Method and apparatus to calibrate thermometer
    1.
    发明授权
    Method and apparatus to calibrate thermometer 有权
    校准温度计的方法和装置

    公开(公告)号:US07181357B1

    公开(公告)日:2007-02-20

    申请号:US11220913

    申请日:2005-09-08

    IPC分类号: G01K15/00 G01K1/00 G01K3/00

    CPC分类号: G01K15/00

    摘要: Briefly, a processor and a method to calibrate a temperature reading of a digital thermometer. The calibration is done by using a first temperature value measured by an analog temperature sensor located at one point on the processor die and a second temperature value measured by a digital temperature sensor located at a second point of the processor die.

    摘要翻译: 简而言之,一种用于校准数字温度计的温度读数的处理器和方法。 校准通过使用由位于处理器管芯上的一个点处的模拟温度传感器测量的第一温度值和由位于处理器管芯的第二点处的数字温度传感器测量的第二温度值来完成。

    METHOD AND APPARATUS TO CALIBRATE THERMOMETER
    2.
    发明申请
    METHOD AND APPARATUS TO CALIBRATE THERMOMETER 有权
    校准温度计的方法和装置

    公开(公告)号:US20070055469A1

    公开(公告)日:2007-03-08

    申请号:US11220913

    申请日:2005-09-08

    IPC分类号: G01K15/00

    CPC分类号: G01K15/00

    摘要: Briefly, a processor and a method to calibrate a temperature reading of a digital thermometer. The calibration is done by using a first temperature value measured by an analog temperature sensor located at one point on the processor die and a second temperature value measured by a digital temperature sensor located at a second point of the processor die.

    摘要翻译: 简而言之,一种用于校准数字温度计的温度读数的处理器和方法。 校准通过使用由位于处理器管芯上的一个点处的模拟温度传感器测量的第一温度值和由位于处理器管芯的第二点处的数字温度传感器测量的第二温度值来完成。

    Method and apparatus for monitoring power in integrated circuits
    3.
    发明申请
    Method and apparatus for monitoring power in integrated circuits 审中-公开
    集成电路监控功率的方法和装置

    公开(公告)号:US20070005152A1

    公开(公告)日:2007-01-04

    申请号:US11173993

    申请日:2005-06-30

    IPC分类号: G05B11/01 G06F1/00

    CPC分类号: G06F1/28

    摘要: A method includes measuring a temperature of a device, determining a voltage applied to the device, determining a leakage power for the device in real time based on the measured temperature and determined voltage and estimating an active power for the device. The method also includes adding the determined leakage power and the estimated active power to estimate a total power value associated with the device, and controlling the device based on the total power value.

    摘要翻译: 一种方法包括测量设​​备的温度,确定施加到设备的电压,基于测量的温度和确定的电压实时确定设备的泄漏功率并估计设备的有功功率。 该方法还包括将确定的泄漏功率和估计的有功功率相加以估计与该设备相关联的总功率值,以及基于总功率值来控制该设备。

    Device and method for on-die temperature measurement
    5.
    发明授权
    Device and method for on-die temperature measurement 有权
    用于管芯温度测量的装置和方法

    公开(公告)号:US07878016B2

    公开(公告)日:2011-02-01

    申请号:US11025140

    申请日:2004-12-30

    IPC分类号: F25D23/12 G01K1/08 G06F1/00

    摘要: A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.

    摘要翻译: 一种用于使用位于处理器核心的热点中的传感器来测量和管理半导体管芯上的处理器核心的热操作的系统。 测量的温度读数是根据传感器感测到的温度来确定的。 中断信号和指示温度信息的软件可读寄存器提供关于处理器的热环境的反馈。 基于测量的温度读数,中断信号指示处理器修改操作。

    Device and method for on-die temperature measurement
    6.
    发明申请
    Device and method for on-die temperature measurement 有权
    用于管芯温度测量的装置和方法

    公开(公告)号:US20060149974A1

    公开(公告)日:2006-07-06

    申请号:US11025140

    申请日:2004-12-30

    IPC分类号: G06F1/26

    摘要: A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.

    摘要翻译: 一种用于使用位于处理器核心的热点中的传感器来测量和管理半导体管芯上的处理器核心的热操作的系统。 测量的温度读数是根据传感器感测到的温度来确定的。 中断信号和指示温度信息的软件可读寄存器提供关于处理器的热环境的反馈。 基于测量的温度读数,中断信号指示处理器修改操作。

    METHOD AND APPARATUS FOR ON-DIE TEMPERATURE SENSING AND CONTROL
    7.
    发明申请
    METHOD AND APPARATUS FOR ON-DIE TEMPERATURE SENSING AND CONTROL 审中-公开
    用于温度传感和控制的方法和装置

    公开(公告)号:US20100205464A1

    公开(公告)日:2010-08-12

    申请号:US12651435

    申请日:2009-12-31

    IPC分类号: G06F1/00

    摘要: For one disclosed embodiment, a plurality of processor cores may be on a semiconductor die. The processor cores may have at least one corresponding temperature sensor. Circuitry on the semiconductor die may generate thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. A thermal event indication may indicate that a sensed temperature exceeds a temperature point. Central management logic on the semiconductor die may receive thermal event indications based on sensed temperatures from multiple temperature sensors of multiple processor cores. The central management logic may modify operation of one or more of the processor cores in response to a thermal event indication. Other embodiments are also disclosed.

    摘要翻译: 对于一个公开的实施例,多个处理器核可以在半导体管芯上。 处理器核可以具有至少一个对应的温度传感器。 基于多个处理器核心的多个温度传感器的感测温度,半导体管芯上的电路可产生热事件指示。 热事件指示可以指示感测的温度超过温度点。 基于多个处理器核心的多个温度传感器的感测温度,半导体管芯上的中央管理逻辑可以接收热事件指示。 中央管理逻辑可以响应于热事件指示来修改一个或多个处理器核的操作。 还公开了其他实施例。

    METHOD AND APPARATUS OF POWER MANAGMENT OF PROCESSOR
    8.
    发明申请
    METHOD AND APPARATUS OF POWER MANAGMENT OF PROCESSOR 有权
    处理器功率管理方法与装置

    公开(公告)号:US20140040643A1

    公开(公告)日:2014-02-06

    申请号:US13893846

    申请日:2013-05-14

    IPC分类号: G06F1/32

    摘要: A processing platform and a method of controlling power consumption of a central processing unit of the processing platform are presented. By operating the method the processing platform is able to set an upper performance state limit and a lower performance state limit. The upper performance state limit is based on a central processing unit activity rate value and the lower performance state limit is based on a minimum require of the operating system to perform operating system tasks. The performance state values are varying within a range of the lower and upper limits according to a power management policy.

    摘要翻译: 提出了处理平台和处理平台中央处理单元功耗控制方法。 通过操作该方法,处理平台能够设置较高的性能状态限制和较低的性能状态限制。 较高的性能状态限制基于中央处理单元活动速率值,较低的性能状态限制基于操作系统执行操作系统任务的最低要求。 性能状态值根据电源管理策略在下限和上限的范围内变化。

    Method and apparatus of power management of processor
    9.
    发明授权
    Method and apparatus of power management of processor 有权
    处理器电源管理方法及装置

    公开(公告)号:US08458498B2

    公开(公告)日:2013-06-04

    申请号:US12342919

    申请日:2008-12-23

    IPC分类号: G06F1/26 G06F1/32

    摘要: A processing platform and a method of controlling power consumption of a central processing unit of the processing platform are presented. By operating the method the processing platform is able to set an upper performance state limit and a lower performance state limit. The upper performance state limit is based on a central processing unit activity rate value and the lower performance state limit is based on a minimum require of the operating system to perform operating system tasks. The performance state values are varying within a range of the lower and upper limits according to a power management policy.

    摘要翻译: 提出了处理平台和处理平台中央处理单元功耗控制方法。 通过操作该方法,处理平台能够设置较高的性能状态限制和较低的性能状态限制。 较高的性能状态限制基于中央处理单元活动速率值,较低的性能状态限制基于操作系统执行操作系统任务的最低要求。 性能状态值根据电源管理策略在下限和上限的范围内变化。