公开(公告)号：US11446784B2

公开(公告)日：2022-09-20

申请号：US16412562

申请日：2019-05-15

申请人： EBARA CORPORATION ,  FUJIMI INCORPORATED

发明人： Yu Ishii ,  Kenya Ito ,  Hitoshi Morinaga ,  Kazusei Tamai ,  Shingo Ohtsuki ,  Hiroshi Asano

IPC分类号： B24B9/06 ,  B24B5/04 ,  B24B19/08 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B9/10 ,  B24B5/36 ,  B24B37/10 ,  B24B37/24 ,  B24B37/30

摘要： The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

公开(公告)号：US20210354262A1

公开(公告)日：2021-11-18

申请号：US17319559

申请日：2021-05-13

申请人： EBARA CORPORATION

发明人： Hirotaka Satori ,  Yu Ishii ,  Toshifumi Kimba ,  Masaki Kinoshita

IPC分类号： B24B37/005 ,  B24B37/34 ,  B24B37/04

摘要： Provided is a technique capable of suppressing a shortage of a light amount of a reflected light from wiring patterns even when a film thickness of a film is thick. A film thickness measurement apparatus 30 is applicable to a polishing apparatus 10 for polishing a film 202 of a substrate 200. The film 202 includes a plurality of wiring patterns. The film thickness measurement apparatus 30 includes a light emitter 43 configured to project an emitted light L1 during polishing of the film by the polishing apparatus, an optical condenser 44 configured to condense the emitted light projected from the light emitter to provide a predetermined spot size D and project the light onto the film, and a light receiver 45 configured to receive a reflected light L2 reflected from the film. The predetermined spot size is smaller than a minimum width of respective wiring patterns constituting the plurality of wiring patterns.

公开(公告)号：US20210170541A1

公开(公告)日：2021-06-10

申请号：US17072870

申请日：2020-10-16

申请人： EBARA CORPORATION

发明人： Yu Ishii ,  Tetsuji Togawa ,  Atsushi Yoshida

IPC分类号： B24B37/005 ,  B24B49/16

摘要： A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.

公开(公告)号：US10651057B2

公开(公告)日：2020-05-12

申请号：US15583327

申请日：2017-05-01

申请人： EBARA CORPORATION

发明人： Kenichi Kobayashi ,  Yu Ishii ,  Keisuke Uchiyama

IPC分类号： H01L21/02 ,  H01L21/67 ,  B08B1/00 ,  H01L21/304 ,  B08B3/04 ,  B08B1/04

摘要： An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

公开(公告)号：US10376929B2

公开(公告)日：2019-08-13

申请号：US15647829

申请日：2017-07-12

申请人： EBARA CORPORATION

发明人： Yu Ishii ,  Masayuki Nakanishi ,  Keisuke Uchiyama

IPC分类号： B24B37/013 ,  B24B37/10 ,  B24B37/30 ,  B08B1/04 ,  B24B37/04 ,  H01L21/687 ,  H01L21/304 ,  H01L21/67 ,  B24B27/033 ,  B24B41/06 ,  B24B49/08 ,  B24D7/06 ,  B24B7/22

摘要： An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.

公开(公告)号：US10016875B2

公开(公告)日：2018-07-10

申请号：US15163064

申请日：2016-05-24

申请人： EBARA CORPORATION

发明人： Yu Ishii ,  Hiroyuki Kawasaki ,  Masayuki Nakanishi ,  Kenya Ito

IPC分类号： B24D11/00 ,  B05D5/02

CPC分类号： B24D11/003 ,  B05D5/02 ,  B24D11/00 ,  B24D11/001

摘要： A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

公开(公告)号：US09566616B2

公开(公告)日：2017-02-14

申请号：US14315283

申请日：2014-06-25

申请人： EBARA CORPORATION

发明人： Tetsuji Togawa ,  Kenya Ito ,  Yu Ishii ,  Keisuke Uchiyama

IPC分类号： B08B1/04 ,  H01L21/304 ,  H01L21/687 ,  B08B1/00 ,  H01L21/67

CPC分类号： B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

摘要： There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

摘要翻译： 公开了一种能够检测由流体支撑的诸如晶片的基板是否适当地存在于预定处理位置中的基板处理装置。 衬底处理装置包括至少一个距离传感器，其构造成测量洗涤器和静水支撑结构之间的距离; 以及处理控制器，被配置为从所述距离的测量值计算所述静液压支撑结构和所述基板的表面之间的间隙，并且确定所述间隙是否落在预定范围内。

公开(公告)号：US11139160B2

公开(公告)日：2021-10-05

申请号：US16184694

申请日：2018-11-08

申请人： EBARA CORPORATION

发明人： Yu Ishii ,  Keisuke Uchiyama

IPC分类号： B24B1/00 ,  B24B41/06 ,  H01L21/02 ,  B24B21/06 ,  H01L21/67 ,  B24B37/10 ,  B24B21/00 ,  B24B9/06 ,  H01L21/683 ,  H01L21/687

摘要： An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

公开(公告)号：US20210170543A1

公开(公告)日：2021-06-10

申请号：US17099571

申请日：2020-11-16

申请人： EBARA CORPORATION

发明人： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC分类号： B24B37/32 ,  H01L21/683

摘要： Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US20190262869A1

公开(公告)日：2019-08-29

申请号：US16405559

申请日：2019-05-07

申请人： EBARA CORPORATION ,  TOSHIBA MEMORY CORPORATION

发明人： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC分类号： B08B1/00 ,  H01L21/67 ,  H01L21/687

摘要： A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.