公开(公告)号：US09075032B2

公开(公告)日：2015-07-07

申请号：US13638483

申请日：2011-03-28

Applicant: Eiji Takai ,  Noriaki Furusato

Inventor： Eiji Takai ,  Noriaki Furusato

IPC: G06F7/00 ,  G01N35/02 ,  G01N35/00 ,  B65G43/00 ,  G01N35/04

CPC classification number: G01N35/02 ,  B65G43/00 ,  G01N35/0092 ,  G01N35/026 ,  G01N2035/00752 ,  G01N2035/0406 ,  G01N2035/0415 ,  G01N2035/0491

Abstract: A transport apparatus for transporting a sample as an analysis objective in a state of being accommodated in a sample container comprises a judging unit which judges whether or not the sample container is positioned at each of first and second collection positions for collecting the sample from the sample container in order to perform each of first and second analysis processes and which outputs each of judgment results thereof as first and second collection position data; and a sample container identification unit which performs individual identification of the sample container in a transport route for the sample container and which outputs an identification result thereof as individual identification data. Further, it is confirmed whether or not the transport of the sample container to the second collection position is adequate on the basis of the first collection position data, the second collection position data, the individual identification data, and data to indicate a predetermined transport amount calculated in accordance with the first and second collection positions.

Abstract translation: 用于在被容纳在样本容器中的状态下运送作为分析对象的样本的运送装置包括：判断单元，判断样本容器是否位于用于从样本收集样本的第一和第二收集位置 容器，以执行第一和第二分析处理中的每一个，并将每个判断结果作为第一和第二收集位置数据输出; 以及样本容器识别单元，其在样本容器的传送路径中执行样本容器的个体识别，并将其识别结果作为个体识别数据输出。 此外，基于第一收集位置数据，第二收集位置数据，个体识别数据和指示预定输送量的数据，确认样品容器到第二收集位置的输送是否足够 根据第一和第二收集位置计算。

公开(公告)号：US20130131859A1

公开(公告)日：2013-05-23

申请号：US13638483

申请日：2011-03-28

Applicant: Eiji Takai ,  Noriaki Furusato

Inventor： Eiji Takai ,  Noriaki Furusato

IPC: G01N35/02 ,  B65G43/00

CPC classification number: G01N35/02 ,  B65G43/00 ,  G01N35/0092 ,  G01N35/026 ,  G01N2035/00752 ,  G01N2035/0406 ,  G01N2035/0415 ,  G01N2035/0491

Abstract: A transport apparatus for transporting a sample as an analysis objective in a state of being accommodated in a sample container comprises a judging unit which judges whether or not the sample container is positioned at each of first and second collection positions for collecting the sample from the sample container in order to perform each of first and second analysis processes and which outputs each of judgment results thereof as first and second collection position data; and a sample container identification unit which performs individual identification of the sample container in a transport route for the sample container and which outputs an identification result thereof as individual identification data. Further, it is confirmed whether or not the transport of the sample container to the second collection position is adequate on the basis of the first collection position data, the second collection position data, the individual identification data, and data to indicate a predetermined transport amount calculated in accordance with the first and second collection positions.

Abstract translation: 用于在被容纳在样本容器中的状态下运送作为分析对象的样本的运送装置包括：判断单元，判断样本容器是否位于用于从样本收集样本的第一和第二收集位置 容器，以执行第一和第二分析处理中的每一个，并将每个判断结果作为第一和第二收集位置数据输出; 以及样本容器识别单元，其在样本容器的传送路径中执行样本容器的个体识别，并将其识别结果作为个体识别数据输出。 此外，基于第一收集位置数据，第二收集位置数据，个体识别数据和指示预定输送量的数据，确认样品容器到第二收集位置的输送是否足够 根据第一和第二收集位置计算。

公开(公告)号：US20070079727A1

公开(公告)日：2007-04-12

申请号：US11634071

申请日：2006-12-06

Applicant: Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

Inventor： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC: C23C18/40 ,  B05D1/40

CPC classification number: C23C18/1803 ,  C23C18/1653 ,  C23C18/40

Abstract: This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract translation: 本发明提供一种使用乙醛酸作为还原剂的化学镀铜溶液，其在坎尼扎罗反应的反应量较小时，不会通过电镀反应和坎尼扎罗反应在很大程度上导致积存在化学镀铜溶液中的盐沉淀， 并可长期稳定使用。 所述无电镀铜溶液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中所述铜离子还原剂是乙醛酸或其盐，所述pH调节剂是氢氧化钾 所述化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US06900394B1

公开(公告)日：2005-05-31

申请号：US09678800

申请日：2000-10-04

Applicant: Takeyuki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

Inventor： Takeyuki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

IPC: H05K3/46 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  H01R12/04 ,  H05K1/11

CPC classification number: C23C18/1617 ,  C23C18/40 ,  H05K3/187

Abstract: A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

Abstract translation: 提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

公开(公告)号：US07169216B2

公开(公告)日：2007-01-30

申请号：US10898282

申请日：2004-07-26

Applicant: Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

Inventor： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC: C23C18/40

CPC classification number: C23C18/1803 ,  C23C18/1653 ,  C23C18/40

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract translation: 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US20050252684A1

公开(公告)日：2005-11-17

申请号：US11113011

申请日：2005-04-25

Applicant: Takeyiki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

Inventor： Takeyiki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

IPC: H05K3/46 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  H05K1/11 ,  B05D3/04 ,  B05D3/10 ,  H01R12/04

CPC classification number: C23C18/1617 ,  C23C18/40 ,  H05K3/187

Abstract: A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

Abstract translation: 提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

公开(公告)号：US06831009B2

公开(公告)日：2004-12-14

申请号：US09962249

申请日：2001-09-26

Applicant: Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

Inventor： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC: H01L214763

CPC classification number: C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

Abstract: A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of a electroless copper plating solution with chosen additive agents or “admixtures” containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline.

Abstract translation: 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用具有选择的添加剂的无电镀铜溶液或含有扁桃腈和三乙基四胺加上色素黑T中的至少一种的“混合物”以及2,2'-联吡啶，1,10-菲咯啉， 和2,9-二甲基-1,10-菲咯啉。

公开(公告)号：US20050042366A1

公开(公告)日：2005-02-24

申请号：US10959073

申请日：2004-10-07

Applicant: Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

Inventor： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC: H05K1/02 ,  C23C18/38 ,  C23C18/40 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  B05D1/18

CPC classification number: C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

Abstract: A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

Abstract translation: 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US06989329B2

公开(公告)日：2006-01-24

申请号：US10959073

申请日：2004-10-07

Applicant: Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

Inventor： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC: H01L21/44

CPC classification number: C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

Abstract: A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

Abstract translation: 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US20050079280A1

公开(公告)日：2005-04-14

申请号：US10898282

申请日：2004-07-26

Applicant: Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

Inventor： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC: C23C18/40 ,  C23C28/02 ,  C25D7/00 ,  H05K3/18 ,  C23C16/00

CPC classification number: C23C18/1803 ,  C23C18/1653 ,  C23C18/40

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract translation: 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。