摘要:
A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure. Chemical-mechanical polishing may then be used to planarize the conductive material.
摘要:
A method for creating a write element of a magnetic head according to one embodiment includes forming a first pole pedestal; forming a write gap layer above the first pole pedestal; forming a second pole pedestal above the write gap layer; and forming at least one of: a cap layer of CoFeON between the first pole pedestal and the write gap, and a seed layer of CoFeON between the write gap layer and the second pole pedestal. Note that other layers may be interspersed between those set forth here.
摘要:
During manufacture, a magnetoresistive sensor having a ferromagnetic free layer is commonly provided with a tantalum cap layer. The tantalum cap layer provides protection to the sensor during manufacture and then is typically removed after performing annealing. The removal of the tantalum cap with a fluorine reactive ion etch leaves low volatility tantalum/fluorine byproducts. The present invention provides a method of using an argon/hydrogen reactive ion etch to remove the tantalum/fluorine byproducts. The resulting sensor has far less damage resulting from the presence of the fluorine byproducts.
摘要:
The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.
摘要:
A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure. Chemical-mechanical polishing may then be used to planarize the conductive material.
摘要:
Methods of making a read head with improved contiguous junctions are described. After sensor layer materials are deposited over a substrate, a lift-off mask is formed over the sensor layer materials in a central region which is surrounded by end regions. Ion milling is performed with use of the lift-off mask such that the sensor layer materials in the end regions are removed and those in the central region remain to form a read sensor. A high-angle ion mill (e.g. between 45–80 degrees) is then performed to remove redeposited material from side walls of the lift-off mask. Next, a reactive ion etch (RIE) is used to reduce the thickness and the width of the lift-off mask and to remove capping layer materials from the top edges of the read sensor. With the reduced-size lift-off mask in place, hard bias and lead layers are deposited adjacent the read sensor as well as over the mask. The reduced-size lift-off mask allows the amount of hard bias to be increased in the contiguous junction region, and the edges of the leads to be deposited more closely over the top edges of the read sensor. Advantageously, the stability of the sensor is enhanced and the transfer curve is improved using a method which can be controlled independently from the initial mask structure and ion milling process. No critical alignments or multiple photoresist processes are necessary.
摘要:
Following the deposition of an insulation layer, a patterned P2 pole tip seed layer is deposited. Significantly, the pole tip seed layer is not deposited beneath the induction coil area of the magnetic head. A dielectric layer is next deposited and a patterned RIE etching mask that includes both a P2 pole tip trench opening and an induction coil trench opening is fabricated upon the dielectric layer. Thereafter, in a single RIE etching step, the P2 pole tip trench is etched through the dielectric material down to the seed layer, and the induction coil trench is etched through the dielectric material down to the insulation layer. The P2 pole tip is first electroplated up into its trench, an induction coil seed layer is next deposited, and the induction coil is then electroplated up into the induction coil trench.
摘要:
A magnetic structure, such as a pole tip, and method for forming the same includes forming a pole tip layer of magnetic material. A layer of polyimide precursor material is added above the pole tip layer and cured. A silicon-containing resist layer is added above the layer of polyimide precursor material and patterned. The resist layer is exposed to oxygen plasma for converting the resist into a glass-like material. Exposed portions of the cured polyimide precursor material are removed for exposing portions of the pole tip layer. The exposed portions of the pole tip layer are removed for forming a pole tip. Chemical mechanical polishing (CMP) can then be performed to remove any unwanted material remaining above the pole tip.
摘要:
The induction coil of the magnetic head of the present invention is fabricated in a patterned electrical insulation material, preferably utilizing reactive ion etch (RIE) techniques. The electrical insulation material is particularly patterned such that it is formed away from the ABS surface and in the location of the induction coil. A fill layer is deposited around the patterned electrical insulation material layer, such that the fill layer is disposed at the ABS surface. In a preferred embodiment, the patterned electrical insulation material is initially fabricated from hard baked photoresist and subsequent to the deposition of the fill layer the hard baked photoresist material is removed and replaced by SiO2. The SiO2 is thereby located away from the ABS surface and the induction coil is subsequently fabricated within the SiO2 material.
摘要:
A magnetic transducer including an electrically conductive shield (ECS) which is disposed between the substrate and first magnetic shield is described. The ECS is preferably embedded in an insulating undercoat layer. The ECS is preferably electrically isolated from the magnetic sensor element and is externally connected to a ground available in the disk drive through the arm electronics. Two alternative ways for connecting the ECS to a ground are described. In one embodiment which is only effective with single-ended input type arm electronics, the ECS is connected to a ground through a via to a lead pad for the read head which is connected to the ground of the arm electronics. In a second and more preferred embodiment a separate lead pad is included on the head to allow the ECS to be connected to electronic or case ground when the head is installed in the arm. The extent of the ECS should be sufficiently large to cover the read head portion of the transducer, i.e., from the edge of the first magnetic shield to the outer edges of the read contact pads, but should preferably not cover the write head pads.