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    Wafer based optical interconnect
    5.
    发明授权
    Wafer based optical interconnect 有权
    基于晶圆的光互连

    公开(公告)号：US07720337B2

    公开(公告)日：2010-05-18

    申请号：US12004541

    申请日：2007-12-20

    申请人： Daoqiang Lu ,  Henning Braunisch

    发明人： Daoqiang Lu ,  Henning Braunisch

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4231

    摘要： In general, in one aspect, a method includes forming conductive layers on a wafer. A through cavity is formed in alignment with the conductive layers. The through cavity is to permit an optical signal from an optical waveguide within an optical connector to pass therethrough. Alignment holes are formed on each side of the through cavity to receive alignment pins. The wafer having the conductive layers, the through cavity in alignment with the conductive layers, and the alignment holes on each side of the through cavity forms an optical-electrical (O/E) interface. An O/E converter is mounted to the metal layers in alignment with the through cavity. The alignment pins and the alignment holes are used to passively align the optical waveguide and the O/E converter.

    摘要翻译： 通常，一方面，一种方法包括在晶片上形成导电层。 形成与导电层对准的通孔。 通孔是允许光连接器内的光波导的光信号通过。 对准孔形成在通孔的每一侧以接收对准销。 具有导电层的晶片，与导电层对准的通孔和通孔的每一侧上的对准孔形成光电（O / E）界面。 O / E转换器安装到与通孔对准的金属层上。 对准引脚和对准孔用于被动对准光波导和O / E转换器。

    Optical package
    8.
    发明申请
    Optical package 失效
    光学包装

    公开(公告)号：US20060067609A1

    公开(公告)日：2006-03-30

    申请号：US10954903

    申请日：2004-09-30

    申请人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    发明人： Daoqiang Lu ,  Henning Braunisch ,  Gilroy Vandentop

    IPC分类号： G02B6/26 ,  G02B6/12 ,  G02B6/42

    CPC分类号： G02B6/1228 ,  G02B6/24 ,  G02B2006/12147

    摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.

    摘要翻译： 公开了光学封装。 在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导， 设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。 第一厚度可以大于第二厚度。 还公开了制造光学封装件的方法。 还公开了在光学封装上对准操作的装置和方法。