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1.发明申请Solution for etching copper surfaces and method of depositing metal on copper surfaces 审中-公开蚀刻铜表面的方法和在铜表面上沉积金属的方法公开(公告)号：US20060189141A1
公开(公告)日：2006-08-24
申请号：US10550829
申请日：2004-03-16
申请人： Hartmut Mahlkow , Christian Sparing
发明人： Hartmut Mahlkow , Christian Sparing
IPC分类号： H01L21/311 , B44C1/22 , C09K13/00 , C23F1/00 , B05D3/10
CPC分类号： C23C18/1844 , C23C18/31 , C23C18/50 , C23F1/18 , C23F3/06 , H01L2924/0002 , H05K3/244 , H05K3/383 , H01L2924/00
摘要： A solution for etching copper or a copper alloy for producing a copper surface having the brightest possible finish for a metallization that is to follow is described. The solution has a pH on the order of 4 or less and is free of sulfate ions. It comprises: a) at least one oxidizing agent selected from the group comprising hydrogen peroxide and peracids, b) at least one substance selected from the group comprising aromatic sulfonic acids and salts of the aromatic sulfonic acids and optionally c) at least one N-heterocyclic compound. Further a method for depositing metal onto the surface of copper or a copper alloy is described. Said method comprises the following method steps: a) contacting the surface with the solution in accordance with the invention and b) coating the surface with at least one metal. The solution and the method are especially suited in the production of electric circuit carriers, more specifically for semiconductor manufacturing.
摘要翻译： 描述了用于蚀刻铜或铜合金的方法，用于制造具有尽可能光亮的用于金属化的精加工的铜表面。 溶液的pH值在4以下，不含硫酸根离子。 它包括：a）至少一种选自过氧化氢和过酸的氧化剂，b）至少一种选自芳族磺酸和芳族磺酸盐的物质，以及任选的c）至少一种N- 杂环化合物。 另外描述了一种将金属沉积在铜或铜合金表面上的方法。 所述方法包括以下方法步骤：a）使表面与根据本发明的溶液接触，以及b）用至少一种金属涂覆表面。 该方案和方法特别适用于生产电路载体，更具体地说用于半导体制造。
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公开(公告)号：US06869637B2
公开(公告)日：2005-03-22
申请号：US10362087
申请日：2001-09-21
摘要： Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ ions.
摘要翻译： 改善印刷电路板上铜表面的可焊性的已知方法存在这样的缺点，即在金属表面形成不规则厚度的外层，这些层非常昂贵，或者用于制造它们的组分对环境有害。 此外，金属表面也适合于形成接合连接以及电接点。 为了克服这些问题，公开了一种浴和一种通过电荷交换反应在金属表面上进行化学镀银的方法，所述金属的表面比银，更特别地在铜上，比含有至少一个卤化银配合物的不贵， 任何Ag +离子还原剂。
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3.发明申请Acidic solution for silver deposition and method for silver layer deposition on metal surfaces 审中-公开用于银沉积的酸性溶液和在金属表面上沉积银层的方法公开(公告)号：US20050175780A1
公开(公告)日：2005-08-11
申请号：US10513250
申请日：2003-05-27
申请人： Christian Sparing , Hartmut Mahlkow
发明人： Christian Sparing , Hartmut Mahlkow
摘要： A processing solution and a method are used for producing solderable and bondable silver layers that properties of which are not degraded even after storing, with no anti-tarnishing compounds being utilized as contrasted with prior art solutions and methods. The acidic solution for silver deposition contains silver ions and at least one Cu(I) complexing agent, said Cu(I) complexing agent being selected from the group consisting of having the structure element (I).
摘要翻译： 处理溶液和方法用于生产可焊接和可粘合的银层，其性能即使在储存后也不会降解，与现有技术的溶液和方法不同，没有使用抗玷污化合物。 用于银沉积的酸性溶液含有银离子和至少一种Cu（I）络合剂，所述Cu（I）络合剂选自具有结构单元（I）的组。
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公开(公告)号：US4248632A
公开(公告)日：1981-02-03
申请号：US11847
申请日：1979-02-13
申请人： Hans J. Ehrich , Wolfgang Clauss , Hartmut Mahlkow
发明人： Hans J. Ehrich , Wolfgang Clauss , Hartmut Mahlkow
CPC分类号： C23C18/28 , C07F17/00 , C23C18/208 , C23C18/30
摘要： An activating agent for application to the unactivated surface of an organic polymer to prepare the surface for chemical metallization comprises an aqueous solution of (a) a water soluble metal salt of an inorganic acid, the metal being silver, gold, or a platinum group metal, and (b) an amount of a ligand-forming organic nitrogen compound sufficient to form a water soluble coordination complex with the metal salt, the solution having a pH between 2.2 and 7, the metal concentration being between about 0.1 and about 1 gram per liter.
摘要翻译： 用于施加到有机聚合物的未活化表面以制备用于化学金属化的表面的活化剂包括（a）无机酸的水溶性金属盐，金属是银，金或铂族金属的水溶液 ，和（b）一定量的配体形成有机氮化合物，足以与金属盐形成水溶性配位络合物，该溶液的pH值在2.2和7之间，金属浓度在约0.1至约1克/ 升。
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公开(公告)号：US5705219A
公开(公告)日：1998-01-06
申请号：US616110
申请日：1996-03-14
IPC分类号： B05D1/18 , B05D3/00 , B05D7/14 , C23C18/18 , C25D5/54 , H01B1/22 , H01B1/24 , H05K3/42 , B05D5/12 , B05D3/04 , B05D5/00 , C25D3/38
CPC分类号： C25D5/54 , B05D1/18 , B05D3/005 , C23C18/1893 , C23C18/2086 , C23C18/30 , H01B1/22 , H01B1/24 , H05K3/424 , B05D7/142 , H05K2201/0323 , H05K2203/122
摘要： A method for coating surfaces of a non-conductor with finely particulate solid particles by substrate-induced coagulation, including the steps of: contacting the non-conductor with a first solution containing a first polar solvent and at least one coagulation initiator comprising high molecular weight material; and, subsequently contacting the non-conductor with a dispersion which contains a second polar solvent and: a) finely particulate solid particles, b) at least one surfactant for preventing the sedimentation of the solid particles, and c) a salt, essentially free of tin ions, for selectively destabilizing the dispersion.
摘要翻译： 一种通过底物诱导的凝结来涂覆具有细颗粒固体颗粒的非导体表面的方法，包括以下步骤：使非导体与含有第一极性溶剂和至少一种包含高分子量的凝结引发剂的第一溶液接触 材料; 并且随后使非导体与包含第二极性溶剂的分散体接触，和：a）细颗粒固体颗粒，b）至少一种用于防止固体颗粒沉降的表面活性剂，和c）基本上不含 锡离子，用于选择性地使分散体失稳。
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公开(公告)号：US4966786A
公开(公告)日：1990-10-30
申请号：US231533
申请日：1988-08-11
摘要： A conditioning means for basis material for producing printing circuits is an alkaline solution of a halogen-free palladium salt and 2-aminopyridine.
摘要翻译： 用于生产印刷电路的基材的调理装置是无卤钯盐和2-氨基吡啶的碱溶液。
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公开(公告)号：US4517254A
公开(公告)日：1985-05-14
申请号：US449492
申请日：1982-12-13
CPC分类号： C23C18/22 , H05K3/381 , Y10S428/936 , Y10T428/12569 , Y10T428/1291 , Y10T428/31721
摘要： A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2-hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.
摘要翻译： 一种通过预处理聚酰亚胺和随后的活化以及如果需要的化学金属化，随后进行电镀金属沉积的聚酰亚胺的粘合金属化方法，其特征在于，聚酰亚胺用碱金属氢氧化物和有机氮水溶液预处理 化合物，例如选自N，N，N'，N'-四 - （2-羟丙基） - 乙二胺，乙二胺四乙酸和次氮基三乙酸的一种。 根据本发明金属化的塑料可用作成形部件，优选在电气工程和电子领域中。
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公开(公告)号：US4285991A
公开(公告)日：1981-08-25
申请号：US150174
申请日：1980-05-15
CPC分类号： H05K3/244 , H05K3/062 , H05K3/422 , H05K3/427 , H05K2201/0341 , H05K2201/0344 , H05K2201/09736 , H05K2203/0571 , H05K2203/1407 , H05K3/243 , H05K3/28 , Y10T29/49165
摘要： A method for producing printed circuits. An epoxy resin reinforced with glass fiber is used as basis material, coated with copper, drilled and activated. In one embodiment, the circuit diagram is applied after covering the non-desired regions with a resistance, by screen or photo printing. A nickel, cobalt, or nickel-cobalt layer is deposited onto the circuit, the circuit is covered with a solder prevention lacquer, then the eyes and bore holes are covered with copper. Alternatively, after pre-treatment and activation, all areas except the soldering eyes and bore holes are covered with resist, a nickel, cobalt or nickel-cobalt layer is applied, the circuit diagram is printed using a resist, and the eyes and bore hole are treated as above.
摘要翻译： 一种印刷电路的制造方法。 用玻璃纤维增强的环氧树脂用作基材，涂铜，钻孔和活化。 在一个实施例中，电路图在通过屏幕或照片打印覆盖不需要的区域之后被施加。 镍，钴或镍钴层沉积在电路上，电路用防焊漆覆盖，眼睛和钻孔被铜覆盖。 或者，在预处理和激活之后，除了焊接眼和钻孔之外的所有区域都被抗蚀剂覆盖，施加镍，钴或镍钴层，电路图使用抗蚀剂印刷，眼睛和钻孔 被视为如上。
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公开(公告)号：US07479305B2
公开(公告)日：2009-01-20
申请号：US10521085
申请日：2002-09-06
摘要： The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of silver in the second method step when the first metal is silver.
摘要翻译： 在印刷电路板上形成可焊接和可粘合层的问题是在进一步处理（安装电气部件）之前，表面在储存电路板之后变色，从而影响可焊性和粘合性。 为了克服这个问题，建议在第一种方法步骤中，在第二种方法步骤中，将沉积在铜上的第一种金属沉积到印刷电路板上，并在第二种方法步骤中沉积银，其条件是第一种金属沉积 当第一金属是银时，在第二方法步骤中银的速率最多的一半的速率。
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10.发明授权公开(公告)号：US06698648B2
公开(公告)日：2004-03-02
申请号：US09937363
申请日：2002-01-17
IPC分类号： B23K3102
CPC分类号： H05K3/243 , H05K2201/0391 , H05K2203/0361 , Y10T29/49144
摘要： Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit carriers provided as well as of corresponding circuit carriers.
摘要翻译： 用于在所选择的焊接区域中产生至少一个可焊接表面的工艺以及与提供的电路载体上的焊料区域以及相应的电路载体不同的功能区域中的至少一个功能表面。
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