摘要:
A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
摘要:
A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.
摘要:
A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要:
A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要:
Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.
摘要:
An apparatus provides feedback regarding the material in which tip of the apparatus is located as the tip is advance into matter of varying resistances. The apparatus responds to a change in pressure, force, or other parameter such that when the tip reaches matter of a certain resistance, a change in the parameter is sensed. The apparatus provides a driving force to a penetrating medical device, such as a needle, when the apparatus tip encounters material of high resistance. When the apparatus tip encounters a low resistance material, no further driving force is applied to the apparatus. An inner core may be advanced into the low resistance material for deployment of a gas or a liquid as desired.
摘要:
An apparatus provides feedback regarding the material in which tip of the apparatus is located as the tip is advance into matter of varying resistances. The apparatus responds to a change in pressure, force, or other parameter such that when the tip reaches matter of a certain resistance, a change in the parameter is sensed. The apparatus provides a driving force to a penetrating medical device, such as a needle, when the apparatus tip encounters material of high resistance. When the apparatus tip encounters a low resistance material, no further driving force is applied to the apparatus. An inner core may be advanced into the low resistance material for deployment of a gas or a liquid as desired.
摘要:
An instrument port for introducing instruments into a surgical site, including a port body having a channel running therethrough from a proximal end to a distal end, an instrument sleeve in slidable contact with the channel, creating a gap therebetween, and fluid flow for removing emboli efficiently from the instrument port, wherein the fluid flow includes the gap is provided. A fluid flow system for use in an instrument port is provided. A method of removably securing an instrument sleeve to a port body by anchoring the instrument port to heart tissue, making at least one flood line in a channel, flushing out emboli, and performing surgery with the instrument port.
摘要:
The present invention relates to the synthesis and processing of materials, including nanostructures such as carbon nanotubes (CNTs). Methods and devices are presented for controlling the growth and/or assembly of nanostructures, in some cases using small channel-type environments (e.g., microfluidic channels). In these micro-scale environments, forces can be applied to nanostructures during their growth process, for instance, to control the rate and/or direction of growth of the nanostructures. These forces can also be used to direct the assembly of nanostructures into ordered configurations such as strands or other assemblies having micro- and macroscopic length scales. In some embodiments, multiple forces are applied simultaneously to direct the growth and/or assembly of nanostructures.
摘要:
An acoustic suppression arrangement 7 for a component undergoing induced vibration is provided. The arrangement 7 includes a component body 8 having an interior surface 9 and an exterior surface 11 having a panel portion 20. A containment plate 24 is provided having a spaced relationship from the panel portion. A first projector 25 is connected to the component body panel portion 20 and extends toward the containment plate 24. A second projector 30 is connected to the containment plate. A connector system 39, 45 is provided to connect the containment plate 24 to the component body 8 while placing the first and second projectors 25, 30 in an interference fit. Vibratory energy of the component body 8 is dissipated by frictional contact between the projectors 25, 30.