公开(公告)号：US08231431B2

公开(公告)日：2012-07-31

申请号：US12358814

申请日：2009-01-23

申请人： Dhruv Gajaria ,  Zhiyong Li ,  Gopalakrishna B. Prabhu ,  Yacov Elgar ,  John Visitacion ,  Yong Liu ,  Jeffrey S. Sullivan ,  Salvador Umotoy ,  Tai T. Ngo ,  Michael Marriott ,  Peter Crundwell ,  Vinay Shah ,  Ho Gene Choi ,  Dennis C. Pierce

发明人： Dhruv Gajaria ,  Zhiyong Li ,  Gopalakrishna B. Prabhu ,  Yacov Elgar ,  John Visitacion ,  Yong Liu ,  Jeffrey S. Sullivan ,  Salvador Umotoy ,  Tai T. Ngo ,  Michael Marriott ,  Peter Crundwell ,  Vinay Shah ,  Ho Gene Choi ,  Dennis C. Pierce

IPC分类号： B24B49/00 ,  B24B7/06 ,  B24B53/21

CPC分类号： B24B9/10 ,  B24B49/045 ,  B24B55/02 ,  H01L21/67092 ,  H01L21/67715 ,  H01L21/67721 ,  H01L21/67727 ,  H01L31/186 ,  Y02E10/50 ,  Y02P70/521

摘要： The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.

摘要翻译： 本发明一般涉及位于自动太阳能电池生产线内的边缘删除模块。 边缘删除模块可以包括用于从太阳能电池装置的边缘区域去除材料并在去除材料之后清洁太阳能电池装置的边缘区域的砂轮装置。 边缘删除模块还可以包括研磨元件，其一部分被周期性地研磨成横向前进到研磨轮装置。 提供控制器来控制模块的各个面的操作和功能。

公开(公告)号：US20090221217A1

公开(公告)日：2009-09-03

申请号：US12358814

申请日：2009-01-23

申请人： DHRUV GAJARIA ,  Zhiyong Li ,  Gopalakrishna B. Prabhu ,  Yacov Elgar ,  John Visitacion ,  Yong Liu ,  Jeffrey S. Sullivan ,  Salvador Umotoy ,  Tai T. Ngo ,  Michael Marriott ,  Peter Crundwell ,  Vinay Shah ,  Ho Gene Choi ,  Dennis C. Pierce

发明人： DHRUV GAJARIA ,  Zhiyong Li ,  Gopalakrishna B. Prabhu ,  Yacov Elgar ,  John Visitacion ,  Yong Liu ,  Jeffrey S. Sullivan ,  Salvador Umotoy ,  Tai T. Ngo ,  Michael Marriott ,  Peter Crundwell ,  Vinay Shah ,  Ho Gene Choi ,  Dennis C. Pierce

IPC分类号： B24B1/00 ,  B24B19/02 ,  B24B41/02 ,  B24B53/007 ,  B24B55/06

CPC分类号： B24B9/10 ,  B24B49/045 ,  B24B55/02 ,  H01L21/67092 ,  H01L21/67715 ,  H01L21/67721 ,  H01L21/67727 ,  H01L31/186 ,  Y02E10/50 ,  Y02P70/521

摘要： The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.

摘要翻译： 本发明一般涉及位于自动太阳能电池生产线内的边缘删除模块。 边缘删除模块可以包括用于从太阳能电池装置的边缘区域去除材料并在去除材料之后清洁太阳能电池装置的边缘区域的砂轮装置。 边缘删除模块还可以包括研磨元件，其一部分被周期性地研磨成横向前进到研磨轮装置。 提供控制器来控制模块的各个面的操作和功能。

公开(公告)号：US08677929B2

公开(公告)日：2014-03-25

申请号：US13338173

申请日：2011-12-27

申请人： Alexander J. Berger ,  Terry Bluck ,  Vinay Shah ,  Judy Huang ,  Karthik Janakiraman ,  Chau T. Nguyen ,  Greg Stumbo

发明人： Alexander J. Berger ,  Terry Bluck ,  Vinay Shah ,  Judy Huang ,  Karthik Janakiraman ,  Chau T. Nguyen ,  Greg Stumbo

IPC分类号： B05C3/00 ,  B05C19/02 ,  B65G37/00 ,  B65G47/12 ,  H01L21/00 ,  H01L25/00 ,  B05D1/18

CPC分类号： H01L31/1876 ,  B05D1/322 ,  B05D1/327 ,  C23C14/042 ,  C23C16/042 ,  Y02E10/50 ,  Y02P70/521

摘要： Disclosed are methods and apparatus for masking of substrates for deposition, and subsequent lifting of the mask with deposited material. Masking materials are utilized that can be used in high temperatures and vacuum environment. The masking material has minimal outgassing once inside a vacuum chamber and withstand the temperatures during deposition process. The mask is inkjeted over the wafers and, after deposition, removed using agitation, such as ultrasonic agitation, or using laser burn off.

摘要翻译： 公开了用于掩蔽用于沉积的基底的方法和装置，以及随后用沉积材料提起掩模。 使用可在高温和真空环境中使用的遮蔽材料。 掩模材料一旦在真空室内就具有最小的除气，并能承受沉积过程中的温度。 将掩模喷涂在晶片上，并且在沉积之后，使用搅拌（例如超声波搅拌）或使用激光烧掉来除去掩模。

公开(公告)号：US20060182536A1

公开(公告)日：2006-08-17

申请号：US11315984

申请日：2005-12-22

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677

CPC分类号： H01L21/68707 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US20060182531A1

公开(公告)日：2006-08-17

申请号：US11154932

申请日：2005-06-16

申请人： Vinay Shah ,  Martin Elliott ,  Jeffrey Hudgens ,  Eric Englhardt

发明人： Vinay Shah ,  Martin Elliott ,  Jeffrey Hudgens ,  Eric Englhardt

IPC分类号： H01L21/677

CPC分类号： H01L21/67265 ,  H01L21/67379 ,  H01L21/67775 ,  Y10S414/135 ,  Y10S414/14

摘要： In at least one aspect, a system is provided that includes (1) a substrate carrier having first docking features; and (2) a loadport having second docking features. The second docking features are adapted to block docking of substrate carriers that do not include the first docking features and to allow docking of substrate carriers that include the first docking features. Numerous other aspects are provided.

公开(公告)号：US08207005B2

公开(公告)日：2012-06-26

申请号：US13042313

申请日：2011-03-07

申请人： Timothy W. Weidman ,  Rohit Mishra ,  Michael P. Stewart ,  Kapila P. Wijekoon ,  Yonghwa Chris Cha ,  Tristan Holtam ,  Vinay Shah

发明人： Timothy W. Weidman ,  Rohit Mishra ,  Michael P. Stewart ,  Kapila P. Wijekoon ,  Yonghwa Chris Cha ,  Tristan Holtam ,  Vinay Shah

IPC分类号： H01L21/00 ,  H01L21/76 ,  H01L21/331 ,  H01L21/20 ,  H01L33/00

CPC分类号： H01L21/67034 ,  G01T1/2018 ,  H01L21/225 ,  H01L21/306 ,  H01L21/308 ,  H01L21/67727 ,  H01L21/67736 ,  H01L21/67745 ,  H01L21/6776 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form the active doped region(s) and the metal contact structure of the solar cell device. In one embodiment, the methods include the steps of depositing a dielectric material that is used to define the boundaries of the active regions and/or contact structure of a solar cell device. Various techniques may be used to form the active regions of the solar cell and the metal contact structure.

摘要翻译： 本发明的实施例考虑使用新的方法形成高效太阳能电池，以形成太阳能电池器件的有源掺杂区域和金属接触结构。 在一个实施例中，所述方法包括沉积用于限定太阳能电池器件的有源区域和/或接触结构的边界的介电材料的步骤。 可以使用各种技术来形成太阳能电池的有源区域和金属接触结构。

公开(公告)号：US07720558B2

公开(公告)日：2010-05-18

申请号：US11220897

申请日：2005-09-06

申请人： Martin R. Elliott ,  Vinay Shah

发明人： Martin R. Elliott ,  Vinay Shah

IPC分类号： G06F19/00 ,  H01L21/677 ,  B65G1/133

CPC分类号： H01L21/67265

摘要： In a first aspect, a first method of mapping contents of a substrate carrier is provided. The first method includes the steps of (1) coupling a sensor to the substrate carrier or a loadport adapted to receive the substrate carrier; and (2) determining a presence or absence of a substrate in a slot of the substrate carrier using the sensor. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种映射衬底载体的内容的第一种方法。 第一种方法包括以下步骤：（1）将传感器耦合到衬底载体或适于接收衬底载体的负载端口; 和（2）使用传感器确定衬底载体的槽中是否存在衬底。 提供了许多其他方面。

公开(公告)号：US07611319B2

公开(公告)日：2009-11-03

申请号：US11154932

申请日：2005-06-16

申请人： Vinay Shah ,  Martin R. Elliott ,  Jeffrey C. Hudgens ,  Eric Andrew Englhardt

发明人： Vinay Shah ,  Martin R. Elliott ,  Jeffrey C. Hudgens ,  Eric Andrew Englhardt

IPC分类号： B65B69/00

CPC分类号： H01L21/67265 ,  H01L21/67379 ,  H01L21/67775 ,  Y10S414/135 ,  Y10S414/14

摘要： In at least one aspect, a system is provided that includes (1) a substrate carrier having first docking features; and (2) a loadport having second docking features. The second docking features are adapted to block docking of substrate carriers that do not include the first docking features and to allow docking of substrate carriers that include the first docking features. Numerous other aspects are provided.

摘要翻译： 在至少一个方面，提供了一种系统，其包括（1）具有第一对接特​​征的衬底载体; 和（2）具有第二对接特征的装载端口。 第二对接特征适于阻止不包括第一对接特​​征的衬底载体的对接并允许对接包括第一对接特​​征的衬底载体。 提供了许多其他方面。

公开(公告)号：US07577487B2

公开(公告)日：2009-08-18

申请号：US11521070

申请日：2006-09-13

申请人： Robert B. Lowrance ,  Eric Andrew Englhardt ,  Michael R. Rice ,  Vinay Shah ,  Sushant S. Koshti ,  Jeffrey C. Hudgens

发明人： Robert B. Lowrance ,  Eric Andrew Englhardt ,  Michael R. Rice ,  Vinay Shah ,  Sushant S. Koshti ,  Jeffrey C. Hudgens

IPC分类号： G06F19/00 ,  G06F7/00

CPC分类号： B65G47/52 ,  B65G29/00 ,  B65G47/28 ,  B65G2203/025 ,  H01L21/67706 ,  H01L21/67715 ,  Y10S414/135 ,  Y10S414/14

摘要： A band to band transfer module according to the present invention may be used with a substrate carrier transport system, or other systems, to transfer substrate carriers (e.g., small lot substrate carriers) from one conveyor to another conveyor or between two points on the same conveyor. The transfers (e.g., pick and place) of the substrate carriers may be made between conveyors traveling at different speeds. Numerous other aspects and features are disclosed.

摘要翻译： 根据本发明的带带传输模块可以与衬底载体传输系统或其他系统一起使用，以将衬底载体（例如，小批量衬底载体）从一个传送器转移到另一个传送器或在相同的两个点之间 输送带。 可以在以不同速度行进的输送机之间形成基板载体的传送（例如拾取和放置）。 公开了许多其他方面和特征。

公开(公告)号：US07374391B2

公开(公告)日：2008-05-20

申请号：US11315873

申请日：2005-12-22

申请人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： B25J15/00

CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。