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    Efficiently virtualizing multiple network attached stores
    1.
    发明申请
    Efficiently virtualizing multiple network attached stores 审中-公开
    有效地虚拟化多个网络连接的商店

    公开(公告)号：US20050198401A1

    公开(公告)日：2005-09-08

    申请号：US10767593

    申请日：2004-01-29

    申请人： Edward Chron ,  Paul Morgan ,  Lance Russell

    发明人： Edward Chron ,  Paul Morgan ,  Lance Russell

    IPC分类号： G06F15/16

    CPC分类号： H04L12/413

    摘要： A method and structure for communicating in a communications network comprising at least one communication virtualizer; a plurality of network-attached store computers connected to the communication virtualizer, wherein the plurality of network-attached store computers are configured to appear as a single available network-attached store computer; and at least one client computer connected to the communication virtualizer.

    摘要翻译： 一种用于在包括至少一个通信虚拟器的通信网络中进行通信的方法和结构; 连接到通信虚拟器的多个连接网络的存储计算机，其中所述多个网络连接的存储计算机被配置为显示为单个可用的网络连接的存储计算机; 以及连接到通信虚拟器的至少一个客户端计算机。

    Nano-crystal etch process
    5.
    发明授权
    Nano-crystal etch process 有权
    纳米晶体蚀刻工艺

    公开(公告)号：US08809198B2

    公开(公告)日：2014-08-19

    申请号：US12650029

    申请日：2009-12-30

    申请人： Ramakanth Alapati ,  Paul Morgan ,  Max Hineman

    发明人： Ramakanth Alapati ,  Paul Morgan ,  Max Hineman

    IPC分类号： H01L21/302

    CPC分类号： H01L21/32134 ,  B82Y10/00 ,  H01L21/28273

    摘要： A method for selectively removing nano-crystals on an insulating layer. The method includes providing an insulating layer with nano-crystals thereon; exposing the nano-crystals to a high density plasma comprising a source of free radical chlorine, ionic chlorine, or both to modify the nano-crystals; and removing the modified nano-crystals with a wet etchant.

    摘要翻译： 一种用于在绝缘层上选择性去除纳米晶体的方法。 该方法包括在其上提供具有纳米晶体的绝缘层; 将纳米晶体暴露于包含游离基氯源，离子氯或二者的高密度等离子体，以修饰纳米晶体; 并用湿蚀刻剂去除修饰的纳米晶体。

    Method of Selectively Removing Conductive Material
    8.
    发明申请
    Method of Selectively Removing Conductive Material 有权
    选择性去除导电材料的方法

    公开(公告)号：US20110203940A1

    公开(公告)日：2011-08-25

    申请号：US13098572

    申请日：2011-05-02

    申请人： Rita J. Klein ,  Dale W. Collins ,  Paul Morgan ,  Joseph N. Greeley ,  Nishant Sinha

    发明人： Rita J. Klein ,  Dale W. Collins ,  Paul Morgan ,  Joseph N. Greeley ,  Nishant Sinha

    IPC分类号： C25F3/02 ,  C25B9/00

    CPC分类号： H01L21/67086 ,  B82Y30/00 ,  C23F1/02 ,  C23F1/10 ,  H01B1/122 ,  H01L21/32115 ,  H01L21/67075

    摘要： An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.

    摘要翻译： 提供了一种用于从衬底选择性地去除导电金属的电解质溶液，方法和系统。 将包含比被除去的导电金属更贵的纳米颗粒的电解质溶液施加到基板上以相对于电介质材料选择性地去除导电金属，而不施加外部电位或处理垫与基板表面的接触 。 解决方案和方法可以应用于例如相对于电介质材料选择性地去除导电金属层（例如阻挡金属），并且可以应用于物理上不同的导电金属（例如，铜互连），而不施加外部电位或接触 具有衬底表面的处理衬垫。

    Method of selectively removing conductive material
    9.
    发明申请
    Method of selectively removing conductive material 有权
    选择性去除导电材料的方法

    公开(公告)号：US20080041725A1

    公开(公告)日：2008-02-21

    申请号：US11507291

    申请日：2006-08-21

    申请人： Rita J. Klein ,  Dale W. Collins ,  Paul Morgan ,  Joseph N. Greeley ,  Nishant Sinha

    发明人： Rita J. Klein ,  Dale W. Collins ,  Paul Morgan ,  Joseph N. Greeley ,  Nishant Sinha

    IPC分类号： B01D35/06

    CPC分类号： H01L21/67086 ,  B82Y30/00 ,  C23F1/02 ,  C23F1/10 ,  H01B1/122 ,  H01L21/32115 ,  H01L21/67075

    摘要： An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.

    摘要翻译： 提供了一种用于从衬底选择性地去除导电金属的电解质溶液，方法和系统。 将包含比被除去的导电金属更贵的纳米颗粒的电解质溶液施加到基板上以相对于电介质材料选择性地去除导电金属，而不施加外部电位或处理垫与基板表面的接触 。 解决方案和方法可以应用于例如相对于电介质材料选择性地去除导电金属层（例如阻挡金属），并且可以应用于物理上不同的导电金属（例如，铜互连），而不施加外部电位或接触 具有衬底表面的处理衬垫。