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1.发明授权Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow 有权使用脉冲传热流体流动的等离子体处理装置中的温度控制公开(公告)号：US08916793B2
公开(公告)日：2014-12-23
申请号：US13111334
申请日：2011-05-19
申请人： Fernando M. Silveira , Hamid Tavassoli , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger , Brad L. Mays , Tina Tsong , Chetan Mahadeswaraswamy , Yashaswini B. Pattar , Duy D. Nguyen , Walter R. Merry
发明人： Fernando M. Silveira , Hamid Tavassoli , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger , Brad L. Mays , Tina Tsong , Chetan Mahadeswaraswamy , Yashaswini B. Pattar , Duy D. Nguyen , Walter R. Merry
CPC分类号： H01J37/20 , H01J37/32724 , H01J37/32908 , H01J37/32926 , H01J37/32935 , H01J2237/2001 , H05H1/34
摘要： Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
摘要翻译： 通过脉冲施加加热功率和脉冲施加冷却功率来控制等离子体处理室中的温度的方法和系统。 在一个实施例中，温度控制至少部分地基于从输入到处理室的等离子体功率得到的前馈控制信号。 在另外的实施例中，耦合到温度受控部件的热储存器和冷储存器中的每一个中的流体水平部分地由耦合两个储存器的被动流平管道保持。 在另一个实施例中，数字传热流体流量控制阀以取决于加热/冷却占空比值的脉冲宽度和具有已经被发现提供良好的温度控制性能的持续时间的配比循环打开。
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2.发明申请TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEAT TRANSFER FLUID FLOW 有权使用脉冲热传递流体的等离子体处理装置中的温度控制公开(公告)号：US20120132397A1
公开(公告)日：2012-05-31
申请号：US13111334
申请日：2011-05-19
申请人： Fernando M. Silveira , Hamid Tavassoli , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger , Brad L. Mays , Tina Tsong , Chetan Mahadeswaraswamy , Yashaswini B. Pattar , Duy D. Nguyen , Walter R. Merry
发明人： Fernando M. Silveira , Hamid Tavassoli , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger , Brad L. Mays , Tina Tsong , Chetan Mahadeswaraswamy , Yashaswini B. Pattar , Duy D. Nguyen , Walter R. Merry
IPC分类号： F28D15/00 , C23C16/52 , B05C13/02 , C23C16/458
CPC分类号： H01J37/20 , H01J37/32724 , H01J37/32908 , H01J37/32926 , H01J37/32935 , H01J2237/2001 , H05H1/34
摘要： Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
摘要翻译： 通过脉冲施加加热功率和脉冲施加冷却功率来控制等离子体处理室中的温度的方法和系统。 在一个实施例中，温度控制至少部分地基于从输入到处理室的等离子体功率得到的前馈控制信号。 在另外的实施例中，耦合到温度受控部件的热储存器和冷储存器中的每一个中的流体水平部分地由耦合两个储存器的被动流平管道保持。 在另一个实施例中，数字传热流体流量控制阀以取决于加热/冷却占空比值的脉冲宽度和具有已经被发现提供良好的温度控制性能的持续时间的配比循环打开。
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公开(公告)号：US09338871B2
公开(公告)日：2016-05-10
申请号：US12905624
申请日：2010-10-15
申请人： Chetan Mahadeswaraswamy , Walter R. Merry , Sergio Fukuda Shoji , Chunlei Zhang , Yashaswini B. Pattar , Duy D. Nguyen , Tina Tsong , Shane C. Nevil , Douglas A. Buchberger, Jr. , Fernando M. Silveira , Brad L. Mays , Kartik Ramaswamy , Hamid Noorbakhsh
发明人： Chetan Mahadeswaraswamy , Walter R. Merry , Sergio Fukuda Shoji , Chunlei Zhang , Yashaswini B. Pattar , Duy D. Nguyen , Tina Tsong , Shane C. Nevil , Douglas A. Buchberger, Jr. , Fernando M. Silveira , Brad L. Mays , Kartik Ramaswamy , Hamid Noorbakhsh
IPC分类号： G01L21/30 , G01R31/00 , H01L21/302 , H01L21/461 , H01L21/306 , C23F1/00 , H05H1/00 , H01J37/32
CPC分类号： H01J37/32009 , G05B6/02 , H01J37/3244 , H01J37/32715 , H01J37/32935 , H01J2237/334 , H05H1/0081
摘要： Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.
摘要翻译： 用于控制等离子体处理室中的温度的方法和系统，其具有减少的控制器响应时间和增加的稳定性。 温度控制至少部分地基于从输入到处理室的等离子体功率得到的前馈控制信号。 补偿由于等离子体功率引起的温度的干扰的前馈控制信号可以与测量温度和期望温度之间的反馈控制信号抵消误差相组合。
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公开(公告)号：US20170323813A1
公开(公告)日：2017-11-09
申请号：US15217513
申请日：2016-07-22
CPC分类号： H01L21/67248 , C23C16/46 , C23C16/50 , C23C16/505 , C23C16/52 , C23C16/56 , H01J37/32715 , H01J37/32724 , H01J37/3299 , H01L21/67017 , H01L21/67103 , H01L21/67109
摘要： An advanced temperature control system and method are described for a wafer carrier in a plasma processing chamber. In one example a heat exchanger provides a temperature controlled thermal fluid to a fluid channel of a workpiece carrier and receives the thermal fluid from the fluid channel. A proportional valve is between the heat exchanger and the fluid channel to control the rate of flow of thermal fluid from the heat exchanger to the fluid channel. A pneumatic valve is also between the heat exchanger and the fluid channel also to control the rate of flow of thermal fluid from the heat exchanger and the fluid channel. A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve and the pneumatic valve in response to the measured temperature to adjust the rate of flow of the thermal fluid.
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