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    Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
    1.
    发明申请
    Acidic solution for silver deposition and method for silver layer deposition on metal surfaces 审中-公开
    用于银沉积的酸性溶液和在金属表面上沉积银层的方法

    公开(公告)号：US20050175780A1

    公开(公告)日：2005-08-11

    申请号：US10513250

    申请日：2003-05-27

    申请人： Christian Sparing ,  Hartmut Mahlkow

    发明人： Christian Sparing ,  Hartmut Mahlkow

    IPC分类号： C23C18/18 ,  C23C18/42 ,  C23F1/18 ,  H05K3/24 ,  B05D3/04 ,  B05D1/18 ,  C23C18/31

    CPC分类号： C23C18/42 ,  C23C18/54 ,  H05K3/244

    摘要： A processing solution and a method are used for producing solderable and bondable silver layers that properties of which are not degraded even after storing, with no anti-tarnishing compounds being utilized as contrasted with prior art solutions and methods. The acidic solution for silver deposition contains silver ions and at least one Cu(I) complexing agent, said Cu(I) complexing agent being selected from the group consisting of having the structure element (I).

    摘要翻译： 处理溶液和方法用于生产可焊接和可粘合的银层，其性能即使在储存后也不会降解，与现有技术的溶液和方法不同，没有使用抗玷污化合物。 用于银沉积的酸性溶液含有银离子和至少一种Cu（I）络合剂，所述Cu（I）络合剂选自具有结构单元（I）的组。

    Solution for etching copper surfaces and method of depositing metal on copper surfaces
    2.
    发明申请
    Solution for etching copper surfaces and method of depositing metal on copper surfaces 审中-公开
    蚀刻铜表面的方法和在铜表面上沉积金属的方法

    公开(公告)号：US20060189141A1

    公开(公告)日：2006-08-24

    申请号：US10550829

    申请日：2004-03-16

    申请人： Hartmut Mahlkow ,  Christian Sparing

    发明人： Hartmut Mahlkow ,  Christian Sparing

    IPC分类号： H01L21/311 ,  B44C1/22 ,  C09K13/00 ,  C23F1/00 ,  B05D3/10

    CPC分类号： C23C18/1844 ,  C23C18/31 ,  C23C18/50 ,  C23F1/18 ,  C23F3/06 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/383 ,  H01L2924/00

    摘要： A solution for etching copper or a copper alloy for producing a copper surface having the brightest possible finish for a metallization that is to follow is described. The solution has a pH on the order of 4 or less and is free of sulfate ions. It comprises: a) at least one oxidizing agent selected from the group comprising hydrogen peroxide and peracids, b) at least one substance selected from the group comprising aromatic sulfonic acids and salts of the aromatic sulfonic acids and optionally c) at least one N-heterocyclic compound. Further a method for depositing metal onto the surface of copper or a copper alloy is described. Said method comprises the following method steps: a) contacting the surface with the solution in accordance with the invention and b) coating the surface with at least one metal. The solution and the method are especially suited in the production of electric circuit carriers, more specifically for semiconductor manufacturing.

    摘要翻译： 描述了用于蚀刻铜或铜合金的方法，用于制造具有尽可能光亮的用于金属化的精加工的铜表面。 溶液的pH值在4以下，不含硫酸根离子。 它包括：a）至少一种选自过氧化氢和过酸的氧化剂，b）至少一种选自芳族磺酸和芳族磺酸盐的物质，以及任选的c）至少一种N- 杂环化合物。 另外描述了一种将金属沉积在铜或铜合金表面上的方法。 所述方法包括以下方法步骤：a）使表面与根据本发明的溶液接触，以及b）用至少一种金属涂覆表面。 该方案和方法特别适用于生产电路载体，更具体地说用于半导体制造。

    Bath and method of electroless plating of silver on metal surfaces
    3.
    发明授权
    Bath and method of electroless plating of silver on metal surfaces 失效
    银和金属表面化学镀银的方法

    公开(公告)号：US06869637B2

    公开(公告)日：2005-03-22

    申请号：US10362087

    申请日：2001-09-21

    申请人： Carl Hutchinson ,  Hartmut Mahlkow ,  Christian Sparing

    发明人： Carl Hutchinson ,  Hartmut Mahlkow ,  Christian Sparing

    IPC分类号： C23C18/42 ,  H05K3/24 ,  B05D7/14 ,  B05D7/24 ,  C23C18/54

    CPC分类号： H05K3/244 ,  C23C18/42

    摘要： Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ ions.

    摘要翻译： 改善印刷电路板上铜表面的可焊性的已知方法存在这样的缺点，即在金属表面形成不规则厚度的外层，这些层非常昂贵，或者用于制造它们的组分对环境有害。 此外，金属表面也适合于形成接合连接以及电接点。 为了克服这些问题，公开了一种浴和一种通过电荷交换反应在金属表面上进行化学镀银的方法，所述金属的表面比银，更特别地在铜上，比含有至少一个卤化银配合物的不贵， 任何Ag +离子还原剂。

    Composition and method for micro etching of copper and copper alloys
    4.
    发明授权
    Composition and method for micro etching of copper and copper alloys 有权
    铜和铜合金微蚀刻的组成和方法

    公开(公告)号：US08758634B2

    公开(公告)日：2014-06-24

    申请号：US13634913

    申请日：2010-05-26

    申请人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

    发明人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

    IPC分类号： H01B13/00

    CPC分类号： C23F1/18 ,  H05K3/28 ,  H05K3/383

    摘要： Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm.

    摘要翻译： 公开了一种用于印刷电路板制造过程中用于和应用所述铜或铜合金微蚀刻方法的组合物。 所述组合物包含铜盐，卤离子源，缓冲体系和苯并噻唑化合物作为蚀刻精炼机。 本发明的组合物和方法对于具有结构特征为＆amp;100μm的印刷电路板的制造特别有用。

    COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
    9.
    发明申请
    COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS 有权
    铜和铜合金的微蚀刻的组合物和方法

    公开(公告)号：US20130056438A1

    公开(公告)日：2013-03-07

    申请号：US13634913

    申请日：2010-05-26

    申请人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

    发明人： Dirk Tews ,  Christian Sparing ,  Martin Thoms

    IPC分类号： C23F1/18 ,  H05K3/22 ,  C09K13/08 ,  C09K13/00 ,  C09K13/06

    CPC分类号： C23F1/18 ,  H05K3/28 ,  H05K3/383

    摘要： Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm.

    摘要翻译： 公开了一种用于印刷电路板制造过程中用于和应用所述铜或铜合金微蚀刻方法的组合物。 所述组合物包含铜盐，卤离子源，缓冲体系和苯并噻唑化合物作为蚀刻精炼机。 本发明的组合物和方法对于具有结构特征为＆amp;100μm的印刷电路板的制造特别有用。

    MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURE
    10.
    发明申请
    MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURE 审中-公开
    多层印刷电路板制造

    公开(公告)号：US20120037312A1

    公开(公告)日：2012-02-16

    申请号：US13265545

    申请日：2010-04-15

    申请人： Christian Sparing ,  Thomas Huelsmann ,  Patrick Brooks ,  Arno Clicque

    发明人： Christian Sparing ,  Thomas Huelsmann ,  Patrick Brooks ,  Arno Clicque

    IPC分类号： B32B37/14

    CPC分类号： H05K3/389 ,  H05K3/385 ,  H05K2201/2063 ,  H05K2203/0315

    摘要： The present invention relates to a process for manufacture of multilayer printed circuit boards and articles formed thereby, especially IC substrates. The inventive process utilizes in individual process steps inorganic silicates and organosilane bonding mixtures to provide adhesion between layers of copper and dielectric materials. Said process leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.

    摘要翻译： 本发明涉及用于制造由此形成的多层印刷电路板和制品的方法，特别是IC基板。 本发明的方法在单独的工艺步骤中利用无机硅酸盐和有机硅烷键合混合物来提供铜和电介质材料的层之间的粘附。 所述方法导致增强的粘合强度，改进的机械和热应力抗性以及多层印刷电路板和IC基片的耐湿性。