方法，以及用于预处理铜表面以允许形成与塑料基底的紧密结合的方法。 所述溶液包括：a）过氧化氢，b）至少一种酸，和c）至少一种含氮五元杂环化合物，和d）另外至少一种含氮粘附促进化合物，所述化合物 包含或由其内的一个或多个氮原子与至少一个式（I）的残基连接的内酰胺，非季脂肪胺，酰胺和聚酰胺组成。

公开(公告)号：US20140076461A1

公开(公告)日：2014-03-20

申请号：US13884711

申请日：2011-10-24

申请人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

发明人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

IPC分类号： H05K3/00

CPC分类号： H05K3/383 ,  C23F1/18 ,  H05K3/00 ,  H05K2203/124

摘要： The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

摘要翻译： 本发明涉及一种用于预处理铜表面的方法，以及用于预处理铜表面以允许形成与塑料基底的紧密结合的方法。 所述溶液包括：a）过氧化氢，b）至少一种酸，和c）至少一种含氮五元杂环化合物，和d）另外至少一种含氮粘附促进化合物，所述化合物 包含或由其内的一个或多个氮原子与至少一个式（I）的残基连接的内酰胺，非季脂肪胺，酰胺和聚酰胺组成。