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1.发明授权公开(公告)号：US11434367B2
公开(公告)日：2022-09-06
申请号：US17070538
申请日：2020-10-14
发明人： Yan Zhang
摘要： A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.
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公开(公告)号：US10954322B2
公开(公告)日：2021-03-23
申请号：US16228099
申请日：2018-12-20
发明人： Rongtao Wang , Yan Zhang , Bingbing Li
IPC分类号： C08F12/34 , C08K5/3492 , C08L55/00 , C08K5/14 , C08K5/37 , C08K5/38 , C08K5/01 , C08K5/06 , C08K5/08 , C08K5/13 , C08K5/18 , C08K5/46 , C08F16/32 , C08L71/12 , C08L63/00 , C08L67/00 , C08L33/08 , C08L79/08
摘要： A prepolymer, which is prepared by subjecting an unsaturated bond-containing compound and a bis(vinylphenyl) compound monomer or a polymer thereof to a prepolymerization reaction, is provided. The bis(vinylphenyl) compound contains between 80% and 99% of para-para vinyl groups and has a monomer content of between 80% and 100%. Moreover, a resin composition comprising the prepolymer and an additive, a method of preparing the prepolymer, and an article made from the resin composition are also provided.
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公开(公告)号：US10093774B2
公开(公告)日：2018-10-09
申请号：US15234478
申请日：2016-08-11
发明人： Chen Yu Hsieh , Yan Zhang
IPC分类号： C08G65/48 , C08J5/24 , C08K5/53 , C08L71/12 , C09D171/12 , H05K1/03 , C08K5/5313 , C08J5/10
摘要： Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties. RY-PPE-Z]c (I)
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公开(公告)号：US12037490B2
公开(公告)日：2024-07-16
申请号：US17526191
申请日：2021-11-15
发明人： Rongtao Wang , Chenyu Shen , Yan Zhang , Xing He
IPC分类号： C08L71/00 , C08J5/24 , C08L25/02 , C09J7/30 , C09J125/02 , C09J171/00
CPC分类号： C08L71/00 , C08J5/244 , C08L25/02 , C09J7/30 , C09J125/02 , C09J171/00 , C08J2309/06 , C08J2325/02 , C08J2371/12 , C08J2425/02 , C08J2471/12 , C08L2205/035 , C09J2400/14 , C09J2400/163 , C09J2409/00 , C09J2423/00 , C09J2471/00
摘要： A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
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公开(公告)号：US11180653B2
公开(公告)日：2021-11-23
申请号：US16852126
申请日：2020-04-17
发明人： Yan Zhang , Jue Tan , Rongtao Wang , Shu-Hao Chang
摘要： A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.
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公开(公告)号：US11174386B2
公开(公告)日：2021-11-16
申请号：US16716909
申请日：2019-12-17
发明人： Chenyu Shen , Yan Zhang , Jue Tan , Rongtao Wang , Chen-Yu Hsieh
摘要： A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.
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公开(公告)号：US10889672B2
公开(公告)日：2021-01-12
申请号：US16211818
申请日：2018-12-06
发明人： Yan Zhang , Rongtao Wang , Mingsheng Yuan , Jue Tan
IPC分类号： C08L71/12 , C08G65/42 , C08L25/16 , C08F212/12 , C08F261/06 , C08G65/48 , C08F2/38 , C08K5/13 , C08K5/37 , C08K5/14 , C08F220/18 , C08F22/40 , C08F12/36
摘要： A prepolymerized resin and a method of preparing the prepolymerized resin are provided, the method comprising a step of prepolymerizing t-butyl styrene and unsaturated bond-containing polyphenylene oxide. The unsaturated bond-containing polyphenylene oxide comprises: methacrylate-terminated polyphenylene oxide, vinylbenzyl-terminated polyphenylene oxide, vinylbenzyl-modified bisphenol A polyphenylene oxide resin, vinyl-containing chain-extended polyphenylene oxide resin or a combination thereof. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.
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公开(公告)号：US10676493B2
公开(公告)日：2020-06-09
申请号：US16158082
申请日：2018-10-11
发明人： Yan Zhang , Rongtao Wang , Mingsheng Yuan , Ningning Jia
IPC分类号： C07F9/6571 , C09K21/12 , C08K5/5313 , C08J5/24 , C08L71/12
摘要： A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.
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公开(公告)号：US11634518B2
公开(公告)日：2023-04-25
申请号：US17526135
申请日：2021-11-15
发明人： Rongtao Wang , Chenyu Shen , Yan Zhang , Xing He
摘要： A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
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10.发明授权公开(公告)号：US11787935B2
公开(公告)日：2023-10-17
申请号：US17557893
申请日：2021-12-21
发明人： Yan Zhang , Rongtao Wang , Ningning Jia
摘要： A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
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