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公开(公告)号：US08659119B2
公开(公告)日：2014-02-25
申请号：US12783787
申请日：2010-05-20
申请人： Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
发明人： Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
IPC分类号： H01L27/01
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.
摘要翻译： 一种电子模块，包括具有至少一个结构的衬底，该结构减少了通过衬底的应力流动，其中所述结构包括在衬底的表面中的至少一个沟槽。
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公开(公告)号：US20100276784A1
公开(公告)日：2010-11-04
申请号：US12783787
申请日：2010-05-20
申请人： David Questad , Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Kharma , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： An electronic module including a substrate having at least one structure that reduces stress flow through the substrate, wherein the structure comprises at least one trench in a surface of the substrate.
摘要翻译： 一种电子模块，包括具有至少一个结构的衬底，所述结构减少了通过衬底的应力流动，其中所述结构包括在所述衬底的表面中的至少一个沟槽。
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公开(公告)号：US07777301B2
公开(公告)日：2010-08-17
申请号：US12099412
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US20080218990A1
公开(公告)日：2008-09-11
申请号：US12099381
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H05K7/00
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US07855430B2
公开(公告)日：2010-12-21
申请号：US12099381
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。
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公开(公告)号：US20080226875A1
公开(公告)日：2008-09-18
申请号：US12099412
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： B32B3/00
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。
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公开(公告)号：US20080205023A1
公开(公告)日：2008-08-28
申请号：US11679407
申请日：2007-02-27
申请人： Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
发明人： Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit , David Questad
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US07732894B2
公开(公告)日：2010-06-08
申请号：US12030274
申请日：2008-02-13
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US20080205024A1
公开(公告)日：2008-08-28
申请号：US12030260
申请日：2008-02-13
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H05K7/02
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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10.发明授权公开(公告)号：US08054630B2
公开(公告)日：2011-11-08
申请号：US12030260
申请日：2008-02-13
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muney , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H05K7/20
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要翻译： 将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。
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