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公开(公告)号：US20090170262A1
公开(公告)日：2009-07-02
申请号：US12397905
申请日：2009-03-04
IPC分类号： H01L21/8239
CPC分类号： H01L27/115 , H01L27/11521 , Y10S438/926 , Y10S438/962
摘要： A virtual ground memory array (VGA) is formed by a storage layer over a substrate with a conductive layer over the storage layer. The conductive layer is opened according to a patterned photoresist layer. The openings are implanted to form source/drain lines in the substrate, then filled with a layer of dielectric material. Chemical mechanical polishing (CMP) is then performed until the top of the conductive layer is exposed. This leaves dielectric spacers over the source/drain lines and conductive material between the dielectric spacers. Word lines are then formed over the conductive material and the dielectric spacers. As an alternative, instead of using a conductive layer, a sacrificial layer is used that is removed after the CMP step. After removing the sacrificial portions, the word lines are formed. In both cases, dielectric spacers reduce gate/drain capacitance and the distance from substrate to gate is held constant across the channel.
摘要翻译： 虚拟接地存储器阵列（VGA）由存储层上的存储层形成在衬底上，在存储层上方具有导电层。 根据图案化的光致抗蚀剂层打开导电层。 注入开口以在衬底中形成源极/漏极线，然后填充一层电介质材料。 然后进行化学机械抛光（CMP），直到暴露导电层的顶部。 这使得源极/漏极线之间的电介质间隔物和电介质间隔物之间的导电材料留下。 然后在导电材料和电介质间隔物上形成字线。 作为替代，代替使用导电层，使用在CMP步骤之后去除的牺牲层。 在去除牺牲部分之后，形成字线。 在这两种情况下，介质间隔物减少了栅极/漏极电容，并且从衬底到栅极的距离在通道上保持恒定。
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公开(公告)号：US07518179B2
公开(公告)日：2009-04-14
申请号：US10961295
申请日：2004-10-08
IPC分类号： H01L27/108 , H01L29/94
CPC分类号： H01L27/115 , H01L27/11521 , Y10S438/926 , Y10S438/962
摘要： A virtual ground memory array (VGA) is formed by a storage layer over a substrate with a conductive layer over the storage layer. The conductive layer is opened according to a patterned photoresist layer. The openings are implanted to form source/drain lines in the substrate, then filled with a layer of dielectric material. Chemical mechanical polishing (CMP) is then performed until the top of the conductive layer is exposed. This leaves dielectric spacers over the source/drain lines and conductive material between the dielectric spacers. Word lines are then formed over the conductive material and the dielectric spacers. As an alternative, instead of using a conductive layer, a sacrificial layer is used that is removed after the CMP step. After removing the sacrificial portions, the word lines are formed. In both cases, dielectric spacers reduce gate/drain capacitance and the distance from substrate to gate is held constant across the channel.
摘要翻译： 虚拟接地存储器阵列（VGA）由存储层上的存储层形成在衬底上，在存储层上方具有导电层。 根据图案化的光致抗蚀剂层打开导电层。 注入开口以在衬底中形成源极/漏极线，然后填充一层电介质材料。 然后进行化学机械抛光（CMP），直到暴露导电层的顶部。 这使得源极/漏极线之间的电介质间隔物和电介质间隔物之间的导电材料留下。 然后在导电材料和电介质间隔物上形成字线。 作为替代，代替使用导电层，使用在CMP步骤之后去除的牺牲层。 在去除牺牲部分之后，形成字线。 在这两种情况下，介质间隔物减少了栅极/漏极电容，并且从衬底到栅极的距离在通道上保持恒定。
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3.发明授权Programming and erasing structure for a floating gate memory cell and method of making 有权浮动存储单元的编程和擦除结构及其制作方法公开(公告)号：US07745870B2
公开(公告)日：2010-06-29
申请号：US11626681
申请日：2007-01-24
IPC分类号： H01L29/76
CPC分类号： H01L27/11521 , H01L21/28273 , H01L27/115 , H01L29/42324
摘要： A floating gate memory cell has a floating gate in which there are two floating gate layers. The top layer is etched to provide a contour in the top layer while leaving the lower layer unchanged. The control gate follows the contour of the floating gate to increase capacitance therebetween. The two layers of the floating gate can be polysilicon separated by a very thin etch stop layer. This etch stop layer is thick enough to provide an etch stop during a polysilicon etch but preferably thin enough to be electrically transparent. Electrons are able to easily move between the two layers. Thus the etch of the top layer does not extend into the lower layer but the first and second layer have the electrical effect for the purposes of a floating gate of being a continuous conductive layer.
摘要翻译： 浮动栅极存储单元具有浮置栅极，其中存在两个浮置栅极层。 蚀刻顶层以在顶层中提供轮廓，同时保持下层不变。 控制栅极跟随浮动栅极的轮廓以增加它们之间的电容。 浮置栅极的两层可以是由非常薄的蚀刻停止层分离的多晶硅。 该蚀刻停止层足够厚以在多晶硅蚀刻期间提供蚀刻停止，但优选足够薄以使其具有电透明性。 电子能够容易地在两层之间移动。 因此，顶层的蚀刻不延伸到下层，但是为了作为连续导电层的浮动栅极的目的，第一和第二层具有电效应。
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4.发明授权Method of fabricating a storage device including decontinuous storage elements within and between trenches 有权制造包括槽内和沟槽之间的不连续存储元件的存储装置的方法公开(公告)号：US07592224B2
公开(公告)日：2009-09-22
申请号：US11393287
申请日：2006-03-30
IPC分类号： H01L21/336
CPC分类号： H01L27/115 , B82Y10/00 , G11C16/0458 , G11C2216/06 , H01L27/11521 , H01L29/42328 , H01L29/42332 , H01L29/42336 , H01L29/66825
摘要： A semiconductor storage cell includes a first source/drain region underlying a first trench defined in a semiconductor layer. A second source/drain region underlies a second trench in the semiconductor layer. A first select gate in the first trench and a second select gate in the second trench are lined by a select gate dielectric. A charge storage stack overlies the select gates and a control gate overlies the stack. The DSEs may comprise discreet accumulations of polysilicon. An upper surface of the first and second select gates is lower than an upper surface of the first and second trenches. The control gate may be a continuous control gate traversing and running perpendicular to the select gates. The cell may include contacts to the semiconductor layer. The control gate may include a first control gate overlying the first select gate and a second control gate overlying the second select gate.
摘要翻译： 半导体存储单元包括在半导体层中限定的第一沟槽下面的第一源极/漏极区域。 第二源极/漏极区域位于半导体层中的第二沟槽的下方。 第一沟槽中的第一选择栅极和第二沟槽中的第二选择栅极由选择栅极电介质排列。 电荷存储堆叠覆盖选择栅极，并且控制栅极覆盖堆叠。 DSE可以包括多晶硅的谨慎积累。 第一和第二选择栅极的上表面比第一和第二沟槽的上表面低。 控制栅极可以是垂直于选择栅极横穿并行进的连续控制栅极。 电池可以包括到半导体层的触点。 控制栅极可以包括覆盖第一选择栅极的第一控制栅极和覆盖第二选择栅极的第二控制栅极。
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5.发明授权公开(公告)号：US07285819B2
公开(公告)日：2007-10-23
申请号：US11188582
申请日：2005-07-25
IPC分类号： H01L29/788
CPC分类号： H01L29/7887 , B82Y10/00 , H01L21/28273 , H01L27/115 , H01L29/4232 , H01L29/42332 , H01L29/42336 , H01L29/66825 , H01L29/7923
摘要： An array of storage cells include a first source/drain region underlying a first trench defined in a semiconductor substrate and a second source/drain region underlying a second trench in the substrate. A charge storage stack lines each of the trenches where the charge storage stack includes a layer of discontinuous storage elements (DSEs). A control gate overlies the first trench. The control gate may run perpendicular to the trenches and traverse the first and second trenches. In another implementation, the control gate runs parallel with the trenches. The storage cell may include one or more diffusion regions occupying an upper surface of the substrate between the first and second trenches. The diffusion region may reside between first and second control gates that are parallel to the trenches. Alternatively, a pair of diffusion regions may occur on either side of a control gate that is perpendicular to the trenches.
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公开(公告)号：US20070020820A1
公开(公告)日：2007-01-25
申请号：US11188909
申请日：2005-07-25
IPC分类号： H01L21/8232
CPC分类号： H01L27/115 , B82Y10/00 , G11C16/0475 , H01L27/11519 , H01L27/11556 , H01L29/42328 , H01L29/42332 , H01L29/42336 , H01L29/7885 , Y10S977/707 , Y10S977/712
摘要： A process for forming an electronic device can include forming a first set of discontinuous storage elements over a primary surface of a substrate and forming a trench within the substrate. The process can also include forming a second set of discontinuous storage elements within the trench. The process can further include forming a first gate electrode within the trench, wherein a discontinuous storage element lies between the first gate electrode and a wall of the trench. The process can still further include removing a part of the second set of discontinuous storage elements and forming a second gate electrode over the first gate electrode. After forming the second gate electrode, substantially none of the second set of discontinuous storage elements lies along the wall of the trench at an elevation between an upper surface of the first gate electrode and the primary surface of the substrate.
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公开(公告)号：US20070018240A1
公开(公告)日：2007-01-25
申请号：US11188910
申请日：2005-07-25
IPC分类号： H01L29/94
CPC分类号： H01L29/7887 , B82Y10/00 , G11C16/0475 , H01L21/28273 , H01L27/115 , H01L27/11556 , H01L29/42328 , H01L29/42332 , H01L29/42336 , H01L29/66825 , Y10S977/707 , Y10S977/712
摘要： An electronic device can include a substrate having a trench that includes a wall and a bottom. The electronic device can also include a first set of discontinuous storage elements that overlie a primary surface of the substrate and a second set of discontinuous storage elements that lie within the trench. The electronic device can also include a first gate electrode, wherein substantially none of the discontinuous storage elements lies along the wall of the trench at an elevation between and upper surface of the first gate electrode and the primary surface of the substrate. The electronic device can also include a second gate electrode overlying the first gate electrode and the primary surface. In another embodiment, a conductive line can be electrically connected to one or more rows or columns of memory cells, and another conductive line can be more rows or more columns of memory cells.
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公开(公告)号：US06887758B2
公开(公告)日：2005-05-03
申请号：US10267153
申请日：2002-10-09
IPC分类号： H01L21/336 , H01L29/792 , H01L29/788
CPC分类号： H01L29/66825 , H01L29/66833 , H01L29/792
摘要： A semiconductor device (10) has a highly doped layer (26) having a first conductivity type uniformly implanted into the semiconductor substrate (20). An oxide-nitride-oxide structure (36, 38, 40) is formed over the semiconductor substrate (20). A halo region (46) having the first conductivity type is implanted at an angle in only a drain side of the oxide-nitride-oxide structure and extends under the oxide-nitride-oxide structure a predetermined distance from an edge of the oxide-nitride-oxide structure. A source (52) and drain (54) having a second conductivity type are implanted into the substrate (20). The resulting non-volatile memory cell provides a low natural threshold voltage to minimize threshold voltage drift during a read cycle. In addition, the use of the halo region (46) on the drain side allows a higher programming speed, and the highly doped layer (26) allows the use of a short channel device.
摘要翻译： 半导体器件（10）具有均匀地注入到半导体衬底（20）中的具有第一导电类型的高掺杂层（26）。 氧化物 - 氧化物 - 氧化物结构（36,38,40）形成在半导体衬底（20）上。 具有第一导电类型的卤素区域（46）以仅在氧化物 - 氧化物 - 氧化物结构的漏极侧的角度被注入，并且在氧化物 - 氮化物 - 氧化物结构之下延伸到氧化氮化物 - 氮化物的边缘的预定距离 氧化物结构。 具有第二导电类型的源极（52）和漏极（54）被注入衬底（20）中。 所得的非易失性存储单元提供低的自然阈值电压，以在读周期期间最小化阈值电压漂移。 此外，在漏极侧使用卤素区域（46）允许更高的编程速度，并且高掺杂层（26）允许使用短通道器件。
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9.发明授权Back-gated semiconductor device with a storage layer and methods for forming thereof 有权具有存储层的后门控半导体器件及其形成方法公开(公告)号：US07679125B2
公开(公告)日：2010-03-16
申请号：US11300077
申请日：2005-12-14
IPC分类号： H01L29/76
CPC分类号： H01L21/28273 , B82Y10/00 , H01L21/28282 , H01L21/84 , H01L27/1203 , H01L29/66825 , H01L29/66833 , H01L29/7887 , H01L29/7923
摘要： A method of making a semiconductor device includes providing a first wafer and providing a second wafer having a first side and a second side, the second wafer including a semiconductor substrate, a storage layer, and a layer of gate material. The storage layer may be located between the semiconductor structure and the layer of the gate material and the storage layer may be located closer to the first side of the second wafer than the semiconductor structure. The method further includes boding the first side of the second wafer to the first wafer. The method further includes removing a first portion of the semiconductor structure to leave a layer of the semiconductor structure after the bonding. The method further includes forming a transistor having a channel region, wherein at least a portion of the channel region is formed from the layer of the semiconductor structure.
摘要翻译： 制造半导体器件的方法包括提供第一晶片并提供具有第一侧和第二侧的第二晶片，所述第二晶片包括半导体衬底，存储层和栅极材料层。 存储层可以位于半导体结构和栅极材料层之间，并且存储层可以比半导体结构更靠近第二晶片的第一侧。 该方法还包括将第二晶片的第一侧布置到第一晶片。 该方法还包括去除半导体结构的第一部分以在结合之后留下半导体结构层。 该方法还包括形成具有沟道区的晶体管，其中沟道区的至少一部分由半导体结构的层形成。
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公开(公告)号：US07582929B2
公开(公告)日：2009-09-01
申请号：US11188999
申请日：2005-07-25
IPC分类号： H01L29/94
CPC分类号： H01L29/7887 , B82Y10/00 , H01L21/28273 , H01L27/115 , H01L27/11556 , H01L29/42328 , H01L29/42332 , H01L29/42336 , H01L29/66825
摘要： An electronic device can include discontinuous storage elements that lie within a trench. In one embodiment, the electronic device can include a substrate having a trench that includes a wall and a bottom. The electronic device can also include a portion of discontinuous storage elements that lie within the trench. The electronic device can also include a first gate electrode, wherein at least one discontinuous storage element lies along the wall of the trench at an elevation between and upper surface of the first gate electrode and a primary surface of the substrate. The electronic device can also include a second gate electrode overlying the first gate electrode and the primary surface of the substrate. In another embodiment, a conductive line can be electrically connected to one or more rows or columns of memory cells, and another conductive line can be more rows or more columns of memory cells.
摘要翻译： 电子设备可以包括位于沟槽内的不连续存储元件。 在一个实施例中，电子设备可以包括具有包括壁和底部的沟槽的衬底。 电子设备还可以包括位于沟槽内的不连续存储元件的一部分。 电子器件还可以包括第一栅电极，其中至少一个不连续存储元件沿着沟槽的壁位于第一栅电极的上表面和衬底的主表面之间的高度处。 电子器件还可以包括覆盖在第一栅电极和衬底的主表面上的第二栅电极。 在另一个实施例中，导线可以电连接到一个或多个存储单元的行或列，而另一个导线可以是更多行或更多列的存储单元。
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