摘要:
A multiplicity of laser diodes aim laser light directly onto the surface of a workpiece and are disposed over and according to the to-be-shaped contour of a workpiece, so that a detector unit for determining the spatial shaping of the workpiece and an evaluation and control unit can determine process parameters for further illumination in dependence on a comparison of an actual state of shaping and a desired state of shaping of the workpiece.
摘要:
A device for plating two or more metal plates, strips, etc., by the absoron of laser energy. The device is fitted with beam-forming optics which form the laser radiation into a beam with a rectangular cross-section. The radiation source is a laser-diode array in which several laser diodes are disposed next to each other in the same plane to give bars which can be laid next to each other, as well as stacked one on top of each other, in any numbers. In order to homogenize the laser radiation produced by the array to give a rectangular cross-section, the device proposed is fitted with special optics such as a prism which converges in the shape of a wedge, a glass plate, with a rectangular cross-section, reflective boundary drives, etc. The rectangular cross-section beam heats the two surfaces of the metal plates being plated only locally, over limited areas and to small depths, to the plastic state. In addition, sensors and control devices for control of the power of the laser-diode array and/or for changing the speed of advance of the metal plates being plated may be used.
摘要:
The invention relates to a process for material treatment with diode radiation, especially laser diode radiation. To match the radiation profile to the treatment process, the process is so carried out that radiation emitted from a multiplicity of diodes is directed with a predetermined radiation profile upon the treated region of the workpiece and that a change in the intensity distribution in the radiation profile is effected by controlling the diode output power.
摘要:
The present invention relates to a device and a process using a laser beam to scan an area of an object, in particular, for selective laser melting of metal powder for fabrication of a mold. The device is provided with a plotter mechanic with two linear axes (4, 5) over which a carrier element can be positioned and moved, an optical means, which guides the laser beam to the carrier element or provides the laser beam at the carrier element, a scanning means (9) at the carrier element, which guides the laser beam to the area of the object and moves the laser beam back and forth in a presetable angle, a focusing optic (15) for focusing the laser beam (8) onto the area of the object (11). The plotter mechanic is disposed in such a manner that the plotter mechanic can position and move the carrier element at a distance over the area of the object (11), which distance permits the use of a focusing optic (15) of short focal length for focusing said laser beam to a diameter of
摘要:
In order to harden the surface of workpieces having complex shapes withoutreviously applying absorption promoting surface layers, a mixture of inert gas and oxygen are supplied to the processing zone while the workpiece is exposed to laser radiation. The degree of absorption is maximized by adjusting at least one of the mixing ratio, the volume flow rate, and the processing temperature to conform to a nominal value.
摘要:
A method for deposition of at least one electrically conducting film on a substrate, wherein the method includes the steps of: selecting a layer of a film material, wherein the layer includes a mask on a front side, and wherein the layer and the mask are one piece; positioning the front side of the layer upon the substrate; applying at least one laser pulse onto a back side of the layer, so as to melt and to vaporize at least parts of the layer such that melt droplets are propelled toward and deposited upon the substrate; and forming the film, wherein at least one slot of the mask limits the distribution of the melt droplets.
摘要:
The present invention relates to a method for smoothing and polishing surfaces by treating them with energetic radiation, in particular laser radiation, in which the to-be-smoothed surface is remelted in a first treatment step using said energetic radiation and employing first treatment parameters at least once down to a first remelting depth of approx. 5 to 100 μm, which is greater than a structural depth of the to-be-smoothed structures of said to-be-smoothed surface, wherein continuous radiation or pulsed radiation with a pulse duration of ≧100 μs is employed. The method makes it possible to automatically polish any three-dimensional surface fast and cost effective.
摘要:
The present invention relates to a method for smoothing and polishing surfaces by treating them with energetic radiation, in particular laser radiation, in which the to-be-smoothed surface (1) is remelted in a first treatment step using said energetic radiation (3) and employing first treatment parameters at least once down to a first remelting depth (10) of approx. 5 to 100 μm, which is greater than a structural depth of the to-be-smoothed structures of said to-be-smoothed surface (1), wherein continuous radiation or pulsed radiation (3) with a pulse duration of ≧100 μs is employed. The method makes it possible to automatically polisch any three-dimensional surface fast and cost effective.
摘要:
A method is disclosed for manufacturing a molded body, in accordance with three-dimensional CAD data of a model of a molded body, by depositing layers of a metallic material in powder form. Several layers of powder are successively deposited one on top of the other, whereby each layer of powder is heated to a specific temperature by means of a focused laser beam applied to a given area corresponding to a selected cross-sectional area of the model of the molded body, before deposition of the next layer. The laser beam is guided over each layer of powder in accordance with the CAD cross-sectional data of the selected cross-sectional area of the model in such a way that each layer of powder is fixed to the layer below it. The method is characterized in that the metallic material in powder form is applied in the form of a metallic powder free of binders and fluxing agents, that it is heated by the laser beam to melting temperature, that the energy of the laser beam is chosen in such a way that the layer of metallic powder is fully molten throughout at the point of impact of said laser beam, that the laser beam is guided across the specified area of powder in several runs in such a way that each run of the laser beam partly overlaps the preceding run, and that a protective gas atmosphere is maintained above the interaction zone of the laser beam and the metallic powder.
摘要:
The invention relates to a method for deposition of at least one electrically conducting film (20) on a substrate (30), comprising the steps: selecting a layer (10) of a film material, wherein the layer (10) comprises a mask (40) on a front side (11) and wherein the layer (10) and the mask (40) are one piece, positioning the front side (11) of the layer (10) upon the substrate (30), applying at least one laser pulse (120) onto a back side (12) of the layer (10), so as to melt and to vaporize at least parts of the layer (10) such that melt droplets (110) are propelled toward and deposited upon said substrate (30), forming the film (20), wherein at least one slot (45) of the mask (40) limits the distribution of said melt droplets (110).