Method and device for scanning the surface of an object with a laser beam
    1.
    发明授权
    Method and device for scanning the surface of an object with a laser beam 有权
    用激光束扫描物体表面的方法和装置

    公开(公告)号:US06534740B1

    公开(公告)日:2003-03-18

    申请号:US09762434

    申请日:2001-02-08

    IPC分类号: B23K2600

    摘要: The present invention relates to a device and a process using a laser beam to scan an area of an object, in particular, for selective laser melting of metal powder for fabrication of a mold. The device is provided with a plotter mechanic with two linear axes (4, 5) over which a carrier element can be positioned and moved, an optical means, which guides the laser beam to the carrier element or provides the laser beam at the carrier element, a scanning means (9) at the carrier element, which guides the laser beam to the area of the object and moves the laser beam back and forth in a presetable angle, a focusing optic (15) for focusing the laser beam (8) onto the area of the object (11). The plotter mechanic is disposed in such a manner that the plotter mechanic can position and move the carrier element at a distance over the area of the object (11), which distance permits the use of a focusing optic (15) of short focal length for focusing said laser beam to a diameter of

    摘要翻译: 本发明涉及一种使用激光束扫描物体区域的装置和方法,特别涉及用于制造模具的金属粉末的选择性激光熔化。 该装置设置有具有两个线性轴线(4,5)的绘图仪器,载体元件可以在该线性轴上定位和移动,光学装置将激光束引导到载体元件或在载体元件处提供激光束 ,在载体元件处的扫描装置(9),其将激光束引导到物体的区域并以可预设的角度来回移动激光束;用于聚焦激光束(8)的聚焦光学元件(15) 到物体(11)的区域上。 绘图机械师以这样的方式设置,使得绘图机械师可以在物体(11)的区域上定位和移动载体元件一定距离,该距离允许使用短焦距聚焦光学元件(15) 在所述物体(11)的区域中将所述激光束聚焦到直径<200μm的激光束。 该装置通过使用扫描仪结合了聚焦激光束的快速移动的优点,其优点是通过使用绘图仪来移动光束,处理场的尺寸与聚焦光学元件的焦距无关。

    Method for smoothing and polishing surfaces by treating them with energetic radiation
    3.
    发明申请
    Method for smoothing and polishing surfaces by treating them with energetic radiation 失效
    通过用能量辐射处理它们来平滑和抛光表面的方法

    公开(公告)号:US20060081573A1

    公开(公告)日:2006-04-20

    申请号:US10519146

    申请日:2003-06-24

    IPC分类号: B23K26/00

    CPC分类号: C21D1/09 B23K26/3576 B24B1/00

    摘要: The present invention relates to a method for smoothing and polishing surfaces by treating them with energetic radiation, in particular laser radiation, in which the to-be-smoothed surface (1) is remelted in a first treatment step using said energetic radiation (3) and employing first treatment parameters at least once down to a first remelting depth (10) of approx. 5 to 100 μm, which is greater than a structural depth of the to-be-smoothed structures of said to-be-smoothed surface (1), wherein continuous radiation or pulsed radiation (3) with a pulse duration of ≧100 μs is employed. The method makes it possible to automatically polisch any three-dimensional surface fast and cost effective.

    摘要翻译: 本发明涉及一种通过用能量辐射(特别是激光辐射)处理它们来平滑和抛光表面的方法,其中在第一处理步骤中使用所述能量辐射(3)重新熔化待平滑的表面(1) 并且使用至少一次到第一重熔深度(10)的第一处理参数。 其大于所述待平滑化表面(1)的待平滑结构的结构深度,其中脉冲持续时间≥100μs的连续辐射或脉冲辐射(3) 被雇用。 该方法使得可以快速,经济地自动地对三维表面进行绘制。

    Selective laser sintering at melting temperature
    4.
    发明授权
    Selective laser sintering at melting temperature 有权
    熔化温度下选择性激光烧结

    公开(公告)号:US06215093B1

    公开(公告)日:2001-04-10

    申请号:US09319132

    申请日:1999-07-12

    IPC分类号: B22F3105

    摘要: A method is disclosed for manufacturing a molded body, in accordance with three-dimensional CAD data of a model of a molded body, by depositing layers of a metallic material in powder form. Several layers of powder are successively deposited one on top of the other, whereby each layer of powder is heated to a specific temperature by means of a focused laser beam applied to a given area corresponding to a selected cross-sectional area of the model of the molded body, before deposition of the next layer. The laser beam is guided over each layer of powder in accordance with the CAD cross-sectional data of the selected cross-sectional area of the model in such a way that each layer of powder is fixed to the layer below it. The method is characterized in that the metallic material in powder form is applied in the form of a metallic powder free of binders and fluxing agents, that it is heated by the laser beam to melting temperature, that the energy of the laser beam is chosen in such a way that the layer of metallic powder is fully molten throughout at the point of impact of said laser beam, that the laser beam is guided across the specified area of powder in several runs in such a way that each run of the laser beam partly overlaps the preceding run, and that a protective gas atmosphere is maintained above the interaction zone of the laser beam and the metallic powder.

    摘要翻译: 公开了根据成型体模型的三维CAD数据,通过以粉末形式沉积金属材料层来制造成型体的方法。 将几层粉末依次沉积在另一层之上,由此通过施加到对应于所选择的模型的所选横截面积的给定区域的聚焦激光束将每层粉末加热到特定温度 成型体,在沉积下一层之前。 根据所选择的模型横截面积的CAD截面数据,激光束被引导到每一层粉末上,使得每层粉末固定在其下面的层中。 该方法的特征在于粉末形式的金属材料以不含粘合剂和助熔剂的金属粉末的形式施加,其被激光束加热至熔融温度,激光束的能量选择在 这样一种方式使得金属粉末层在所述激光束的冲击点处完全熔化,激光束以多次运行被引导穿过特定的粉末区域,使得激光束的每次运行部分地 与先前的运行重叠,并且在激光束和金属粉末的相互作用区域之上保持保护气体气氛。

    Laser diode array device for bonding metal plates
    5.
    发明授权
    Laser diode array device for bonding metal plates 失效
    用于接合金属板的激光二极管阵列器件

    公开(公告)号:US5886313A

    公开(公告)日:1999-03-23

    申请号:US793254

    申请日:1997-06-05

    摘要: A device for plating two or more metal plates, strips, etc., by the absoron of laser energy. The device is fitted with beam-forming optics which form the laser radiation into a beam with a rectangular cross-section. The radiation source is a laser-diode array in which several laser diodes are disposed next to each other in the same plane to give bars which can be laid next to each other, as well as stacked one on top of each other, in any numbers. In order to homogenize the laser radiation produced by the array to give a rectangular cross-section, the device proposed is fitted with special optics such as a prism which converges in the shape of a wedge, a glass plate, with a rectangular cross-section, reflective boundary drives, etc. The rectangular cross-section beam heats the two surfaces of the metal plates being plated only locally, over limited areas and to small depths, to the plastic state. In addition, sensors and control devices for control of the power of the laser-diode array and/or for changing the speed of advance of the metal plates being plated may be used.

    摘要翻译: PCT No.PCT / DE95 / 01126 Sec。 371日期:1997年6月5日 102(e)日期1997年6月5日PCT提交1995年8月21日PCT公布。 公开号WO96 / 05937 日期1996年2月29日用于通过吸收激光能量来镀覆两个或更多个金属板,条带等的装置。 该装置配有波束形成光学器件,其将激光辐射形成为具有矩形横截面的梁。 辐射源是激光二极管阵列,其中几个激光二极管在相同的平面中彼此相邻地设置,以产生彼此相邻放置的条,并且以任何数量彼此堆叠在一起 。 为了均匀化由阵列产生的激光辐射以产生矩形横截面,所提出的装置装配有特殊的光学器件,例如以楔形的形状收敛的棱镜,具有矩形横截面的玻璃板 ,反射边界驱动器等。矩形横截面光束将金属板的两个表面加热,仅在局部地限制区域和较小深度镀覆到塑料状态。 此外,可以使用用于控制激光二极管阵列的功率和/或用于改变被镀的金属板的前进速度的传感器和控制装置。

    Laser beam apparatus and workpiece machining process
    8.
    发明授权
    Laser beam apparatus and workpiece machining process 失效
    激光束设备和工件加工过程

    公开(公告)号:US06114651A

    公开(公告)日:2000-09-05

    申请号:US980089

    申请日:1997-11-26

    摘要: A laser beam apparatus for the removal of surface layers from work pieces with a beam-emitting head that may be guided by hand and that is equipped with focusing optics, which is connected to laser apparatus that generates a laser beam so as to admit light, which exhibits a beam-deflecting direction that moves on a pre-determined pathway in an oscillating manner, which covers the laser beam radially with a point and releases it through an emission opening that faces the work piece, and which has a distance retainer that permits the adjustment of the distance of the beam-emitting head from the work piece. In order to achieve the possibility of its use under freehand guidance with great mean power outputs in the course of which acceptable area coverage rates, or rather processing times are to be rendered possible, the laser beam apparatus is embodied in such a way that the distance retainer is the point of the beam-emitting head that covers the laser beam radially, that the laser beam may be oscillated by the beam deflection apparatus on a pre-determined pathway by means of an exit opening of the distance retainer that has been adapted to the pathway, and that the focusing optics can alter the focusing of the laser beam depending upon the beam deflection in the sense of a focus that lies on the surface of the work piece.

    摘要翻译: PCT No.PCT / DE96 / 00941 Sec。 371日期:1997年11月26日 102(e)日期1997年11月26日PCT提交1996年5月30日PCT公布。 出版物WO96 / 38257 日期:1996年12月5日一种激光束装置,用于通过手动引导的具有射束头的工件排除表面层,并配有聚焦光学元件,该聚焦光学元件连接到产生激光束的激光装置 以承认光,其呈现以预定路径以振荡方式移动的光束偏转方向,其以一定点径向覆盖激光束并将其通过面向工件的发射开口释放,并且具有 距离保持器,其允许调节光束发射头与工件的距离。 为了实现其在可接受的区域覆盖率或更多的处理时间成为可能的过程中以大的平均功率输出的手绘引导下的使用的可能性,激光束装置被实现为使得距离 保持器是径向覆盖激光束的光束发射头的点,激光束可以通过距离保持器的出口开口由光束偏转装置摆动在预定的路径上, 路径,并且聚焦光学器件可以改变激光束的聚焦,这取决于位于工件表面上的焦点的光束偏转。

    Process for treatment of materials with diode radiation
    9.
    发明授权
    Process for treatment of materials with diode radiation 失效
    用二极管辐射处理材料的工艺

    公开(公告)号:US5705788A

    公开(公告)日:1998-01-06

    申请号:US557070

    申请日:1995-11-17

    摘要: The invention relates to a process for material treatment with diode radiation, especially laser diode radiation. To match the radiation profile to the treatment process, the process is so carried out that radiation emitted from a multiplicity of diodes is directed with a predetermined radiation profile upon the treated region of the workpiece and that a change in the intensity distribution in the radiation profile is effected by controlling the diode output power.

    摘要翻译: PCT No.PCT / EP94 / 00706 Sec。 371日期:1995年11月17日 102(e)日期1995年11月17日PCT 1994年3月8日PCT公布。 第WO94 / 26459号公报 日期:1994年11月24日本发明涉及一种二极管辐射材料处理方法,特别是激光二极管辐射。 为了使辐射轮廓与处理过程相匹配,进行这样的处理,即从多个二极管发射的辐射以预定的辐射轮廓指向被处理的工件的区域,并且辐射剖面中的强度分布的变化 通过控制二极管输出功率来实现。