III-N ON SILICON USING NANO STRUCTURED INTERFACE LAYER
    1.
    发明申请
    III-N ON SILICON USING NANO STRUCTURED INTERFACE LAYER 审中-公开
    III-N在使用纳米结构界面层的硅上

    公开(公告)号:US20130214282A1

    公开(公告)日:2013-08-22

    申请号:US13399334

    申请日:2012-02-17

    IPC分类号: H01L29/20 H01L21/20

    摘要: A method of fabricating a layer of single crystal semiconductor material on a silicon substrate including providing a crystalline silicon substrate and epitaxially depositing a nano structured interface layer on the substrate. The nano structured interface layer has a thickness up to a critical thickness. The method further includes epitaxially depositing a layer of single crystal semiconductor material in overlying relationship to the nano structured interface layer. Preferably, the method includes the nano structured interface layer being a layer of coherently strained nano dots of selected material. The critical thickness of the nano dots includes a thickness up to a thickness at which the nano dots become incoherent.

    摘要翻译: 一种在硅衬底上制造单晶半导体材料层的方法,包括提供晶体硅衬底并在衬底上外延沉积纳米结构化界面层。 纳米结构界面层具有至多临界厚度的厚度。 该方法还包括以与纳米结构界面层重叠的关系外延沉积单晶半导体材料层。 优选地,该方法包括纳米结构界面层,其是选定材料的相干应变纳米点层。 纳米点的临界厚度包括达到纳米点变得不相干的厚度的厚度。

    Rare earth oxy-nitride buffered III-N on silicon
    7.
    发明授权
    Rare earth oxy-nitride buffered III-N on silicon 有权
    稀土氧氮化物缓冲III-N在硅上

    公开(公告)号:US09105471B2

    公开(公告)日:2015-08-11

    申请号:US13196919

    申请日:2011-08-03

    IPC分类号: H01L21/02 H01L29/20

    摘要: Rare earth oxy-nitride buffered III-N on silicon includes a silicon substrate with a rare earth oxide (REO) structure, including several REO layers, is deposited on the silicon substrate. A layer of single crystal rare earth oxy-nitride is deposited on the REO structure. The REO structure is stress engineered to approximately crystal lattice match the layer of rare earth oxy-nitride so as to provide a predetermined amount of stress in the layer of rare earth oxy-nitride. A III oxy-nitride structure, including several layers of single crystal rare earth oxy-nitride, is deposited on the layer of rare earth oxy-nitride. A layer of single crystal III-N nitride is deposited on the III oxy-nitride structure. The III oxy-nitride structure is chemically engineered to approximately crystal lattice match the layer of III-N nitride and to transfer the predetermined amount of stress in the layer of rare earth oxy-nitride to the layer of III-N nitride.

    摘要翻译: 硅上的稀土氧氮化物缓冲III-N包括具有稀土氧化物(REO)结构的硅衬底,其包括几个REO层,沉积在硅衬底上。 一层单晶稀土氧氮化物沉积在REO结构上。 REO结构被应力工程化为大致晶格匹配稀土氮氧化物层,以便在稀土氮​​氧化物层中提供预定量的应力。 包含数层单晶稀土氧氮化物的III族氮氧化物结构沉积在稀土氮氧化物层上。 在III氧氮化物结构上沉积单层III-N氮化物层。 III族氮氧化物结构被化学工程化为与III-N族氮化物层大致晶格匹配并将预定量的稀土氮氧化物层中的应力传递到III-N族氮化物层。

    RARE EARTH OXY-NITRIDE BUFFERED III-N ON SILICON
    10.
    发明申请
    RARE EARTH OXY-NITRIDE BUFFERED III-N ON SILICON 有权
    稀土氧化氮缓冲III-N在硅上

    公开(公告)号:US20130032858A1

    公开(公告)日:2013-02-07

    申请号:US13196919

    申请日:2011-08-03

    IPC分类号: H01L29/12 H01L21/20

    摘要: Rare earth oxy-nitride buffered III-N on silicon includes a silicon substrate with a rare earth oxide (REO) structure, including several REO layers, is deposited on the silicon substrate. A layer of single crystal rare earth oxy-nitride is deposited on the REO structure. The REO structure is stress engineered to approximately crystal lattice match the layer of rare earth oxy-nitride so as to provide a predetermined amount of stress in the layer of rare earth oxy-nitride. A III oxy-nitride structure, including several layers of single crystal rare earth oxy-nitride, is deposited on the layer of rare earth oxy-nitride. A layer of single crystal III-N nitride is deposited on the III oxy-nitride structure. The III oxy-nitride structure is chemically engineered to approximately crystal lattice match the layer of III-N nitride and to transfer the predetermined amount of stress in the layer of rare earth oxy-nitride to the layer of III-N nitride.

    摘要翻译: 硅上的稀土氧氮化物缓冲III-N包括具有稀土氧化物(REO)结构的硅衬底,其包括几个REO层,沉积在硅衬底上。 一层单晶稀土氧氮化物沉积在REO结构上。 REO结构被应力工程化为大致晶格匹配稀土氮氧化物层,以便在稀土氮​​氧化物层中提供预定量的应力。 包含数层单晶稀土氧氮化物的III族氮氧化物结构沉积在稀土氮氧化物层上。 在III氧氮化物结构上沉积单层III-N氮化物层。 III族氮氧化物结构被化学工程化为与III-N族氮化物层大致晶格匹配并将预定量的稀土氮氧化物层中的应力传递到III-N族氮化物层。