公开(公告)号：US20110042797A1

公开(公告)日：2011-02-24

申请号：US12857928

申请日：2010-08-17

申请人： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

发明人： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

IPC分类号： H01L23/00 ,  H01L23/488 ,  H01L23/498

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00

摘要： A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

摘要翻译： 半导体封装包括具有绝缘层的衬底。 绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。 半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。 第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

公开(公告)号：US08709879B2

公开(公告)日：2014-04-29

申请号：US13835683

申请日：2013-03-15

申请人： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

发明人： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00

摘要： A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

摘要翻译： 半导体封装包括具有绝缘层的衬底。 绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。 半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。 第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

公开(公告)号：US08426959B2

公开(公告)日：2013-04-23

申请号：US12857928

申请日：2010-08-17

申请人： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

发明人： Ji-hyun Park ,  Heungkyu Kwon ,  Min-Ok Na ,  Taehwan Kim

IPC分类号： H01L23/28

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00

摘要： A semiconductor package includes a substrate having an insulation layer. The insulation layer has a first region having a first surface roughness and a second region having a second surface roughness. A semiconductor chip is mounted in the first region, and an underfill resin solution is filled into the space between the semiconductor chip and the insulation layer. The roughness of the second region prevents the underfill resin from flowing out from the semiconductor chip to thereby reduce a size of the semiconductor package.

摘要翻译： 半导体封装包括具有绝缘层的衬底。 绝缘层具有第一表面粗糙度的第一区域和具有第二表面粗糙度的第二区域。 半导体芯片安装在第一区域中，底部填充树脂溶液填充到半导体芯片和绝缘层之间的空间中。 第二区域的粗糙度防止底部填充树脂从半导体芯片流出，从而减小半导体封装的尺寸。

公开(公告)号：US20090315840A1

公开(公告)日：2009-12-24

申请号：US12318422

申请日：2008-12-29

申请人： Changkeun Park ,  Suhwan Moon ,  Minkyung Lee ,  Deuksu Lee ,  Taehwan Kim ,  Miyoung Do ,  Kyohyuck Choo ,  Ilho Kim ,  Shinkwon Park

发明人： Changkeun Park ,  Suhwan Moon ,  Minkyung Lee ,  Deuksu Lee ,  Taehwan Kim ,  Miyoung Do ,  Kyohyuck Choo ,  Ilho Kim ,  Shinkwon Park

IPC分类号： G06F3/041

CPC分类号： G06F3/0412 ,  G02F1/13338 ,  G02F1/133528 ,  G06F3/042

摘要： A liquid crystal display is disclosed. The liquid crystal display includes a liquid crystal display panel including a pixel array and touch sensors, a transparent conductive layer on one substrate of the liquid crystal display panel transmitting display light, a polarizing plate on the transparent conductive layer, a driving voltage supply circuit, and a signal transmitting unit electrically connecting the transparent conductive layer to the driving voltage supply circuit. A portion of the transparent conductive layer is connected to a ground level voltage source. The driving voltage supply circuit generates a driving voltage required to perform light sensing operations of the touch sensors during a touch period based on changes in an amount of surface charge of the transparent conductive layer depending on whether or not the polarizing plate is touched.

摘要翻译： 公开了一种液晶显示器。 液晶显示器包括：液晶显示面板，包括像素阵列和触摸传感器，透明显示面板的液晶显示面板的一个基板上的透明导电层，透明导电层上的偏振片，驱动电压供给电路， 以及将透明导电层电连接到驱动电压电路的信号发送单元。 透明导电层的一部分连接到地电平电压源。 驱动电压供给电路根据是否触摸了偏振片，生成在触摸时段期间，根据透明导电层的表面电荷量的变化，进行触摸传感器的感光操作所需的驱动电压。

公开(公告)号：US08590501B1

公开(公告)日：2013-11-26

申请号：US12885590

申请日：2010-09-20

申请人： Taehwan Kim ,  Seunghyun Jang

发明人： Taehwan Kim ,  Seunghyun Jang

IPC分类号： F02M35/10

CPC分类号： F02B27/0284 ,  F02B27/0263 ,  F02D9/16 ,  Y02T10/146

摘要： An intake manifold assembly is disclosed that utilizes a barrel valve apparatus comprised of segments and connectors. The barrel valve apparatus and its housing component can be tapered and flexible. A protrusion such as a draft can be used to seal the performance of the barrel valve apparatus without a seal. Openings in the barrel valve apparatus can possess an integrated bellmouth shape.

摘要翻译： 公开了一种使用由段和连接器组成的桶式阀装置的进气歧管组件。 桶形阀装置及其壳体部件可以是锥形和柔性的。 可以使用诸如通风的突起来密封没有密封的桶形阀装置的性能。 桶形阀装置中的开口可以具有一体式的喇叭形状。

公开(公告)号：US20110206364A1

公开(公告)日：2011-08-25

申请号：US13031870

申请日：2011-02-22

申请人： Jinsuk Han ,  Seungki Kim ,  Taehwan Kim

发明人： Jinsuk Han ,  Seungki Kim ,  Taehwan Kim

IPC分类号： G03B9/14

CPC分类号： G03B9/14 ,  H02K33/16

摘要： A camera shutter device and an optical apparatus having the same are disclosed. The shutter device includes a core wrapped by a coil, wherein a first distal end and a second distal end of the core are arranged in parallel, and when a voltage is applied to the coil, the first and second distal ends exhibit a mutually opposite polarity with respect to each other. A magnet is arranged with a side facing the first and second distal ends of the core for linearly and reciprocally moving between the first and second distal ends. In addition, a slider opens and closes a shutter blade as the magnet linearly and reciprocally moves. Thus, the driving unit of the core, magnet, and slider can be miniaturized and thinned, and a reciprocatively moving distance of a magnet can he minimally shortened to quicken the opening/shutting operation.

摘要翻译： 公开了一种相机快门装置及具有该相机快门装置的光学装置。 快门装置包括由线圈包裹的芯，其中芯的第一远端和第二远端平行布置，并且当电压施加到线圈时，第一和第二远端呈现相互相反的极性 相对于彼此。 磁体被布置成具有面对芯的第一和第二远端的一侧，用于在第一和第二远端之间线性和往复运动。 此外，当磁体线性地并且往复移动时，滑块打开和关闭快门叶片。 因此，芯，磁体和滑块的驱动单元可以小型化和薄化，并且可以最小限度地缩短磁体的往复移动距离以加快打开/关闭操作。

公开(公告)号：US20210149115A1

公开(公告)日：2021-05-20

申请号：US17133347

申请日：2020-12-23

申请人： Duanni Huang ,  Saeed Fathololoumi ,  Meer Nazmus Sakib ,  Mohammad Montazeri Najafabadi ,  Chaoxuan Ma ,  David Hui ,  Taehwan Kim ,  Ling Liao ,  Hao Li ,  Ganesh Balamurugan ,  Haisheng Rong ,  Aliasghar Eftekhar

发明人： Duanni Huang ,  Saeed Fathololoumi ,  Meer Nazmus Sakib ,  Mohammad Montazeri Najafabadi ,  Chaoxuan Ma ,  David Hui ,  Taehwan Kim ,  Ling Liao ,  Hao Li ,  Ganesh Balamurugan ,  Haisheng Rong ,  Aliasghar Eftekhar

IPC分类号： G02B6/27 ,  G02B6/26

摘要： The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

公开(公告)号：US09843242B2

公开(公告)日：2017-12-12

申请号：US13552226

申请日：2012-07-18

申请人： Taehwan Kim ,  Shunghun Woo ,  Donggeun Chang ,  Byungyong Kim

发明人： Taehwan Kim ,  Shunghun Woo ,  Donggeun Chang ,  Byungyong Kim

IPC分类号： H02K11/00 ,  H02K11/215 ,  H02K29/08 ,  H02K1/28 ,  G01D5/20 ,  G01D5/14 ,  H02K11/21 ,  H02K5/22

CPC分类号： H02K11/215 ,  G01D5/142 ,  G01D5/20 ,  H02K1/28 ,  H02K5/22 ,  H02K5/225 ,  H02K11/21 ,  H02K29/08

摘要： Disclosed is an anti-separating structure of a sensing magnet for EPS motor, the structure being a coupling structure between the sensing magnet and a plate of the EPS motor, the structure including a disk-shaped plate formed with a magnet accommodation unit protrusively formed near at a rotation shaft, a ring-shaped sensing magnet centrally formed with a through hole having a diameter corresponding to the magnet accommodation unit, and magnet grip units each formed at a predetermined gap along a circumferential surface of the magnet accommodation unit.

公开(公告)号：US20160187381A1

公开(公告)日：2016-06-30

申请号：US14955545

申请日：2015-12-01

申请人： Sunghoon Jang ,  Minsuk Choi ,  Byungho Choi ,  Taehwan Kim

发明人： Sunghoon Jang ,  Minsuk Choi ,  Byungho Choi ,  Taehwan Kim

IPC分类号： G01R1/067

CPC分类号： G01R1/06722

摘要： A semiconductor test apparatus includes a pogo pin that is provided on a board and is in contact with an inspected object. The pogo pin includes a barrel fixedly disposed on the board, a plunger movably coupled to the barrel, and a conduction film covering the pogo pin. The conduction film contacts a portion of the plunger to be electrically connected to the plunger while being electrically insulated from the barrel.

摘要翻译： 半导体测试装置包括设置在板上并与检测对象接触的弹簧销。 弹簧销包括固定地设置在板上的筒，可移动地联接到筒的柱塞和覆盖弹簧销的导电膜。 导电膜接触柱塞的一部分以与柱塞电绝缘而与柱塞电连接。

公开(公告)号：US20140216698A1

公开(公告)日：2014-08-07

申请号：US14167282

申请日：2014-01-29

申请人： Donald Carbone ,  Timothy Collins ,  Jongkyu Kim ,  Taehwan Kim ,  Terry Schiefer ,  Douglas Sehr

发明人： Donald Carbone ,  Timothy Collins ,  Jongkyu Kim ,  Taehwan Kim ,  Terry Schiefer ,  Douglas Sehr

IPC分类号： F28F9/00

CPC分类号： F28D7/106 ,  F28D2021/0082

摘要： A modular heat exchanger assembly comprising: a plurality of interlocking housings each having a heat-exchanging element, a first and second side each having a mating connector and a first end and a second end, wherein the interlocking housings interlock to each other by the second side having a mating connector interlocking with the first side having a mating connector to provide a heat exchanger core, the first end has a plurality of first end mating connector openings and the second end has a plurality of second end mating connector openings; there may be at least one first-type end cap, at least one second-type end cap and/or at least one third-type end cap for connection to either one of the first end mating connector openings or one of the second end mating connector openings and there is at least one access opening.

摘要翻译： 一种模块化热交换器组件，包括：多个互锁壳体，每个互锁壳体具有热交换元件，第一和第二侧面各自具有配合连接器以及第一端部和第二端部，其中所述互锁壳体通过第二 具有与所述第一侧互锁的配合连接器，所述配合连接器具有配合连接器以提供热交换器芯，所述第一端具有多个第一端配合连接器开口，并且所述第二端具有多个第二端配合连接器开口; 可以存在至少一个第一类型端盖，至少一个第二类型端盖和/或至少一个第三类型端盖，用于连接到第一端配合连接器开口中的任一个或者第二端配合中的一个 连接器开口和至少一个进入开口。