摘要:
An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.
摘要:
A substrate processing apparatus that is arranged adjacent to an exposure device includes a processing section including a first processing unit and a second processing unit. The first processing unit includes a development region, a first cleaning region, and a first transport region. The development region and the first cleaning region are arranged opposite to each other with the first transport region interposed therebetween. The second processing unit includes a reversing region, a second cleaning region, and a second transport region. The reversing region and the second cleaning region are arranged opposite to each other with the second transport region interposed therebetween. The second processing unit is arranged between the first processing unit and the exposure device. The substrate processing apparatus also includes a transfer section coupled to the processing section and an interface configured to receive and transfer the substrate between the processing section and the exposure device.
摘要:
A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.
摘要:
An improved swing type substrate cleaning apparatus comprises a substrate chuck for holding the substrate while rotating the same, a cleaning brush holding apparatus for holding a cleaning brush while rotating the same, a cleaning brush elevating apparatus for holding the cleaning brush holding apparatus in a manner enabling elevation and swing of the same, and a buffer apparatus for reducing the velocity at which the cleaning brush elevating apparatus lowers the cleaning brush holding apparatus when the cleaning brush is lowered to be in contact with the substrate. Since the velocity with which the cleaning brush is lowered is reduced to be lower than a prescribed value by means of the buffer apparatus, no significant shock is created when the cleaning brush is brought into contact with the substrate.
摘要:
This invention is concerned with a method and apparatus for the development of photographic films in a photographic film processor in which the films are developed when the exposed films pass through a developing tank containing developer. The object of said invention is to attain uniform development with a simple method, that is, to make the change of the activity of the developer during the development of the films to be treated very small from the leading end to the trailing end of the film. The said invention makes the influence of the momentarily changing activity of the developer in contact with the films as small as possible by compensating for the decrease of the activity due to the exhaustion of the developer by gradually increasing the immersion time of the films in the developer from the leading end toward the trailing end of the photographic films by gradually changing the relative level of the liquid surface when the films are fed into the developer.
摘要:
A temperature control door (27) controls air flow through a duct (12) and is positioned in accordance with the output of a sensor (41), (42). A slider (74) of a potentiometer (72) is connected to the door (27) so that the slider (74) is in a central position when the temperature control door (27) is in a central position. A switch (86) connects the slider (74) to one end of a resistance element (73) of the potentiometer (72) when the temperature control door (27) is on one side of the central position and the apparatus (11) is in a cooling mode and to the other end of the resistance element (73) of the potentiometer (72) when the temperature control door (27) is on the other side of the central position and the apparatus (11) is in a heating mode. The speed of a blower (16) which forces air through the duct (12) is controlled in accordance with the resistance of the potentiometer (72). A switch (87) controls the blower (16) to run a maximum speed when the apparatus (11) is in a maximum cooling mode.
摘要:
In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.
摘要:
A moving image representing a maintenance method is reflected on a moving image display section in an operation panel. A worker can grasp the maintenance method by seeing the moving image displayed on the moving image display section. Consequently, maintenance can be performed in a short time and accurately in accordance with the moving image displayed on the moving image display section.
摘要:
An inspection unit is provided in a substrate processing apparatus performing resist coating processing and development processing on a substrate. In the inspection unit, a film thickness measuring device, a line width measuring device, an overlay measuring device and a macro defect inspection device are successively stacked and arranged from below. The inspection unit is provided on an intermediate portion of a substrate transport path formed in the substrate processing apparatus. The substrate processed in the substrate processing apparatus is selectively introduced into each inspection part. Therefore, the apparatus can properly inspect the substrate at need while suppressing reduction of the throughput. Thus provided are a substrate processing apparatus and a substrate inspection method capable of properly inspecting a substrate while suppressing reduction of the throughput.
摘要:
An atmospheric conditioning unit for supplying temperature- and humidity-controlled air to a chemical processing part (spin coater) is arranged immediately above a chemical processing part, between this chemical processing part and a heat treatment part (including a hot plate and a cool plate). Namely, the chemical processing part, the atmospheric conditioning unit and the heat treatment part are vertically arranged in a stacked manner. The atmospheric conditioning unit receives external air from an opening. A closed partition is provided to block air flow between the atmospheric conditioning unit and a transport area. The temperature- and humidity-controlled air supplied from the atmospheric conditioning unit to the spin coater forms a downflow in the spin coater, and thereafter rises through an opening and joins with the air flowing from the opening, to be introduced into the atmospheric conditioning unit again and reused.