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公开(公告)号：US5474798A
公开(公告)日：1995-12-12
申请号：US296706
申请日：1994-08-26
申请人： Gary B. Larson , Donna Kologe , Cynthia Retallick , Jon Bengston
发明人： Gary B. Larson , Donna Kologe , Cynthia Retallick , Jon Bengston
CPC分类号： H05K3/244 , H05K3/062 , H05K3/108 , H05K3/427 , H05K1/09 , H05K2201/0338 , H05K2201/0344 , H05K2201/0355 , H05K2203/0571 , H05K2203/072 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/422
摘要： The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.
摘要翻译： 本发明涉及印刷电路板的制造方法。 该方法考虑使用无电镀镍作为用于互连的主要介质，用于将电路构建为期望的厚度和作为抗蚀剂。 该方法在减少生产这些电路板当前所需的步骤和各种化学品的数量方面是特别通用的。
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公开(公告)号：US5431959A
公开(公告)日：1995-07-11
申请号：US296697
申请日：1994-08-26
申请人： Donna Kologe , Cynthia Retallick , Jon Bengston
发明人： Donna Kologe , Cynthia Retallick , Jon Bengston
CPC分类号： H05K3/24 , C23C18/1651 , C23C18/1834 , C23C18/1844
摘要： Disclosed is a composition and process useful in activating nickel-phosphorous surfaces for subsequent plating thereon. A combination of sulfuric acid and ammonium sulfate is utilized to render otherwise non-catalytic nickel-phosphorous surfaces catalytic to subsequent plating.
摘要翻译： 公开了一种组合物和方法，其用于活化镍 - 磷表面以用于其后的电镀。 利用硫酸和硫酸铵的组合来使非催化镍 - 磷表面催化以后续镀覆。
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3.发明授权公开(公告)号：US06837923B2
公开(公告)日：2005-01-04
申请号：US10431251
申请日：2003-05-07
申请人： David Crotty , Jon Bengston
发明人： David Crotty , Jon Bengston
CPC分类号： C23C18/36 , C08K5/435 , C08L27/18 , C08L71/02 , C08L83/12 , C08L2205/03 , C23C18/1662
摘要： A low viscosity silicone glycol surfactant together with glycerin is added to a polytetrafluoroethylene dispersion for use with an electroless nickel plating bath. The improved plating bath produces a stable PTFE dispersion that continues to work as the plating bath ages and that produces an electroless nickel deposit with greater than 20 percent by volume of PTFE in the deposit.
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公开(公告)号：US06692583B2
公开(公告)日：2004-02-17
申请号：US10076897
申请日：2002-02-14
申请人： Jon Bengston , Mark Wojtaszek , Gerald Wojcik , Massimo Dimarco
发明人： Jon Bengston , Mark Wojtaszek , Gerald Wojcik , Massimo Dimarco
IPC分类号： C23C2207
摘要： A conversion coating composition and a method of applying the conversion coating composition to magnesium and magnesium alloy articles prior to painting to prevent corrosion. The conversion coating composition comprises a source of vanadate ions, a material comprising phosphorus, and nitric acid or a source of nitrate ions. In addition, the composition may also contain boric acid or a source of borate ions and a source of fluoride ions or a source of fluoroborate ions.
摘要翻译： 转化涂料组合物以及在涂漆之前将转化涂料组合物施用于镁和镁合金制品以防止腐蚀的方法。 转化涂料组合物包含钒酸根离子源，包含磷和硝酸的材料或硝酸根离子源。 此外，组合物还可以含有硼酸或硼酸根离子源和氟离子源或氟硼酸根离子源。
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5.发明授权公开(公告)号：US06281090B1
公开(公告)日：2001-08-28
申请号：US09603978
申请日：2000-06-27
IPC分类号： H01L2348
CPC分类号： H01C17/18 , H01C17/065 , H01L24/05 , H01L2924/12042 , H05K1/167 , H05K3/064 , H05K3/184 , H05K3/381 , H05K2201/0344 , H05K2203/025 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1453 , H01L2924/00
摘要： A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.
摘要翻译： 揭示一个过程，其中电阻器可以通过将电阻器电镀到绝缘基板上而与印刷电路板一体制造。 作为用于提高电镀电阻器的均匀性和一致性的技术，揭示了通过电镀电阻器的蚀刻和氧化的绝缘基板的均匀化。
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公开(公告)号：US20050199587A1
公开(公告)日：2005-09-15
申请号：US10799018
申请日：2004-03-12
申请人： Jon Bengston
发明人： Jon Bengston
CPC分类号： C23C18/22 , C23C18/30 , H05K3/181 , H05K3/381 , H05K2203/0796 , H05K2203/1157
摘要： The invention comprises a process of preparing a non-conductive substrate for subsequent metalization. The process replaces the traditional chromic acid etching step with an etching solution comprising a permanganate and a mineral acid. The process also includes a novel activation solution comprising a palladium salt and an amine complexor. The new process of the invention is more environmentally friendly than the traditional chromic acid etching solutions but achieves a comparable result on most non-conductive substrates.
摘要翻译： 本发明包括制备用于随后金属化的不导电基底的方法。 该方法用包含高锰酸盐和无机酸的蚀刻溶液替代传统的铬酸蚀刻步骤。 该方法还包括包含钯盐和胺络合物的新型活化溶液。 本发明的新方法比传统的铬酸蚀刻溶液更环保，但在大多数非导电基材上获得可比的结果。
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公开(公告)号：US20050016416A1
公开(公告)日：2005-01-27
申请号：US10625435
申请日：2003-07-23
申请人： Jon Bengston
发明人： Jon Bengston
IPC分类号： C23C18/40
CPC分类号： C23C18/405
摘要： An improved electroless copper plating bath solution comprising a stabilizer selected from the group consisting of formate salts and formic acid. The addition of the formate salt or formic acid to the plating solution provides increased bath stability at the elevated operating conditions of the plating bath, preventing copper from spontaneously decomposing from the plating solution.
摘要翻译： 一种改进的无电镀铜浴溶液，其包含选自甲酸盐和甲酸的稳定剂。 向镀液中加入甲酸盐或甲酸可在镀浴的升高的操作条件下提高浴液稳定性，防止铜从电镀溶液中自发分解。
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8.发明授权Process for cleaning and defluxing parts, specifically electronic circuit assemblies 失效用于清洁和去焊零件的工艺，特别是电子电路组件
公开(公告)号：US5431739A
公开(公告)日：1995-07-11
申请号：US255249
申请日：1994-06-07
申请人： Jon Bengston
发明人： Jon Bengston
CPC分类号： H05K3/26 , C09D9/00 , C11D7/5022 , H05K2203/0783
摘要： The present invention relates to environmentally safe flux removing compositions specifically formulated for cleaning electronic circuit assemblies, such as printed circuit boards, during the fabrication thereof. Aryl alcohols, such as benzyl alcohol, are used to remove solder flux, oils and other contaminates from various substrates.
摘要翻译： 本发明涉及在其制造期间专门配制用于清洁电子电路组件（例如印刷电路板）的环境安全的助焊剂去除组合物。 芳基醇如苄醇用于从各种底物中除去焊剂，油和其他污染物。
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