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    LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES
    3.
    发明申请
    LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES 有权
    LED包装与具有平面表面的包装

    公开(公告)号：US20150194580A1

    公开(公告)日：2015-07-09

    申请号：US14661874

    申请日：2015-03-18

    申请人： CREE, INC.

    发明人： THEODORE LOWES ,  Eric Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

    IPC分类号： H01L33/54 ,  H01L33/60 ,  H01L33/50

    CPC分类号： H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.

    摘要翻译： 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装还可以包括具有一个或多个LED的底座以及一个或多个LED和底座上的毯子转换材料层。 密封剂可以在底座上，LED上方，并且在密封剂内部反射的光将到达转换材料，并将其全向吸收和发射。 这允许反射光现在从密封剂中逸出。 这允许例如当与具有半球密封剂或透镜的传统封装相比时，有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，使得在不同应用中使用封装更具灵活性。

    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES
    4.
    发明申请
    LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES 有权
    带多个元件的LED封装光源和具有平面表面的封装

    公开(公告)号：US20130328073A1

    公开(公告)日：2013-12-12

    申请号：US13649067

    申请日：2012-10-10

    申请人： CREE, INC.

    发明人： THEODORE LOWES ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

    IPC分类号： H01L33/50 ,  H01L33/54

    CPC分类号： H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

    摘要翻译： 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有发射不同颜色的光的多个LED的底座和LED和底座上的毯子转换材料层。 密封剂可以在基座上，LED上方，并且在密封剂内反射的光将到达转换材料以被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 LED封装可以具有更高的芯片面积与LED封装面积比。 通过使用具有平面表面的密封剂，LED封装在特征和LED封装比率之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

    LED package with encapsulant having planar surfaces
    5.
    发明授权
    LED package with encapsulant having planar surfaces 有权
    LED封装具有平坦表面的密封剂

    公开(公告)号：US09048396B2

    公开(公告)日：2015-06-02

    申请号：US13649052

    申请日：2012-10-10

    申请人： CREE, INC.

    发明人： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

    IPC分类号： F21V9/16 ,  H01L33/50 ,  H01L33/54 ,  F21V9/00

    CPC分类号： H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

    摘要翻译： 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。