AUTOMATIC CONTROL OF LASER DIODE CURRENT AND OPTICAL POWER OUTPUT
    1.
    发明申请
    AUTOMATIC CONTROL OF LASER DIODE CURRENT AND OPTICAL POWER OUTPUT 有权
    激光二极管电流和光功率输出的自动控制

    公开(公告)号:US20070114361A1

    公开(公告)日:2007-05-24

    申请号:US11626302

    申请日:2007-01-23

    IPC分类号: G01J1/32

    摘要: An automatic power control system provides a control signal that regulates the output power of at least one laser diode. Coarse adjustment of the control signal is provided by a first means, preferably a digital variable resistor, while fine adjustment and compensation is provided by a second means, preferably by a digital-to-analog converter that receives an input signal proportional to a sensed control system parameter. The control system includes an operational amplifier having a first input coupled to sense output power, and a second input coupled to a DAC to provide finer resolution control. Memory can store system parameter or system parameter variations that can be coupled to the DAC and/or variable resistor to enhance system stability over ambient variations.

    摘要翻译: 自动功率控制系统提供调节至少一个激光二极管的输出功率的控制信号。 控制信号的粗调是由第一装置,优选数字可变电阻器提供的,而微调和补偿由第二装置提供,优选地由接收与感测控制成正比的输入信号的数 - 模转换器 系统参数。 控制系统包括运算放大器,其具有耦合以感测输出功率的第一输入,以及耦合到DAC的第二输入以提供更精细的分辨率控制。 存储器可以存储可耦合到DAC和/或可变电阻器的系统参数或系统参数变化,以增强系统在环境变化方面的稳定性。

    Method and apparatus for processing electronic records for physical transactions
    2.
    发明申请
    Method and apparatus for processing electronic records for physical transactions 审中-公开
    用于处理物理交易的电子记录的方法和装置

    公开(公告)号:US20050198041A1

    公开(公告)日:2005-09-08

    申请号:US11109402

    申请日:2005-04-19

    IPC分类号: G06F17/30 G06Q10/06 G06Q40/00

    摘要: A method and apparatus for processing transactions. In particular, the mechanism of the present invention is used for processing information for physical transactions. A data structure is received at a customer data processing system for a physical transaction entered into by the customer. This information is extracted and used to update records or other information in the customer data processing system. Further, a second data structure is sent to a supplier of an item used in the physical transaction. This data structure is used by the supplier to update information maintained by the supplier about the item. After updating the information, the information is analyzed to generate statistics about physical transactions involving the item.

    摘要翻译: 一种处理交易的方法和装置。 特别地,本发明的机制用于处理物理交易的信息。 在客户数据处理系统处接收用于由客户输入的物理交易的数据结构。 该信息被提取并用于更新客户数据处理系统中的记录或其他信息。 此外,向物理交易中使用的物品的供应商发送第二数据结构。 该数据结构由供应商用来更新由供应商维护的关于该物品的信息。 更新信息后,分析信息以生成涉及物品的物理交易的统计信息。

    Method for making multi-layer ceramic acoustic transducer
    3.
    发明申请
    Method for making multi-layer ceramic acoustic transducer 失效
    制作多层陶瓷声换能器的方法

    公开(公告)号:US20050099096A1

    公开(公告)日:2005-05-12

    申请号:US10706820

    申请日:2003-11-11

    摘要: A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

    摘要翻译: 一种制造具有降低的总电阻抗的多层声学换能器的方法。 该方法基于将具有相对的金属化表面的两个压电陶瓷层与薄的电导体接合,然后将中间导体形成第二电极而将顶表面和底表面电连接以形成环绕电极。 由以这种方式连接的压电层组成的两层陶瓷堆叠的总电阻为相同尺寸的固体陶瓷元件的四分之一。 这提供了声堆叠阻抗与电缆的阻抗的更好匹配,用于在身体内成像的增加的穿透深度以及改善的声学元件灵敏度。

    Method of manufacturing ultrasound transducer device having acoustic backing
    4.
    发明申请
    Method of manufacturing ultrasound transducer device having acoustic backing 有权
    制造具有声学背衬的超声波换能器装置的方法

    公开(公告)号:US20050046311A1

    公开(公告)日:2005-03-03

    申请号:US10960871

    申请日:2004-10-06

    摘要: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译: 一种超声波换能器装置,包括:微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征,例如突片或凹口,用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄,以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配,以便防止在向后传播的任何声能的界面处的反射,即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Multi-layer ceramic acoustic transducer

    公开(公告)号:US20060117551A1

    公开(公告)日:2006-06-08

    申请号:US11340411

    申请日:2006-01-26

    IPC分类号: H01L41/18

    摘要: A method for manufacturing a multi-layer acoustic transducer with reduced total electrical impedance. The method is based on the bonding of two piezoelectric ceramic layers with confronting metallized surfaces to a thin electrical conductor, then electrically connecting the top and bottom surfaces to form a wrap-around electrode while a center conductor forms a second electrode. The total electrical impedance of a two-layer ceramic stack comprised of piezoelectric layers connected in this manner is one-fourth that of a solid ceramic element of the same size. This provides for better matching of the acoustic stack impedance to that of the electrical cable, increased penetration depth for imaging within the body, and improved acoustic element sensitivity.

    HIGH-DENSITY CONNECTION BETWEEN MULTIPLE CIRCUIT BOARDS
    6.
    发明申请
    HIGH-DENSITY CONNECTION BETWEEN MULTIPLE CIRCUIT BOARDS 有权
    多电路板之间的高密度连接

    公开(公告)号:US20050221633A1

    公开(公告)日:2005-10-06

    申请号:US10813945

    申请日:2004-03-30

    摘要: A high-density connection of multiple circuit boards having overlapping ends arranged in a stack. The metal traces on the stacked circuit boards are electrically connected by contact of the ends of the traces, which ends may be pads. The stacked circuit boards can be clamped, soldered or bonded together. Multiple circuit boards may be connected to a single circuit board. In one embodiment, double-sided circuit boards are stacked so that a first circuit board connects to a second circuit board through a third circuit board disposed intermediate the first and second circuit boards. The circuit boards may be flexible or rigid.

    摘要翻译: 具有重叠端的多个电路板的高密度连接被布置成堆叠。 层叠电路板上的金属迹线通过迹线端部的接触而电连接,该端部可以是焊盘。 堆叠电路板可以夹紧,焊接或粘合在一起。 多个电路板可以连接到单个电路板。 在一个实施例中,双面电路板被堆叠,使得第一电路板通过布置在第一和第二电路板之间的第三电路板连接到第二电路板。 电路板可以是柔性的或刚性的。

    Method and apparatus for processing electronic records for physical transactions

    公开(公告)号:US20050192856A1

    公开(公告)日:2005-09-01

    申请号:US11109445

    申请日:2005-04-19

    摘要: A method and apparatus for processing transactions. In particular, the mechanism of the present invention is used for processing information for physical transactions. A data structure is received at a customer data processing system for a physical transaction entered into by the customer. This information is extracted and used to update records or other information in the customer data processing system. Further, a second data structure is sent to a supplier of an item used in the physical transaction. This data structure is used by the supplier to update information maintained by the supplier about the item. After updating the information, the information is analyzed to generate statistics about physical transactions involving the item.

    Method for making multi-layer ceramic acoustic transducer
    8.
    发明申请
    Method for making multi-layer ceramic acoustic transducer 有权
    制作多层陶瓷声换能器的方法

    公开(公告)号:US20050099097A1

    公开(公告)日:2005-05-12

    申请号:US10706840

    申请日:2003-11-11

    摘要: Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers are electrically connected to form interdigitated electrodes. The total electrical impedance of a multi-layer stack comprised of piezoelectric layers connected in this manner is inversely related to the square of the number of layers in the stack. This provides for better matching of the acoustic stack impedance to that of the electrical cable and improved acoustic element sensitivity.

    摘要翻译: 制备具有降低的总电阻抗的多层声换能器的方法。 这些方法基于具有金属化表面的各个压电层的堆叠以形成其中金属层电连接以形成叉指电极的板。 由以这种方式连接的压电层组成的多层叠层的总电阻与叠层中层数的平方成反比。 这提供了声堆叠阻抗与电缆的阻抗更好的匹配以及改善的声学元件灵敏度。

    Electronic System With Lead Free Interconnections And Method of Fabrication
    10.
    发明申请
    Electronic System With Lead Free Interconnections And Method of Fabrication 审中-公开
    无铅互连电子系统及其制造方法

    公开(公告)号:US20080116552A1

    公开(公告)日:2008-05-22

    申请号:US11560867

    申请日:2006-11-17

    IPC分类号: H01L23/02

    摘要: An electronic system (1) having an interconnect structure (30, 45). In one embodiment a system (1) includes a first electronic device (2) with a first plurality of contact pads (15) each having a noble metal (18) formed along a first surface (19), and a second electronic device (3) with a second plurality of contact pads (29) each having a noble metal (18) formed along a first surface (19). The noble metal (18) of one of the contact pads (15) of the first device (2) is bonded to the noble metal (18) of one of the contact pads (29) of the second device (3). In one embodiment of an associated method of forming an interconnect structure (45), a first electronic device (2) is provided with a first plurality of contact pads (15) each having a noble metal (18) along a first surface (19), and a second electronic device (3) is provided with a plurality of contact pads (29) each having a noble metal (18) along a first surface (19). One or more of the contact pads (15) on the first device (2) is aligned with one or more of the contact pads (29) on the second device (3) to form pairs of pads (45) for electrical contact with one another. The first surface (19) of a contact pad (15) of the first device (2) is pressed against the first surface (19) of a contact pad (29) on the second device (3) to make contact between the two first surfaces (19).

    摘要翻译: 一种具有互连结构(30,45)的电子系统(1)。 在一个实施例中,系统(1)包括具有第一多个接触焊盘(15)的第一电子设备(2),每个接触焊盘具有沿着第一表面(19)形成的贵金属(18)和第二电子设备(3) )与具有沿着第一表面(19)形成的贵金属(18)的第二多个接触焊盘(29)连接。 第一装置(2)的接触焊盘(15)之一的贵金属(18)被接合到第二装置(3)的接触焊盘(29)之一的贵金属(18)上。 在形成互连结构(45)的相关联的方法的一个实施例中,第一电子器件(2)设置有第一多个接触焊盘(15),每个接触焊盘沿着第一表面(19)具有贵金属(18) ,并且第二电子设备(3)设置有多个接触焊盘(29),每个接触焊盘(29)沿着第一表面(19)具有贵金属(18)。 第一装置(2)上的接触焊盘(15)中的一个或多个与第二装置(3)上的一个或多个接触焊盘(29)对准以形成一对焊盘(45),用于与一个 另一个。 第一装置(2)的接触垫(15)的第一表面(19)被压靠在第二装置(3)上的接触垫(29)的第一表面(19)上,以使第一装置 表面(19)。