公开(公告)号：US20050177507A1

公开(公告)日：2005-08-11

申请号：US11028489

申请日：2004-12-30

申请人： David Bandych ,  John Marron ,  Mark Hoffmeyer ,  Michael Barnes ,  Tim Dawson ,  Paul Hanson

发明人： David Bandych ,  John Marron ,  Mark Hoffmeyer ,  Michael Barnes ,  Tim Dawson ,  Paul Hanson

IPC分类号： G06F17/60

CPC分类号： G06Q20/10 ,  G06Q20/102

摘要： A system and method is provided for processing transactions between at least one buying company and at least one selling company which results in the creation of a new collaborative data set. In one embodiment, the method comprises providing a central datastore accessible to users from the buying company and users from the selling company. Purchase order and invoice data are obtained and compared via a computer, to identify a matched record having purchase order data and corresponding invoice data. A collaborative data set in the central datastore is created, based in part on the matched record and storing in the datastore detailed settlement data regarding settlement of the matched record of purchase order data and corresponding invoice data. The method stores a complete settlement transaction history by providing for storage of additional settlement data in the central datastore, wherein credit memos, debit memos regarding the invoice, the purchase order of the matched record, and/or other documents related to the transaction are stored as part of the collaborative data set.

摘要翻译： 提供了一种用于处理至少一个购买公司和至少一个销售公司之间的交易的系统和方法，其导致创建新的协作数据集。 在一个实施例中，该方法包括提供来自购买公司的用户和销售公司的用户可访问的中央数据存储。 通过计算机获得采购订单和发票数据并进行比较，以识别具有采购订单数据和相应发票数据的匹配记录。 创建中央数据存储区中的协作数据集，部分基于匹配的记录，并存储数据存储区中关于结算采购订单数据和相应发票数据的匹配记录的详细结算数据。 该方法通过提供在中央数据存储区中存储附加结算数据来存储完整的结算交易历史，其中存储有关发票的借记凭单，与该交易有关的匹配记录的采购订单和/或其他文件 作为协作数据集的一部分。

公开(公告)号：US20130054421A1

公开(公告)日：2013-02-28

申请号：US13619986

申请日：2012-09-14

申请人： David W. Bandych ,  John T. Marron ,  Mark Hoffmeyer ,  Michael J. Barnes ,  Tim Dawson ,  Paul Hanson

发明人： David W. Bandych ,  John T. Marron ,  Mark Hoffmeyer ,  Michael J. Barnes ,  Tim Dawson ,  Paul Hanson

IPC分类号： G06Q30/06

CPC分类号： G06Q20/10 ,  G06Q20/102

摘要： A system and method are provided for processing transactions between at least one buying company and at least one selling company using a central datastore accessible to users from the buying company and selling company. Purchase order and invoice data are obtained and compared to identify a matched record having purchase order data and corresponding invoice data. A collaborative data set in the central datastore is created, based in part on the matched record and storing in the datastore detailed settlement data regarding settlement of the matched record of purchase order data and corresponding invoice data. A complete settlement transaction history is stored by providing for storage of additional settlement data in the central datastore, wherein credit memos, debit memos regarding the invoice, the purchase order of the matched record, and/or other documents related to the transaction are stored as part of the collaborative data set.

摘要翻译： 提供了一种系统和方法，用于处理至少一个购买公司和至少一个销售公司之间的交易，使用购买公司和销售公司的用户可以访问的中央数据存储区。 获取采购订单和发票数据并进行比较，以识别具有采购订单数据和相应发票数据的匹配记录。 创建中央数据存储区中的协作数据集，部分基于匹配的记录，并存储数据存储区中关于结算采购订单数据和相应发票数据的匹配记录的详细结算数据。 通过提供在中央数据存储中存储附加结算数据来存储完整的结算交易历史，其中贷方单据，关于发票的借记凭单，匹配记录的采购订单和/或与交易有关的其他文件被存储为 协作数据集的一部分。

公开(公告)号：US08326754B2

公开(公告)日：2012-12-04

申请号：US11028489

申请日：2004-12-30

申请人： David W. Bandych ,  John T. Marron ,  Mark Hoffmeyer ,  Michael J. Barnes ,  Tim Dawson ,  Paul Hanson

发明人： David W. Bandych ,  John T. Marron ,  Mark Hoffmeyer ,  Michael J. Barnes ,  Tim Dawson ,  Paul Hanson

IPC分类号： G06Q40/00 ,  G07B17/00

CPC分类号： G06Q20/10 ,  G06Q20/102

摘要： A system and method are provided for processing transactions between at least one buying company and at least one selling company using a central datastore accessible to users from the buying company and selling company. Purchase order and invoice data are obtained and compared to identify a matched record having purchase order data and corresponding invoice data. A collaborative data set in the central datastore is created, based in part on the matched record and storing in the datastore detailed settlement data regarding settlement of the matched record of purchase order data and corresponding invoice data. A complete settlement transaction history is stored by providing for storage of additional settlement data in the central datastore, wherein credit memos, debit memos regarding the invoice, the purchase order of the matched record, and/or other documents related to the transaction are stored as part of the collaborative data set.

摘要翻译： 提供了一种系统和方法，用于处理至少一个购买公司和至少一个销售公司之间的交易，使用购买公司和销售公司的用户可以访问的中央数据存储区。 获取采购订单和发票数据并进行比较，以识别具有采购订单数据和相应发票数据的匹配记录。 创建中央数据存储区中的协作数据集，部分基于匹配的记录，并存储数据存储区中关于结算采购订单数据和相应发票数据的匹配记录的详细结算数据。 通过提供在中央数据存储中存储附加结算数据来存储完整的结算交易历史，其中贷方单据，关于发票的借记凭证，匹配记录的采购订单和/或与交易有关的其他文件被存储为 协作数据集的一部分。

公开(公告)号：US20070145574A1

公开(公告)日：2007-06-28

申请号：US11316264

申请日：2005-12-22

申请人： John Colbert ,  Mark Hoffmeyer

发明人： John Colbert ,  Mark Hoffmeyer

IPC分类号： H01L21/48 ,  H01L23/34

CPC分类号： H01L23/3736 ,  H01L23/3672 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322

摘要： A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

摘要翻译： 提供了一种制造方法和一种具有焊料释放层的高性能可重复工作的散热器和封装结构。 散热器结构包括散热器底座。 所选择的热管或蒸气室中的一个以及多个平行翅片焊接到散热器基座。 将焊料释放层施加到散热器基座的外表面。 焊料释放层具有比用于将所选择的一个热管或蒸气室固定的每个焊料以及多个平行散热片连接到散热器基座的熔融温度范围更低的温度范围。 在施加焊料释放层之后，用选定的传热介质填充热管或蒸汽室。

公开(公告)号：US20070236895A1

公开(公告)日：2007-10-11

申请号：US11393140

申请日：2006-03-30

申请人： Gerald Bartley ,  Richard Ericson ,  Mark Hoffmeyer ,  Wesley Martin ,  Benjamin Mashak ,  Trevor Timpane ,  Ay Vang

发明人： Gerald Bartley ,  Richard Ericson ,  Mark Hoffmeyer ,  Wesley Martin ,  Benjamin Mashak ,  Trevor Timpane ,  Ay Vang

IPC分类号： H05K1/14

CPC分类号： H05K1/167 ,  H05K1/116 ,  H05K3/027 ,  H05K3/429 ,  H05K2203/171

摘要： A via resistor structure and method are provided for implementing a resistor and for trimming a resistance value of the resistor. A resistive material selectively is deposited adjacent to a pad connecting to a via where a resistor is to be defined. A trimmed path is formed in the resistive material for selectively changing the resistance value of the resistor.

摘要翻译： 提供了一种通过电阻器结构和方法来实现电阻器并且用于微调电阻器的电阻值。 电阻材料选择性地沉积在连接到要限定电阻器的通孔的焊盘附近。 在电阻材料中形成修整路径，用于选择性地改变电阻器的电阻值。

公开(公告)号：US20060288570A1

公开(公告)日：2006-12-28

申请号：US11512961

申请日：2006-08-31

申请人： Todd Cannon ,  William Csongradi ,  Benjamin Fox ,  Roger Gravrok ,  Mark Hoffmeyer ,  David Pease ,  Ryan Schlichting

发明人： Todd Cannon ,  William Csongradi ,  Benjamin Fox ,  Roger Gravrok ,  Mark Hoffmeyer ,  David Pease ,  Ryan Schlichting

IPC分类号： H05K3/36 ,  H05K1/00

CPC分类号： H05K1/024 ,  H01P3/088 ,  H05K3/222 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09736 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.

摘要翻译： 提供了一种用于实现可定制的电介质印刷电路卡迹线的方法和结构。 在选择的信号迹线附近定义空白。 然后用具有预定介电特性的电介质材料填充该空隙。 选择介电材料以改变所选择的信号迹线的至少一个预定的电性质，例如耦合，传播延迟和衰减。 在一个实施例中，印刷电路卡的外层包括多个信号迹线，并且包括多个匹配信号迹线的匹配电路卡层附接到印刷电路卡的外层以在所选择的信号迹线附近产生空腔 。 空腔填充有所选择的电介质材料。 在另一个实施例中，在印刷电路卡的外层上的信号迹线附近选择性地去除电介质材料，以在选定的信号迹线附近限定空隙。

公开(公告)号：US20080044949A1

公开(公告)日：2008-02-21

申请号：US11876095

申请日：2007-10-22

申请人： John Colbert ,  Mark Hoffmeyer

发明人： John Colbert ,  Mark Hoffmeyer

IPC分类号： H01L21/00

CPC分类号： H01L23/3736 ,  H01L23/3672 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322

摘要： A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

摘要翻译： 提供了一种制造方法和一种具有焊料释放层的高性能可重复工作的散热器和封装结构。 散热器结构包括散热器底座。 所选择的热管或蒸气室中的一个以及多个平行翅片焊接到散热器基座。 将焊料释放层施加到散热器基座的外表面。 焊料释放层具有比用于将所选择的一个热管或蒸气室固定的每个焊料以及多个平行散热片连接到散热器基座的熔融温度范围更低的温度范围。 在施加焊料释放层之后，用选定的传热介质填充热管或蒸汽室。

公开(公告)号：US20050241850A1

公开(公告)日：2005-11-03

申请号：US10835464

申请日：2004-04-29

申请人： Todd Cannon ,  William Csongradi ,  Benjamin Fox ,  Roger Gravrok ,  Mark Hoffmeyer ,  David Pease ,  Ryan Schlichting

发明人： Todd Cannon ,  William Csongradi ,  Benjamin Fox ,  Roger Gravrok ,  Mark Hoffmeyer ,  David Pease ,  Ryan Schlichting

IPC分类号： H01P3/08 ,  H01R12/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/22 ,  H05K3/46

CPC分类号： H05K1/024 ,  H01P3/088 ,  H05K3/222 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09736 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155

摘要： A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.

摘要翻译： 提供了一种用于实现可定制的电介质印刷电路卡迹线的方法和结构。 在选择的信号迹线附近定义空白。 然后用具有预定介电特性的电介质材料填充该空隙。 选择介电材料以改变所选择的信号迹线的至少一个预定的电性质，例如耦合，传播延迟和衰减。 在一个实施例中，印刷电路卡的外层包括多个信号迹线，并且包括多个匹配信号迹线的匹配电路卡层附接到印刷电路卡的外层以在所选择的信号迹线附近产生空腔 。 空腔填充有所选择的电介质材料。 在另一个实施例中，在印刷电路卡的外层上的信号迹线附近选择性地去除电介质材料，以在选定的信号迹线附近限定空隙。

公开(公告)号：US20050239347A1

公开(公告)日：2005-10-27

申请号：US11167662

申请日：2005-06-27

申请人： Bruce Chamberlin ,  Mark Hoffmeyer ,  Wai Ma ,  Arch Nuttall ,  James Stack

发明人： Bruce Chamberlin ,  Mark Hoffmeyer ,  Wai Ma ,  Arch Nuttall ,  James Stack

IPC分类号： H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42

CPC分类号： H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

摘要翻译： 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20070035937A1

公开(公告)日：2007-02-15

申请号：US11201972

申请日：2005-08-11

申请人： John Colbert ,  Eric Eckberg ,  Roger Hamilton ,  Mark Hoffmeyer ,  Amanda Mikhail ,  Arvind Sinha

发明人： John Colbert ,  Eric Eckberg ,  Roger Hamilton ,  Mark Hoffmeyer ,  Amanda Mikhail ,  Arvind Sinha

IPC分类号： H05K7/04 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。