摘要:
The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.
摘要:
Embodiments include apparatuses, methods, and systems including a dynamic polarization controller (DPC) to receive a first light beam and a second light beam, to adjust a rotation of a state of polarization (SOP) of the first light beam and the second light beam to generate a third light beam and a fourth light beam, under the control of a first control signal, a second control signal, and a third control signal. The first control signal may be related to a phase difference between the third light beam and the fourth light beam, the second control signal may be related to an intensity difference between the third light beam and the fourth light beam, and the third control signal may be related to a rotation of a SOP of the third light beam and the fourth light beam. Other embodiments may also be described and claimed.
摘要:
A liquid crystal display is disclosed. The liquid crystal display includes a liquid crystal display panel including a pixel array and touch sensors, a transparent conductive layer on one substrate of the liquid crystal display panel transmitting display light, a polarizing plate on the transparent conductive layer, a driving voltage supply circuit, and a signal transmitting unit electrically connecting the transparent conductive layer to the driving voltage supply circuit. A portion of the transparent conductive layer is connected to a ground level voltage source. The driving voltage supply circuit generates a driving voltage required to perform light sensing operations of the touch sensors during a touch period based on changes in an amount of surface charge of the transparent conductive layer depending on whether or not the polarizing plate is touched.
摘要:
An intake manifold assembly is disclosed that utilizes a barrel valve apparatus comprised of segments and connectors. The barrel valve apparatus and its housing component can be tapered and flexible. A protrusion such as a draft can be used to seal the performance of the barrel valve apparatus without a seal. Openings in the barrel valve apparatus can possess an integrated bellmouth shape.
摘要:
A camera shutter device and an optical apparatus having the same are disclosed. The shutter device includes a core wrapped by a coil, wherein a first distal end and a second distal end of the core are arranged in parallel, and when a voltage is applied to the coil, the first and second distal ends exhibit a mutually opposite polarity with respect to each other. A magnet is arranged with a side facing the first and second distal ends of the core for linearly and reciprocally moving between the first and second distal ends. In addition, a slider opens and closes a shutter blade as the magnet linearly and reciprocally moves. Thus, the driving unit of the core, magnet, and slider can be miniaturized and thinned, and a reciprocatively moving distance of a magnet can he minimally shortened to quicken the opening/shutting operation.
摘要:
A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.
摘要:
Disclosed is an anti-separating structure of a sensing magnet for EPS motor, the structure being a coupling structure between the sensing magnet and a plate of the EPS motor, the structure including a disk-shaped plate formed with a magnet accommodation unit protrusively formed near at a rotation shaft, a ring-shaped sensing magnet centrally formed with a through hole having a diameter corresponding to the magnet accommodation unit, and magnet grip units each formed at a predetermined gap along a circumferential surface of the magnet accommodation unit.
摘要:
A semiconductor test apparatus includes a pogo pin that is provided on a board and is in contact with an inspected object. The pogo pin includes a barrel fixedly disposed on the board, a plunger movably coupled to the barrel, and a conduction film covering the pogo pin. The conduction film contacts a portion of the plunger to be electrically connected to the plunger while being electrically insulated from the barrel.
摘要:
A modular heat exchanger assembly comprising: a plurality of interlocking housings each having a heat-exchanging element, a first and second side each having a mating connector and a first end and a second end, wherein the interlocking housings interlock to each other by the second side having a mating connector interlocking with the first side having a mating connector to provide a heat exchanger core, the first end has a plurality of first end mating connector openings and the second end has a plurality of second end mating connector openings; there may be at least one first-type end cap, at least one second-type end cap and/or at least one third-type end cap for connection to either one of the first end mating connector openings or one of the second end mating connector openings and there is at least one access opening.
摘要:
A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.