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    Electroplating device
    1.
    发明授权
    Electroplating device 有权

    公开(公告)号：US10968530B2

    公开(公告)日：2021-04-06

    申请号：US16260153

    申请日：2019-01-29

    Applicant: EBARA CORPORATION

    Inventor： Mitsuhiro Shamoto ,  Tsutomu Nakada ,  Masashi Shimoyama

    IPC: C25D17/12 ,  H01L21/67 ,  H01L21/687 ,  C25D17/06 ,  C25D5/08 ,  C25D21/00 ,  C25D17/00

    Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.

    ELECTROLESS PLATING METHOD
    2.
    发明申请
    ELECTROLESS PLATING METHOD 审中-公开
    电镀法

    公开(公告)号：US20150267302A1

    公开(公告)日：2015-09-24

    申请号：US14658616

    申请日：2015-03-16

    Applicant: Ebara Corporation

    Inventor： Makoto Kubota ,  Akira Susaki ,  Masashi Shimoyama ,  Tsutomu Nakada

    IPC: C23C22/73

    CPC classification number: C23C18/1834 ,  C23C18/1619 ,  C23C18/1651 ,  C23C18/1664 ,  C23C18/1675 ,  C23C18/1676

    Abstract: An electroless plating method which can prevent stoppage of a plating reaction and a decrease in a plating rate is disclosed. This method includes: circulating a plating solution through a plating bath while heating the plating solution; immersing the substrate in the plating solution in the plating bath; forming a first electroless plating film on the substrate while circulating the plating solution at a first flow rate during a period from when the substrate is immersed in the plating solution until a predetermined time elapses; and forming a second electroless plating film on the first electroless plating film while circulating the plating solution at a second flow rate that is lower than the first flow rate after the predetermined time has elapsed.

    Abstract translation: 公开了一种能够防止电镀反应停止和电镀速度降低的无电镀方法。 该方法包括：在加热电镀溶液的同时使镀液循环通过电镀液; 将基板浸渍在电镀液中的电镀液中; 在从基板浸入电镀液中经过预定时间的期间以第一流量使电镀液循环，在基板上形成第一无电镀膜; 在第一化学镀膜上形成第二无电镀膜，同时在经过规定时间后以比第一流量低的第二流量使电镀液循环。

    Plating apparatus and plating method
    3.
    发明授权
    Plating apparatus and plating method 有权

    公开(公告)号：US10914019B2

    公开(公告)日：2021-02-09

    申请号：US16174103

    申请日：2018-10-29

    Applicant: EBARA CORPORATION

    Inventor： Shao Hua Chang ,  Yasuyuki Masuda ,  Jumpei Fujikata ,  Masashi Shimoyama ,  Tsutomu Nakada

    IPC: C25D21/10 ,  C25D17/00

    Abstract: A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.

    Plating apparatus, plating method, and substrate holder
    4.
    发明授权
    Plating apparatus, plating method, and substrate holder 有权

    公开(公告)号：US10513795B2

    公开(公告)日：2019-12-24

    申请号：US16396384

    申请日：2019-04-26

    Applicant: EBARA CORPORATION

    Inventor： Junko Mine ,  Tsutomu Nakada ,  Mitsutoshi Yahagi

    IPC: C25D21/12 ,  H01L23/00 ,  H01L21/687 ,  C25D5/18 ,  C25D17/06 ,  C25D17/00

    Abstract: In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

    PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS
    5.
    发明申请
    PLATING APPARATUS AND CLEANING DEVICE USED IN THE PLATING APPARATUS 审中-公开
    在镀膜设备中使用的镀膜装置和清洁装置

    公开(公告)号：US20150090584A1

    公开(公告)日：2015-04-02

    申请号：US14497520

    申请日：2014-09-26

    Applicant: Ebara Corporation

    Inventor： Yoshio Minami ,  Tsutomu Nakada

    IPC: C25D17/06 ,  C25D3/48 ,  C25D21/08

    CPC classification number: C25D17/06 ,  C25D3/48 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/02 ,  C25D21/08

    Abstract: A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.

    Abstract translation: 公开了一种用于电镀基板的电镀装置。 电镀装置包括：浸渍型电镀浴; 在其侧壁上具有孔的干式电镀浴; 以及按压机构，其构造成将基板保持件按压在所述干式电镀液的侧壁上以将所述基板保持在所述侧壁上以封闭所述孔。 衬底保持器包括基部构件和构造成将基板夹在其间的保持构件，被构造成密封基板和保持构件之间的间隙的第一密封部分，被构造成密封基底构件和基部构件之间的间隙的第二密封部分 以及构造成密封所述保持构件与所述干式电镀浴的侧壁之间的间隙的第三密封部。

    Plating apparatus, plating method, and substrate holder
    8.
    发明授权
    Plating apparatus, plating method, and substrate holder 有权

    公开(公告)号：US10316426B2

    公开(公告)日：2019-06-11

    申请号：US15248248

    申请日：2016-08-26

    Applicant: EBARA CORPORATION

    Inventor： Junko Mine ,  Tsutomu Nakada ,  Mitsutoshi Yahagi

    IPC: C25D5/18 ,  C25D17/00 ,  C25D17/06 ,  C25D21/12 ,  H01L23/00 ,  H01L21/687

    Abstract: In-plane uniformity of a film that is plated on a polygonal substrate is enhanced. An anode holder configured to hold an anode, a substrate holder configured to hold a polygonal substrate, a plating bath for accommodating the anode holder and the substrate holder, and dipping the anode and the substrate in a plating solution, and a control device for controlling a current that flows between the anode and the substrate are included. The substrate holder has a plurality of power feeding members that are disposed along respective sides of the polygonal substrate. The control device is configured to be able to control the current so that currents of at least two different values are simultaneously supplied to the plurality of power feeding members.

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